Abstract:
A semiconductor memory device operates under a so-called address multiplex access method. A row part of the device is enabled by receiving a row address strobe (RAS) signal. A column part of the device is enabled by simultaneously receiving both a column address strobe (CAS) signal and a timing control signal supplied from the row part during its enable state. A column address buffer in the column part is enabled by simultaneously receiving both the CAS signal and a timing control signal. The timing control signal is produced from a circuit when it detects and holds the RAS signal.
Abstract:
A semiconductor memory device is connected to a power source and includes a reference potential line connected to receive a reference potential from the power source. An input circuit is connected to the reference potential line and receives an external input signal having a logic level defined in reference to the reference potential to be supplied to the source potential line. The output circuit has an external output terminal which is connected to the reference potential line. The output circuit is for generating an output to the external output terminal. An inhibiting circuit inhibits a response to the external input signal of the input circuit for a predetermined period during which the output of the output circuit changes.
Abstract:
A metal-insulator semiconductor dynamic memory device comprising sense amplifiers arrayed on a semiconductor substrate and column decoders. Each of the column decode being provided for a plurality of sense amplifiers and selecting one or more sense amplifiers from the plurality of sense amplifiers, the column decoders being dispersed on both sides of the arrayed sense amplifiers. A plurality of control signal lines which, in order to select the sense amplifiers, control gate elements connected between bit lines connected to the sense amplifiers and data bus lines and which are disposed on both sides of the arrayed sense amplifiers. Conducting lines are also disposed between the sense amplifiers and deliver signals from the control signal lines, for selecting sense amplifiers to the gate elements on the opposite side of the control signal lines with regard to the arrayed sense amplifiers.
Abstract:
A semiconductor circuit used as a buffer circuit having an input stage circuit for receiving an input clock signal and an inverted input clock signal, a bootstrap circuit including a transistor for receiving the output of the input stage circuit and for maintaining the gate voltage of the transistor at a high level during the standby period, and an output circuit, including a transistor which is switched on and off by the output of the bootstrap circuit, for generating an output clock signal; the semiconductor circuit further comprising a current leak circuit for maintaining, during the standby period, the voltage of a point in the semiconductor circuit which is charged during the standby period at the value corresponding to the voltage of the power source, whereby the delay of the output clock signal, caused of the fluctuation by the voltage of the power supply during the standby period, is improved and then the high speed access time in the dynamic memory is carried out.
Abstract:
A metal-insulator semiconductor dynamic memory device including sense amplifiers arrayed on a semiconductor substrate and divided into a plurality of sense amplifier groups. Column decoders are provided, one decoder for each sense amplifier group, each sense amplifier group being selected by the column decoder. One or more control signal lines for simultaneously selecting the output signals of at least two sense amplifiers in the sense amplifier group selected by the column decoder, a plurality of data buses for transferring the output signals of at least two sense amplifiers selected by one or more control signal lines, are included in the memory device. All of the sense amplifiers have the control signal lines and the data buses in common.
Abstract:
In a semiconductor integrated circuit having first and second power supply lines for receiving a power supply voltage, an external input terminal for receiving an input signal, and a high voltage detection circuit for detecting at the external input terminal a high voltage higher than a predetermined voltage which is higher than the power supply voltage, the high voltage detection circuit comprises an input circuit connected to the external input terminal for generating circuit for generating a reference voltage; and a differential voltage amplifier connected to receive the detection voltage and the reference voltage for amplifying the difference between the detection voltage and the reference voltage, to thereby determine whether the high voltage is applied, the input circuit comprising; a level shift element connected to the external input terminal for providing the detection voltage; an impedance element connected between the level shift element and the second power supply line; and a leak current compensating element connected between the first power supply line and the level shift element for allowing a current to flow from the first power supply line through the leak current compensating element and the impedance element to the second power supply line when the high voltage is not applied to the external input terminal.
Abstract:
A dynamic semiconductor memory device includes data output lines (D, D), a data output buffer (12), a column enable buffer (9), and an output enable buffer (11) for generating an output enable signal (OE) to enable the transmission of data from the data output lines to the data buffer. The output enable buffer is driven by the clock signals of the column enable buffer. An output disabling circuit (13) is provided to stop the generation of an output enable signal by the output enable buffer when the output enable buffer is not being driven by the column enable buffer. As a result, the data output buffer assumes a high-impedance state when a power supply is turned on.
Abstract:
A semiconductor integrated circuit (IC) device includes therein a test circuit. The test circuit operates to distinguish the power source level during the testing or ground level occurring at an internal node located inside the semiconductor chip. The test circuit includes a series-connected MIS transistor and an MIS diode. The gate of the MIS transistor is connected to the internal node. The MIS diode is connected to an external input/output (I/O) pin. The level at the internal node, i.e., the power source level or the ground level, can be distinguished by a first voltage level or a second voltage level applied to the external I/O pin, whichever enables a current to be drawn from the external I/O pin.
Abstract:
A semiconductor circuit for driving a clock signal line comprising a first circuit for pulling up the potential of the clock signal line to the source voltage and a second circuit for pulling down the potential of the clock signal line to a lower voltage. A capacitor is connected to the clock signal line for receiving a potential push signal and pushing the potential of the clock signal line higher than the source voltage. The capacitor performs the function of capacitance only after the potential of the clock signal line is raised to the source voltage. The operational speed of a dynamic memory device associated with the semiconductor device is then enhanced.
Abstract:
A buffer circuit comprises a flip-flop which is receives an external input via a first input circuit and a reference voltage via a second input circuit. Internal complementary outputs are then produced via an output circuit. The flip-flop cooperates with at least one level setting device by way of a second input circuit. The level setting device functions to produce a voltage level to deactivate the second input circuit during activation of the flip-flop.