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公开(公告)号:US20200335310A1
公开(公告)日:2020-10-22
申请号:US16838987
申请日:2020-04-02
摘要: A gas flow system is provided, including a gas flow source, one or more gas inlets, one or more gas outlets, a gas flow region, a low pressure region, wherein the low pressure region is fluidly coupled to the one or more gas outlets, a high pressure region, and a gap. The one or more gas inlets are fluidly coupleable to the gas flow source. The gas flow region is fluidly coupled to the one or more gas inlets and the one or more gas outlets. The gap fluidly couples the gas flow region to the high pressure region. The high pressure region near the targets allows for process gas interactions with the target to sputter onto the substrate below. The low pressure region near the substrate prevents unwanted chemical interactions between the process gas and the substrate.
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公开(公告)号:US20200013597A1
公开(公告)日:2020-01-09
申请号:US16573265
申请日:2019-09-17
发明人: Anantha K. SUBRAMANI , Hanbing WU , Wei W. WANG , Ashish GOEL , Srinivas GUGGILLA , Lavinia NISTOR
摘要: Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.
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公开(公告)号:US20150114823A1
公开(公告)日:2015-04-30
申请号:US14062627
申请日:2013-10-24
发明人: Joung Joo LEE , Guojun LIU , Wei W. WANG , Prashanth KOTHNUR
CPC分类号: H01J37/3447 , C23C14/042 , C23C14/22 , C23C14/3471 , H01J37/3426
摘要: The present invention provides an apparatus including a bipolar collimator disposed in a physical vapor deposition chamber and methods of using the same. In one embodiment, an apparatus includes a chamber body and a chamber lid disposed on the chamber body defining a processing region therein, a collimator disposed in the processing region, and a power source coupled to the collimator.
摘要翻译: 本发明提供一种装置,包括设置在物理气相沉积室中的双极准直器及其使用方法。 在一个实施例中,一种装置包括室主体和设置在室主体上的室盖,其限定其中的处理区域,设置在处理区域中的准直器和耦合到准直器的电源。
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公开(公告)号:US20140076234A1
公开(公告)日:2014-03-20
申请号:US14057477
申请日:2013-10-18
发明人: Chien-Teh KAO , Jing-Pei Connie CHOU , Chiukin (Steven) LAI , Salvador P. UMOTOY , Joel M. HUSTON , Son TRINH , Mei CHANG , Xiaoxiong YUAN , Yu CHANG , Xinliang LU , Wei W. WANG , See-Eng PHAN
IPC分类号: H01L21/02
CPC分类号: H01L21/02104 , C23C14/022 , C23C14/50 , C23C14/541 , H01J37/32082 , H01J37/32357 , H01J37/3244 , H01J37/32522 , H01J37/32541 , H01J37/32568 , H01J37/32862 , H01J2237/2001 , H01L21/67069 , H01L21/67109 , H01L2924/0002 , H01L2924/00
摘要: A multi-chamber processing system includes a transfer chamber, a first processing chamber outfitted to perform CVD, a second processing chamber, and a robot positioned to transfer substrates between the transfer chamber, the first processing chamber, and the second processing chamber. The second processing chamber may include one or a combination of a first electrode and a second electrode comprising a plasma cavity formed therein.
摘要翻译: 多室处理系统包括传送室,用于执行CVD的第一处理室,第二处理室和位于传送室,第一处理室和第二处理室之间传送基板的机器人。 第二处理室可以包括第一电极和第二电极中的一个或组合,其包括其中形成的等离子体腔。
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公开(公告)号:US20200312683A1
公开(公告)日:2020-10-01
申请号:US16808107
申请日:2020-03-03
发明人: Ilya LAVITSKY , Keith A. MILLER , John J. MAZZOCCO , Wei W. WANG
IPC分类号: H01L21/67 , H01L21/687 , H01L21/02 , C23C14/50
摘要: A moveable substrate support for use in a processing chamber is provided. The moveable substrate support includes a substrate support surface and a robot, wherein the robot is configured to move the substrate support surface along a movement path. The substrate support includes a halo, and the halo protects the underlying components of the processing chamber from unwanted deposition, while the substrate support surface is moving along the movement path. The substrate support protects processing chamber components from deposition, reducing cleaning time and reducing the need for repairs of the components of the processing chamber.
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公开(公告)号:US20170271182A1
公开(公告)日:2017-09-21
申请号:US15613906
申请日:2017-06-05
IPC分类号: H01L21/67 , G01J5/08 , H01L21/687 , G01J5/00
CPC分类号: H01L21/67248 , G01J5/0007 , G01J5/0818 , H01L21/68742
摘要: Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. One or more lift pins has a light pipe disposed therein to collect radiation emitted or transmitted by the substrate when the lift pin contacts the substrate surface.
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公开(公告)号:US20170053784A1
公开(公告)日:2017-02-23
申请号:US15240927
申请日:2016-08-18
发明人: Anantha K. SUBRAMANI , Hanbing WU , Wei W. WANG , Ashish GOEL , Srinivas GUGGILLA , Lavinia NISTOR
CPC分类号: H01J37/3417 , C23C14/3464 , C23C14/564 , H01J37/32871 , H01J37/3429 , H01J37/3441 , H01J37/3447 , H01J37/3464 , H01J37/3485
摘要: Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.
摘要翻译: 本文提供了用于共溅射多个靶材料的方法和装置的实施例。 在一些实施例中,包括用于支撑衬底的衬底支撑件的处理室; 耦合到载体并且具有相应的多个靶以溅射到所述衬底上的多个阴极; 以及耦合到所述载体并在所述多个靶的相邻对之间延伸的过程屏蔽。
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公开(公告)号:US20140269826A1
公开(公告)日:2014-09-18
申请号:US14189664
申请日:2014-02-25
CPC分类号: H01L21/67248 , G01J5/0007 , G01J5/0818 , H01L21/68742
摘要: Disclosed are method and apparatus for treating a substrate. The apparatus is a dual-function process chamber that may perform both a material process and a thermal process on a substrate. The chamber has an annular radiant source disposed between a processing location and a transportation location of the chamber. Lift pins have length sufficient to maintain the substrate at the processing location while the substrate support is lowered below the radiant source plane to afford radiant heating of the substrate. One or more lift pins has a light pipe disposed therein to collect radiation emitted or transmitted by the substrate when the lift pin contacts the substrate surface.
摘要翻译: 公开了用于处理基材的方法和装置。 该装置是双功能处理室,其可以在基板上进行材料处理和热处理。 该室具有设置在处理位置和室的输送位置之间的环形辐射源。 提升销具有足够的长度以将衬底保持在处理位置,同时衬底支撑件降低到辐射源平面下方以提供衬底的辐射加热。 一个或多个提升销具有设置在其中的光管,用于当提升销接触基板表面时收集由基板发射或传输的辐射。
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