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公开(公告)号：US20070236901A1
公开(公告)日：2007-10-11
申请号：US11748045
申请日：2007-05-14
IPC分类号： H01R12/16
CPC分类号： H01R12/52 , H01R12/7011 , H01R12/7082 , H01R12/714 , H01R12/716 , H01R12/721 , H01R13/24 , H01R31/06 , H05K1/0237 , H05K1/14 , H05K1/147 , H05K3/222 , H05K7/1441 , H05K2201/044 , H05K2201/10189 , H05K2201/10356
摘要： A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.
摘要翻译： 一种用于具有印刷电路板，第一电气结构和第二电气结构的系统中的信号分离连接器。 连接器包括用于在第一电气结构和印刷电路板之间传送信号的第一组导电元件和用于在第一电结构和第二电结构之间传送信号的第二组导电元件。
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2.发明申请Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity 有权具有冗余接触点的电气互连器件，用于减少电容性短截线和改善的信号完整性公开(公告)号：US20070178774A1
公开(公告)日：2007-08-02
申请号：US11607143
申请日：2006-12-01
IPC分类号： H01R4/48
CPC分类号： H05K3/326 , H01R12/714 , H01R12/79 , H01R13/2407 , H01R13/658 , H05K3/4092 , H05K2201/0397 , H05K2201/0979
摘要： An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.
摘要翻译： 一种电互连装置，用于在要配合的两个导电元件的端部之间建立冗余触点，产生不具有电容短截线的电互连。
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3.发明申请公开(公告)号：US20060035482A1
公开(公告)日：2006-02-16
申请号：US11123863
申请日：2005-05-06
IPC分类号： H05K1/00
CPC分类号： H01R12/714 , H01R12/52 , H01R12/7082 , H01R13/24 , H01R13/6599
摘要： An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
摘要翻译： 电连接器。 一种电连接器，包括具有第一通道的连接器主体和在第一末端部分中延伸穿过第一通道的第一导电元件。 第一末端部分具有第一力矩臂，当被迫与第一导电表面接触时，扭转第一导电元件以产生扭转力。 扭转力保持第一末端部分与第一导电表面接触。
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4.发明申请Stair step printed circuit board structures for high speed signal transmissions 有权阶梯式印刷电路板结构用于高速信号传输公开(公告)号：US20050103522A1
公开(公告)日：2005-05-19
申请号：US10990280
申请日：2004-11-15
申请人： Kevin Grundy , William Wiedemann , Joseph Fjelstad
发明人： Kevin Grundy , William Wiedemann , Joseph Fjelstad
CPC分类号： H05K3/3405 , H01L2224/16225 , H01L2224/32225 , H01L2224/48227 , H01L2224/48465 , H01L2224/49109 , H01L2224/73204 , H01L2924/15311 , H01L2924/19107 , H01L2924/3011 , H05K1/183 , H05K3/308 , H05K3/3421 , H05K3/3447 , H05K3/4602 , H05K3/4697 , H05K2201/0919 , H05K2201/092 , H05K2201/09845 , H05K2201/10189 , H05K2201/1059 , H05K2201/10689 , H05K2201/10704 , H05K2201/10727 , H05K2201/10734 , H01L2924/00
摘要： Disclosed are stair stepped PCB structures which provide high performance, direct path, via-less interconnections between various elements of an electronic interconnection structure including, among others, IC packages and connectors.
摘要翻译： 公开了楼梯级PCB结构，其提供包括IC封装和连接器在内的电子互连结构的各种元件之间的高性能，直接路径，无通孔互连。
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公开(公告)号：US20050093152A1
公开(公告)日：2005-05-05
申请号：US10964578
申请日：2004-10-12
申请人： Joseph Fjelstad , Para Segaram , Thomas Obenhuber , Inessa Obenhuber , Kevin Grundy , William Wiedemann
发明人： Joseph Fjelstad , Para Segaram , Thomas Obenhuber , Inessa Obenhuber , Kevin Grundy , William Wiedemann
IPC分类号： H01L20060101 , H01L23/13 , H01L23/31 , H01L23/48 , H01L23/498 , H01L25/065
CPC分类号： H01L23/13 , H01L23/3128 , H01L23/49805 , H01L23/49816 , H01L23/49833 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L2224/16 , H01L2224/32145 , H01L2224/32188 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/4824 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/8592 , H01L2225/0651 , H01L2225/06555 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15173 , H01L2924/15311 , H01L2924/1532 , H01L2924/15331 , H01L2924/181 , H01L2924/19042 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599 , H01L2924/00012
摘要： A cost effective, high performance, IC package assembly of the present invention comprises stair-stepped layers of redistribution circuits from at least one chip to terminals on any of multiple surfaces and levels of the IC package assembly. Critical path circuits of the assembly have no plated vias and are directly routed from interconnection terminals which are used to interconnect the package to the IC chip terminals by flip chip or wire bond methods.
摘要翻译： 本发明的成本有效，高性能的IC封装组件包括从IC封装组件的多个表面和电平中的任一个上的至少一个芯片到端子的阶梯层的再分配电路。 组件的关键路径电路没有电镀通孔，并且通过倒装芯片或引线键合方法将互连封装与IC芯片端子互连的互连端直接布线。
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6.发明申请High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture 有权高速，直通，阶梯式，具有改进的信号完整性特征的电子连接器及其制造方法公开(公告)号：US20050239300A1
公开(公告)日：2005-10-27
申请号：US11055579
申请日：2005-02-09
CPC分类号： H05K1/117 , H01R12/523 , H01R12/62 , H01R12/716 , H01R13/24 , H01R13/6587 , H05K1/142 , H05K3/366 , H05K3/368 , H05K2201/09063 , H05K2201/09445 , H05K2201/09472 , H05K2201/09709 , H05K2201/09845 , H05K2201/10189 , H05K2203/167
摘要： An electrical connector comprised of a plurality of electrical contacts arranged in a stair-step configuration designed to mate with electrical components having electrical contacts arranged in a stair-step configuration. A direct connect signaling system comprised of stair-step electrical connectors mated to stair-step printed circuit boards, other stair-step electrical components, or combinations thereof.
摘要翻译： 一种电连接器，包括布置成阶梯式结构的多个电触点，其设计成与具有以阶梯状构造布置的电触点的电气部件配合。 一种直接连接信号系统，包括与台阶式印刷电路板，其他楼梯电气部件或其组合配合的楼梯级电连接器。
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公开(公告)号：US20050189640A1
公开(公告)日：2005-09-01
申请号：US11055578
申请日：2005-02-09
CPC分类号： H01L23/13 , H01L23/3107 , H01L24/48 , H01L24/49 , H01L25/105 , H01L2224/0401 , H01L2224/05599 , H01L2224/16235 , H01L2224/48095 , H01L2224/48227 , H01L2224/48247 , H01L2224/49109 , H01L2224/85399 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2225/1088 , H01L2924/00014 , H01L2924/01027 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/181 , H01L2924/18165 , H01L2924/19041 , H01L2924/19107 , H01L2924/3011 , H01L2924/30111 , H05K1/182 , H05K1/183 , H05K3/308 , H05K3/3405 , H05K3/3421 , H05K3/3447 , H05K3/4046 , H05K3/4602 , H05K3/4697 , H05K2201/0919 , H05K2201/092 , H05K2201/09845 , H05K2201/10189 , H05K2201/1053 , H05K2201/10545 , H05K2201/1059 , H05K2201/10659 , H05K2201/10689 , H05K2201/10704 , H05K2201/10727 , H05K2201/10734 , H01L2224/45099 , H01L2924/00 , H01L2924/00012
摘要： Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.
摘要翻译： 由多个封装，印刷电路板，连接器和插入件采用的结构，以产生减少与使用通孔相关联的有害信号质量问题的信号路径。 公开的结构可以与通孔实现共存。
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公开(公告)号：US20060034061A1
公开(公告)日：2006-02-16
申请号：US11097450
申请日：2005-04-01
IPC分类号： H01R12/16
CPC分类号： H01R12/52 , H01R12/7011 , H01R12/7082 , H01R12/714 , H01R12/716 , H01R12/721 , H01R13/24 , H01R31/06 , H05K1/0237 , H05K1/14 , H05K1/147 , H05K3/222 , H05K7/1441 , H05K2201/044 , H05K2201/10189 , H05K2201/10356
摘要： A signal-segregating connector for use in a system having a printed circuit board, a first electrical structure and a second electrical structure. The connector includes a first set of conductive elements to convey signals between the first electrical structure and the printed circuit board, and a second set of conductive elements to convey signals between the first electrical structure and the second electrical structure.
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9.发明申请Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity 有权具有冗余接触点的电气互连器件，用于减少电容性短截线和改善的信号完整性公开(公告)号：US20050221680A1
公开(公告)日：2005-10-06
申请号：US11093266
申请日：2005-03-28
CPC分类号： H05K3/326 , H01R12/714 , H01R12/79 , H01R13/2407 , H01R13/658 , H05K3/4092 , H05K2201/0397 , H05K2201/0979
摘要： An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.
摘要翻译： 一种电互连装置，用于在要配合的两个导电元件的端部之间建立冗余触点，产生不具有电容短截线的电互连。
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