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    Semiconductor packages
    1.
    发明授权
    Semiconductor packages 有权

    公开(公告)号：US10090278B2

    公开(公告)日：2018-10-02

    申请号：US15393754

    申请日：2016-12-29

    申请人： Sang-Sick Park ,  Geol Nam ,  Tae Hong Min ,  Jihwan Hwang

    发明人： Sang-Sick Park ,  Geol Nam ,  Tae Hong Min ,  Jihwan Hwang

    IPC分类号： H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00

    摘要： A semiconductor package includes a plurality of semiconductor chips on a substrate. The semiconductor chips include a first semiconductor chip, a second semiconductor chip, and a third semiconductor chip that are sequentially stacked on the substrate. The semiconductor package further includes a plurality of non-conductive layers between the substrate and the first semiconductor chip and between adjacent semiconductor chips among the semiconductor chips. The semiconductor chips include smaller widths as a distance from the substrate increases. Each of the non-conductive layers includes an extension protruding outward from a side surface of an overlying one of the semiconductor chips.

    CHIP-STACKED SEMICONDUCTOR PACKAGE
    3.
    发明申请
    CHIP-STACKED SEMICONDUCTOR PACKAGE 有权
    芯片堆叠半导体封装

    公开(公告)号：US20160056101A1

    公开(公告)日：2016-02-25

    申请号：US14818682

    申请日：2015-08-05

    申请人： Young-kun JEE ,  Tae-hong MIN ,  Sun-kyoung SEO

    发明人： Young-kun JEE ,  Tae-hong MIN ,  Sun-kyoung SEO

    IPC分类号： H01L23/498 ,  H01L25/065 ,  H01L23/31

    CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3142 ,  H01L23/3178 ,  H01L23/481 ,  H01L2224/16145 ,  H01L2224/73204 ,  H01L2225/06513

    摘要： A chip-stacked semiconductor package including a first chip having a plurality of first real bump pads and a plurality of first dummy bump pads, a second chip on the first chip, the second chip including a plurality of real bumps and a plurality of bridge dummy bumps, the plurality of real bumps electrically connected to the plurality of first real bump pads, the plurality of bridge dummy bumps connected to the plurality of first dummy bump pads, and a sealing member sealing the first chip and the second chip may be provided.

    摘要翻译： 一种芯片堆叠半导体封装，包括具有多个第一实际凸块焊盘和多个第一虚拟凸块焊盘的第一芯片，第一芯片上的第二芯片，所述第二芯片包括多个实际凸块和多个桥模 可以提供电连接到多个第一真实凸块焊盘的多个真实凸块，连接到多个第一虚拟凸块焊盘的多个桥接虚拟凸起以及密封第一芯片和第二芯片的密封构件。