公开(公告)号：US6067025A

公开(公告)日：2000-05-23

申请号：US984007

申请日：1997-12-03

Applicant: Anthony M. Chiu ,  Alan H. Kramer

Inventor： Anthony M. Chiu ,  Alan H. Kramer

IPC: H01L23/544 ,  H01L23/58 ,  G08B21/00

CPC classification number: H01L22/34 ,  H01L23/58 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/49179 ,  H01L2224/73265 ,  H01L2224/859 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/30107 ,  H01L2924/3011 ,  Y10T29/49037

Abstract: An apparatus and method for controlling the height of packaging above an integrated circuit package (30) comprising, a substrate (12), a silicon chip (16) and a signal wire (20), one or more height detection wires (32) extending above the top surface (26) of the silicon chip (16) and the signal wire (20) and a detector electrically connected to the height detection wire (32), wherein the height detection wire (32) and the detector form an electric circuit that is affected when a polisher of encapsulant (40) is in proximity to the height detection wire (32), is disclosed.

Abstract translation: 一种用于控制集成电路封装（30）上方的封装高度的装置和方法，包括：衬底（12），硅芯片（16）和信号线（20），一个或多个高度检测线（32）延伸 在硅芯片（16）的顶表面（26）和信号线（20）之上，以及电连接到高度检测线（32）的检测器，其中高度检测线（32）和检测器形成电路 公开了当密封剂（40）的抛光机靠近高度检测线（32）时受到影响。

公开(公告)号：US20100297841A1

公开(公告)日：2010-11-25

申请号：US12804870

申请日：2010-07-30

Applicant: Danielle A. Thomas ,  Harry Michael Siegel ,  Antonio A. Do Bento Vieira ,  Anthony M. Chiu

Inventor： Danielle A. Thomas ,  Harry Michael Siegel ,  Antonio A. Do Bento Vieira ,  Anthony M. Chiu

IPC: H01L21/60 ,  H01L21/768

CPC classification number: H01L24/13 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05546 ,  H01L2224/05624 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: A system and method is disclosed for providing a redistribution metal layer in an integrated circuit. The redistribution metal layer is formed from the last metal layer in the integrated circuit during manufacture of the integrated circuit before final passivation is applied. The last metal layer provides sites for solder bump pads used in flip chip interconnection. The redistribution metal layer can be (1) a flat layer deposited over the next to last metal layer through an opening in a dielectric layer, or (2) deposited over an array of vias connected to the next to last metal layer. Space between the solder bump pads is deposited with narrower traces for connecting active circuit areas below. A final passivation layer is deposited to ensure product reliability.

Abstract translation: 公开了用于在集成电路中提供再分配金属层的系统和方法。 在施加最终钝化之前，在集成电路的制造期间，由分布金属层由集成电路中的最后一个金属层形成。 最后一个金属层提供了用于倒装芯片互连的焊料凸块的位置。 再分布金属层可以是（1）通过介电层中的开口沉积在下一个最后金属层上的平坦层，或（2）沉积在连接到最后一个金属层上的通孔阵列上。 焊锡凸块之间的空间沉积有较窄的走线，用于连接下面的有源电路区域。 沉积最后的钝化层以确保产品的可靠性。

公开(公告)号：US07098065B2

公开(公告)日：2006-08-29

申请号：US10952183

申请日：2004-09-28

Applicant: Anthony M. Chiu ,  Harry Michael Siegel

Inventor： Anthony M. Chiu ,  Harry Michael Siegel

IPC: H01L21/00

CPC classification number: B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  B81C2203/0163

Abstract: An integrated lid for microelectromechanical system (MEMS) devices is formed from a nitride layer deposited over a cavity containing movable parts for the device. Pillars are formed through openings within large area movable parts to support the lid over those parts. Slides are formed and moved under large etchant openings through the lid to allow the openings to be sealed by sputtering.

Abstract translation: 用于微机电系统（MEMS）器件的集成盖由沉积在包含用于该器件的可移动部件的空腔的氮化物层上形成。 支柱通过大面积可移动部件内的开口形成，以支撑这些部件上的盖子。 在大的蚀刻剂开口处形成滑动件并通过盖子移动，以允许通过溅射密封开口。

公开(公告)号：US07096581B2

公开(公告)日：2006-08-29

申请号：US10091743

申请日：2002-03-06

Applicant: Danielle A. Thomas ,  Harry Michael Siegel ,  Antonio A. Do Bento Vieira ,  Anthony M. Chiu

Inventor： Danielle A. Thomas ,  Harry Michael Siegel ,  Antonio A. Do Bento Vieira ,  Anthony M. Chiu

IPC: H05K3/30

CPC classification number: H01L24/13 ,  H01L23/3114 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/05546 ,  H01L2224/05624 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: An integrated circuit includes a portion having at least one active circuit area. The integrated circuit also includes a redistribution metal layer fabricated at least partially during fabrication of the portion of the integrated circuit. A method for fabricating an integrated circuit includes fabricating a portion of the integrated circuit, where the portion includes at least one active circuit area. The method also includes fabricating a redistribution metal layer at least partially during fabrication of the portion of the integrated circuit.

Abstract translation: 集成电路包括具有至少一个有源电路区域的部分。 集成电路还包括在集成电路的部分的制造期间至少部分地制造的再分布金属层。 一种用于制造集成电路的方法包括制造集成电路的一部分，其中该部分包括至少一个有源电路区域。 该方法还包括在制造集成电路的该部分期间至少部分地制造再分布金属层。

公开(公告)号：US07068270B1

公开(公告)日：2006-06-27

申请号：US08348703

申请日：1994-12-02

Applicant: Anthony M. Chiu

Inventor： Anthony M. Chiu

IPC: G06T17/00

CPC classification number: G06F17/5081 ,  G06F17/5086

Abstract: A computer is used to model objects by accepting commands from a user. The object is altered in response to the commands. Dimensions are formed between the features, and relations between the dimensions are formed in order to present inconsistence relations which prevent the object from being modeled.

Abstract translation: 计算机用于通过接受来自用户的命令来对对象进行建模。 响应命令更改对象。 在特征之间形成尺寸，并且形成尺寸之间的关系以便呈现防止对象被建模的不一致关系。

公开(公告)号：US06908787B2

公开(公告)日：2005-06-21

申请号：US10611578

申请日：2003-07-01

Applicant: Anthony M. Chiu

Inventor： Anthony M. Chiu

IPC: H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC classification number: H01L24/85 ,  H01L24/03 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02126 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05009 ,  H01L2224/05556 ,  H01L2224/05558 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48453 ,  H01L2224/48463 ,  H01L2224/48472 ,  H01L2224/48624 ,  H01L2224/48647 ,  H01L2224/48724 ,  H01L2224/48747 ,  H01L2224/48824 ,  H01L2224/48847 ,  H01L2224/4943 ,  H01L2224/73265 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85207 ,  H01L2224/85365 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A system and method is disclosed for increasing the strength of a bond made by a small diameter wire in ball bonding. In one embodiment of the invention a structure for receiving a ball bond comprises substrate material that has portions that form a substrate cavity and a wire bond pad that covers and fills the substrate cavity. The wire bond pad also has portions that form a wire bond cavity for receiving the ball bond. The ball is wirebonded to the sides and bottom of the wire bond cavity. The sides of the wire bond cavity provide additional strength to the bond to resist shear and tensile forces that may act on the wire.

公开(公告)号：US06769174B2

公开(公告)日：2004-08-03

申请号：US10205692

申请日：2002-07-26

Applicant: Harry M. Siegel ,  Anthony M. Chiu

Inventor： Harry M. Siegel ,  Anthony M. Chiu

IPC: H05K330

CPC classification number: H01L21/568 ,  H01L21/566 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/85001 ,  H01L2224/85444 ,  H01L2224/8547 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49171 ,  Y10T29/49172 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A method for providing a leadframeless package structure is provided. The method includes providing a temporary carrier. The temporary carrier is coupled to a metal foil layer with a temporary adhesive layer. An integrated circuit chip is coupled to the metal foil layer. The temporary adhesive layer and the temporary carrier are removed to form the leadframeless package structure after molding.

公开(公告)号：US5805419A

公开(公告)日：1998-09-08

申请号：US756460

申请日：1996-11-26

Applicant: Michael J. Hundt ,  Anthony M. Chiu

Inventor： Michael J. Hundt ,  Anthony M. Chiu

IPC: H01R33/76 ,  H01L23/32 ,  H01L23/40 ,  H01R12/00 ,  H05K7/10 ,  H05K7/20

CPC classification number: H05K7/1069 ,  H01L23/4093 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181

Abstract: A socketed integrated circuit packaging system, including a packaged integrated circuit and a socket therefor, is disclosed. The integrated circuit package includes a device circuit board to which a thermally conductive slug is mounted; the underside of the device circuit board has a plurality of lands arranged in an array. The integrated circuit chip is mounted to the slug, through a hole in the device circuit board, and is wire-bonded to the device circuit board and thus to the lands on the underside. The socket is a molded frame, having a hole therethrough to receive the conductive slug of the integrated circuit package; the socket may also have its own thermally conductive slug disposed within the hole of the frame. The socket has spring contact members at locations matching the location of the lands on the device circuit board. The integrated circuit package may be inserted into the socket frame, held there by a metal or molded clip. A low profile, low cost, and high thermal conductivity package and socket combination, is thus produced.

公开(公告)号：US5696029A

公开(公告)日：1997-12-09

申请号：US665062

申请日：1996-05-15

Applicant: Robert Alvarez ,  Anthony M. Chiu ,  Jay Alexander

Inventor： Robert Alvarez ,  Anthony M. Chiu ,  Jay Alexander

IPC: H01L23/50 ,  H01L23/495 ,  H01L21/56 ,  H01L21/60 ,  H01L21/70

CPC classification number: H01L23/49503 ,  H01L23/49541 ,  H01L2924/0002

Abstract: A lead frame design and manufacturing process comprising a lead frame (18) having its internal lead fingers (20) punched out to dimensions optimized to accommodate the body size of a selected die. A die pad (30), also optimized to accommodate the body size of the selected die, is attached to the lead frame with mechanical or chemical bonding. Punches are used to punch out the internal lead pins according to selected dimensions.

Abstract translation: 一种引线框架设计和制造方法，其包括引线框架（18），其引导框架（18）具有冲压出的尺寸以适应所选模具的主体尺寸的尺寸。 还优化以适应所选择的模具的主体尺寸的芯片焊盘（30）通过机械或化学键合附接到引线框架。 冲头用于根据所选尺寸冲出内部引脚。

公开(公告)号：US5555488A

公开(公告)日：1996-09-10

申请号：US6899

申请日：1993-01-21

Applicant: Robert N. McLellan ,  Anthony M. Chiu

Inventor： Robert N. McLellan ,  Anthony M. Chiu

IPC: H01L21/60 ,  H01L23/28 ,  H01L23/495 ,  H05K3/30 ,  H05K7/02 ,  H01L23/544

CPC classification number: H05K3/301 ,  H01L23/49555 ,  H05K3/303 ,  H01L2924/0002 ,  H05K2201/10454 ,  H05K2201/10568 ,  H05K2201/10696 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49121 ,  Y10T29/49139

Abstract: An electronic device (10) includes a package (16) having two posts (30) suitable for insertion in PCB holes. Package (16) presents a lengthwise molding plane (32) along which the upper portion (42) and bottom portion (44) of package (16) are mated during the molding process. Posts (30) are disposed substantially exclusively in bottom portion (44) so that posts (30) are asymmetric about lengthwise molding plane (32). Thus, even if a top mold (42a) and a bottom mold (44a) are misaligned there will be no effect on the dimensional tolerance of posts (30) and thus the tolerance of post (30) can be closely matched with a PCB hole (20) tolerance to insure a snug fit. Thus, device (10) is mounted edgewise on a PCB (18) by insertion of posts (30) into PCB holes (20) so that tips (24) of lead fingers (4 14) can be connected to PCB (18) by surfacing-mounting techniques or the like.

Abstract translation: 电子设备（10）包括具有适于插入PCB孔中的两个柱（30）的封装（16）。 包装件（16）呈现纵向成型平面（32），在模制过程中，包装件（16）的上部分（42）和底部部分（44）沿着该成型平面配合。 柱（30）基本上仅设置在底部（44）中，使得柱（30）在纵向成型平面（32）上是不对称的。 因此，即使顶模（42a）和底模（44a）不对准，也不会影响柱（30）的尺寸公差，因此柱（30）的公差可以与PCB孔 （20）公差，以确保贴合。 因此，装置（10）通过将柱（30）插入PCB孔（20）而沿PCB方式安装在PCB（18）上，使得引线指（4,14）的尖端（24）可以通过 表面贴装技术等。