公开(公告)号：US20170053784A1

公开(公告)日：2017-02-23

申请号：US15240927

申请日：2016-08-18

Applicant: APPLIED MATERIALS, INC.

Inventor： Anantha K. SUBRAMANI ,  Hanbing WU ,  Wei W. WANG ,  Ashish GOEL ,  Srinivas GUGGILLA ,  Lavinia NISTOR

IPC: H01J37/34 ,  C23C14/34

CPC classification number: H01J37/3417 ,  C23C14/3464 ,  C23C14/564 ,  H01J37/32871 ,  H01J37/3429 ,  H01J37/3441 ,  H01J37/3447 ,  H01J37/3464 ,  H01J37/3485

Abstract: Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.

Abstract translation: 本文提供了用于共溅射多个靶材料的方法和装置的实施例。 在一些实施例中，包括用于支撑衬底的衬底支撑件的处理室; 耦合到载体并且具有相应的多个靶以溅射到所述衬底上的多个阴极; 以及耦合到所述载体并在所述多个靶的相邻对之间延伸的过程屏蔽。

公开(公告)号：US20200013597A1

公开(公告)日：2020-01-09

申请号：US16573265

申请日：2019-09-17

Applicant: APPLIED MATERIALS, INC.

Inventor： Anantha K. SUBRAMANI ,  Hanbing WU ,  Wei W. WANG ,  Ashish GOEL ,  Srinivas GUGGILLA ,  Lavinia NISTOR

IPC: H01J37/34 ,  C23C14/34

Abstract: Embodiments of a method and apparatus for co-sputtering multiple target materials are provided herein. In some embodiments, a process chamber including a substrate support to support a substrate; a plurality of cathodes coupled to a carrier and having a corresponding plurality of targets to be sputtered onto the substrate; and a process shield coupled to the carrier and extending between adjacent pairs of the plurality of targets.