Abstract:
A dynamic random access memory comprises a substrate, a transfer transistor provided on the substrate, a memory cell capacitor provided on the substrate in contact with a first diffusion region formed in the substrate, a first conductor pattern provided on the substrate to extend in a first direction as a word line, a first insulator layer provided on the substrate to bury the memory cell capacitor and the first conductor pattern, a first contact hole provided on the first insulator layer to expose a second diffusion region formed in the substrate, a second conductor pattern provided on the first insulator layer to extend in a second direction, passing above the memory cell capacitor and making a contact with the second diffusion region at the first contact hole, a second insulator layer provided on the second conductor pattern, a second contact hole provided on the second insulator layer at a part thereof that locates above the memory cell capacitor to expose the upper major surface of the second conductor pattern, and a third conductor pattern provided on the second insulator layer to extend in the second direction substantially coincident with the first conductor pattern as a bit line of the dynamic random access memory, wherein the third conductor pattern makes a contact with the second conductor pattern at the second contact hole.
Abstract:
A semiconductor memory device which includes a plurality of memory cells each having a capacitor, and peripheral circuits of the memory cells, integrated on a semiconductor substrate. Each capacitor has a storage electrode and an electrode opposite to the storage electrode, the opposite electrode being connected to a ground line, wherein, the ground line connected to the opposite electrode of each capacitor is separated from the other ground lines connected to the peripheral circuits. All of the ground lines are connected to a common portion having an impedance lower than the impedance of each ground line, whereby data stored in the capacitors is prevented from being destroyed.
Abstract:
A metal-insulator semiconductor dynamic memory device including sense amplifiers arrayed on a semiconductor substrate and divided into a plurality of sense amplifier groups. Column decoders are provided, one decoder for each sense amplifier group, each sense amplifier group being selected by the column decoder. One or more control signal lines for simultaneously selecting the output signals of at least two sense amplifiers in the sense amplifier group selected by the column decoder, a plurality of data buses for transferring the output signals of at least two sense amplifiers selected by one or more control signal lines, are included in the memory device. All of the sense amplifiers have the control signal lines and the data buses in common.
Abstract:
A semiconductor memory testing device and testing method comprises an address pattern generator which successively generates an address pattern which specifies the X-Y addresses of each memory cell of a semiconductor memory device which is to be tested, an address changeover or swapping device which makes access to the semiconductor memory device with the address pattern supplied by the address pattern generator during normal operation mode, and addresses interchanged during swap operation mode, a comparator which compares data from the semiconductor memory device with an expected value to detect hardware error, and a fail memory device which stores information concerning the existence hardware error in each of the memory cells of the semiconductor memory device in an address region corresponding to that of the bad cell of the semiconductor memory device. The semiconductor memory device and the fail memory device both receive common X-Y addresses from the address changeover or swapping device. The comparator preheated from comparing by a signal supplied from said fail memory device for the memory cells of the semiconductor memory device corresponding to the memory cells of the fail memory device which have information stored therein indicating the existence of hardware errors.
Abstract:
A semiconductor memory device including a pair of bit lines, a memory cell provided between the pair of bit lines, and a potential difference control device connected to the pair of bit lines. The bit lines include a potential difference therebetween when information stored in the memory cell is read out. The potential difference control device has a transistor control for receiving a first control signal and for responding thereto; thereby, increasing the potential difference between the pair of bit lines up to a predetermined level so as to provide a high speed read-operation and to reliably discriminate a "good" or a "no good" reading when subjected to a screening test.
Abstract:
A semiconductor memory device operates under a so-called address multiplex access method. A row part of the device is enabled by receiving a row address strobe (RAS) signal. A column part of the device is enabled by simultaneously receiving both a column address strobe (CAS) signal and a timing control signal supplied from the row part during its enable state. A column address buffer in the column part is enabled by simultaneously receiving both the CAS signal and a timing control signal. The timing control signal is produced from a circuit when it detects and holds the RAS signal.
Abstract:
A semiconductor device, provided with a buffer, which comprises a first transistor for pulling up the output terminal voltage, a second transistor for pulling down the output terminal voltage, and a charge-pumping circuit for maintaining the output terminal voltage at a level higher than the power source voltage by charge pumping when the output terminal voltage is at a high level. The semiconductor device further comprises a circuit for pulling down the output terminal voltage during the period from when power is supplied to when an input signal is supplied to the buffer.
Abstract:
A semiconductor memory device is connected to a power source and includes a reference potential line connected to receive a reference potential from the power source. An input circuit is connected to the reference potential line and receives an external input signal having a logic level defined in reference to the reference potential to be supplied to the source potential line. The output circuit has an external output terminal which is connected to the reference potential line. The output circuit is for generating an output to the external output terminal. An inhibiting circuit inhibits a response to the external input signal of the input circuit for a predetermined period during which the output of the output circuit changes.
Abstract:
A metal-insulator semiconductor dynamic memory device comprising sense amplifiers arrayed on a semiconductor substrate and column decoders. Each of the column decode being provided for a plurality of sense amplifiers and selecting one or more sense amplifiers from the plurality of sense amplifiers, the column decoders being dispersed on both sides of the arrayed sense amplifiers. A plurality of control signal lines which, in order to select the sense amplifiers, control gate elements connected between bit lines connected to the sense amplifiers and data bus lines and which are disposed on both sides of the arrayed sense amplifiers. Conducting lines are also disposed between the sense amplifiers and deliver signals from the control signal lines, for selecting sense amplifiers to the gate elements on the opposite side of the control signal lines with regard to the arrayed sense amplifiers.
Abstract:
A semiconductor circuit used as a buffer circuit having an input stage circuit for receiving an input clock signal and an inverted input clock signal, a bootstrap circuit including a transistor for receiving the output of the input stage circuit and for maintaining the gate voltage of the transistor at a high level during the standby period, and an output circuit, including a transistor which is switched on and off by the output of the bootstrap circuit, for generating an output clock signal; the semiconductor circuit further comprising a current leak circuit for maintaining, during the standby period, the voltage of a point in the semiconductor circuit which is charged during the standby period at the value corresponding to the voltage of the power source, whereby the delay of the output clock signal, caused of the fluctuation by the voltage of the power supply during the standby period, is improved and then the high speed access time in the dynamic memory is carried out.