公开(公告)号：US20170144221A1

公开(公告)日：2017-05-25

申请号：US15316684

申请日：2015-06-12

Applicant: Alpha Metals, Inc.

Inventor： Shamik GHOSHAL ,  V. Sathish KUMAR ,  Pavan VISHWANATH ,  Ranjit S. PANDHER ,  Remya CHANDRAN ,  Sutapa MUKHERJEE ,  Siuli SARKAR ,  Bawa SINGH ,  Ravindra Mohan BHATKAL

IPC: B22F1/00 ,  B23K3/06 ,  H01L21/78 ,  B23K35/30 ,  B22F1/02 ,  H01L23/00 ,  B23K1/00 ,  B23K35/02

CPC classification number: B22F1/0044 ,  B22F1/02 ,  B22F3/1017 ,  B22F3/22 ,  B22F5/006 ,  B22F7/04 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2999/00 ,  B23K1/0016 ,  B23K3/0607 ,  B23K35/0244 ,  B23K35/3006 ,  B23K2101/40 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68313 ,  H01L2221/68368 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/11003 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/11438 ,  H01L2224/1144 ,  H01L2224/11505 ,  H01L2224/11848 ,  H01L2224/13139 ,  H01L2224/13294 ,  H01L2224/13295 ,  H01L2224/13311 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13363 ,  H01L2224/1338 ,  H01L2224/13384 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13393 ,  H01L2224/13411 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13455 ,  H01L2224/13464 ,  H01L2224/13469 ,  H01L2224/1349 ,  H01L2224/16227 ,  H01L2224/27002 ,  H01L2224/27003 ,  H01L2224/27009 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27332 ,  H01L2224/27334 ,  H01L2224/27438 ,  H01L2224/2744 ,  H01L2224/27505 ,  H01L2224/2782 ,  H01L2224/27821 ,  H01L2224/27848 ,  H01L2224/29139 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29363 ,  H01L2224/29364 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/2949 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/75251 ,  H01L2224/75316 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83002 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83222 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0463 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/2064 ,  H05K3/32 ,  H05K2203/1131 ,  B22F1/0018 ,  B22F1/025 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01005 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/206

Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

公开(公告)号：US20170033073A1

公开(公告)日：2017-02-02

申请号：US15302827

申请日：2015-04-10

Applicant: Alpha Metals, Inc.

Inventor： Shamik GHOSHAL ,  Nirmalya Kumar CHAKI ,  Poulami Sengupta ROY ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01L23/00 ,  B23K35/02 ,  B22F1/00 ,  B23K35/36 ,  B23K35/365 ,  B22F1/02 ,  B23K1/00 ,  B23K35/30

CPC classification number: H01L24/29 ,  B22F1/0003 ,  B22F1/0014 ,  B22F1/0074 ,  B22F1/025 ,  B22F7/04 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2302/45 ,  B23K1/0016 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3601 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/365 ,  B23K2101/40 ,  B23K2103/56 ,  H01B1/22 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L51/5246 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/131 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13439 ,  H01L2224/1349 ,  H01L2224/13499 ,  H01L2224/16227 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/27332 ,  H01L2224/27436 ,  H01L2224/27505 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/2949 ,  H01L2224/29499 ,  H01L2224/32145 ,  H01L2224/32146 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/81075 ,  H01L2224/81192 ,  H01L2224/81203 ,  H01L2224/8121 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83075 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/83439 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1461 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/206 ,  H01L2924/2064 ,  H05K3/321 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/0105 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01028 ,  H01L2924/0103 ,  H01L2924/0493 ,  H01L2924/01004 ,  H01L2224/27 ,  H01L2924/01074 ,  H01L2224/81 ,  H01L2224/11436 ,  H01L2224/11 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

Abstract translation: 一种烧结粉末，其特征在于，包括：平均最长尺寸为100nm〜50μm的第一种金属粒子。