公开(公告)号：US09177834B2

公开(公告)日：2015-11-03

申请号：US14184672

申请日：2014-02-19

申请人： Chee Seng Foong ,  Meng Kong Lye ,  Lan Chu Tan ,  Seng Kiong Teng

发明人： Chee Seng Foong ,  Meng Kong Lye ,  Lan Chu Tan ,  Seng Kiong Teng

IPC分类号： H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48245 ,  H01L2224/732 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/0665 ,  H01L2224/48 ,  H01L2224/72

摘要： A semiconductor device includes a semiconductor die encapsulated in a package casing and having four main side walls each oriented generally parallel with one of first or second orthogonal directions. Signal leads are electrically coupled to the die and each has an exposed portion that extends from one of the main side walls parallel with one of the first or second directions. One or more power bars are electrically coupled to the die and each has at least one power bar lead extending at a non-zero angle with respect to the first and second directions. The power bars and associated power bar leads are electrically isolated from the signal leads. One or more tie bars extends at a generally non-zero angle with respect to the first and second directions and is electrically isolated from the signal leads and the power bars and associated power bar leads.

摘要翻译： 半导体器件包括封装在封装壳体中并具有四个主侧壁的半导体管芯，每个主侧壁大致平行于第一或第二正交方向之一。 信号引线电耦合到管芯，并且每个具有从主侧壁中的一个平行于第一或第二方向之一延伸的暴露部分。 一个或多个电源杆电耦合到管芯，并且每个具有至少一个相对于第一和第二方向以非零角度延伸的电源杆引线。 电源条和相关的电源条引线与信号引线电隔离。 一个或多个连接杆相对于第一和第二方向以大致非零的角度延伸，并且与信号引线和功率条以及相关联的功率条引线电隔离。

公开(公告)号：US20150235924A1

公开(公告)日：2015-08-20

申请号：US14184672

申请日：2014-02-19

申请人： Chee Seng Foong ,  Meng Kong Lye ,  Lan Chu Tan ,  Seng Kiong Teng

发明人： Chee Seng Foong ,  Meng Kong Lye ,  Lan Chu Tan ,  Seng Kiong Teng

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC分类号： H01L21/56 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/72 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/27334 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45664 ,  H01L2224/48245 ,  H01L2224/732 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/85411 ,  H01L2224/85424 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/0665 ,  H01L2224/48 ,  H01L2224/72

摘要： A semiconductor device includes a semiconductor die encapsulated in a package casing and having four main side walls each oriented generally parallel with one of first or second orthogonal directions. Signal leads are electrically coupled to the die and each has an exposed portion that extends from one of the main side walls parallel with one of the first or second directions. One or more power bars are electrically coupled to the die and each has at least one power bar lead extending at a non-zero angle with respect to the first and second directions. The power bars and associated power bar leads are electrically isolated from the signal leads. One or more tie bars extends at a generally non-zero angle with respect to the first and second directions and is electrically isolated from the signal leads and the power bars and associated power bar leads.

摘要翻译： 半导体器件包括封装在封装壳体中并具有四个主侧壁的半导体管芯，每个主侧壁大致平行于第一或第二正交方向之一。 信号引线电耦合到管芯，并且每个具有从主侧壁中的一个平行于第一或第二方向之一延伸的暴露部分。 一个或多个电源杆电耦合到管芯，并且每个具有至少一个相对于第一和第二方向以非零角度延伸的电源杆引线。 电源条和相关的电源条引线与信号引线电隔离。 一个或多个连接杆相对于第一和第二方向以大致非零的角度延伸，并且与信号引线和功率条以及相关联的功率条引线电隔离。

公开(公告)号：US08933547B1

公开(公告)日：2015-01-13

申请号：US14086929

申请日：2013-11-21

申请人： Jia Lin Yap ,  Yin Kheng Au ,  Ahmad Termizi Suhaimi ,  Seng Kiong Teng ,  Boon Yew Low ,  Navas Khan Oratti Kalandar

发明人： Jia Lin Yap ,  Yin Kheng Au ,  Ahmad Termizi Suhaimi ,  Seng Kiong Teng ,  Boon Yew Low ,  Navas Khan Oratti Kalandar

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L21/4842 ,  H01L23/4952 ,  H01L23/49558 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171

摘要： A lead frame for a packaged semiconductor device has multiple, configurable power bars that can be selectively electrically connected, such as with bond wires, to each other and/or to other leads of the lead frame to customize the lead frame for different package designs. One or more of the configurable power bars may extend into one or more cut-out regions in a die paddle of the lead frame, which allows for short bond wires to be used to connect the power bars to die pads of a semiconductor die mounted on the die paddle.

摘要翻译： 用于封装半导体器件的引线框架具有多个可配置的功率条，其可以例如通过接合线电连接到引线框架的彼此和/或引线框架的其它引线，以定制用于不同封装设计的引线框架。 一个或多个可配置的功率条可以延伸到引线框架的管芯焊盘中的一个或多个切除区域，这允许短接合线用于将功率棒连接到安装在其上的半导体管芯的管芯焊盘 模具桨。

公开(公告)号：US20110204498A1

公开(公告)日：2011-08-25

申请号：US12712159

申请日：2010-02-24

申请人： Yin Kheng Au ,  Mohd Rusli Ibrahim ,  Meng Kong Lye ,  Zi Song Poh ,  Seng Kiong Teng ,  Kesyakumar V.C. Muniandy

发明人： Yin Kheng Au ,  Mohd Rusli Ibrahim ,  Meng Kong Lye ,  Zi Song Poh ,  Seng Kiong Teng ,  Kesyakumar V.C. Muniandy

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame for a semiconductor package has a flag to which a semiconductor die is mounted. Tie bars are coupled to the flag. There is a first set of leads and each first set lead in the first set of leads has a first set lead parallel length and a first set lead tapered length. The first set lead parallel length of each first set lead has a constant width and edges that are parallel to edges of all other first set lead parallel lengths. A free end region of the first set lead tapered length of each first set lead provides a first set lead bond target region. There is a second set of leads disposed between a first one of the tie bars and the first set of leads. Each second set lead, in the second set of leads, has a second set lead parallel length and a second set lead tapered length. The second set lead parallel length of each second set lead has a constant width and edges that are parallel to edges of all other second set lead parallel lengths in the second set of leads and also parallel to the edges of first set lead parallel lengths. At least one second set lead has an extension length extending inwardly from the second set lead tapered length, the extension length has a constant width and provides a second set lead bond target region. Wire bond leads electrically couple both the first set lead bond target region and second set lead bond target region to respective die external electrical connection pads on a surface of the die and a package body encloses the die.

摘要翻译： 半导体封装的引线框架具有安装有半导体管芯的标志。 领带条与标志相连。 存在第一组引线，并且第一组引线中的每个第一组引线具有第一组引线平行长度和第一组引线锥形长度。 每个第一组引线的第一组引线平行长度具有恒定的宽度，并且与所有其它第一组引线平行长度的边缘平行的边缘。 每个第一集合引线的第一组引线锥形长度的自由端区域提供第一组引线键合目标区域。 存在设置在第一组连杆和第一组引线之间的第二组引线。 在第二组引线中的每个第二设定引线具有第二设定引线平行长度和第二设定引线锥形长度。 每个第二组引线的第二组引线平行长度具有恒定的宽度，并且边缘平行于第二组引线中的所有其它第二设定引线平行长度的边缘，并且平行于第一组引线平行长度的边缘。 至少一个第二固定引线具有从第二组引线锥形长度向内延伸的延伸长度，延伸长度具有恒定的宽度并且提供第二组引线键合目标区域。 引线接合引线将第一组引线接合目标区域和第二组引线接合目标区域电耦合到管芯表面上的相应管芯外部电连接焊盘，并且封装主体封装管芯。

公开(公告)号：US08012799B1

公开(公告)日：2011-09-06

申请号：US12795664

申请日：2010-06-08

申请人： Ruzaini Ibrahim ,  Seng Kiong Teng

发明人： Ruzaini Ibrahim ,  Seng Kiong Teng

IPC分类号： H01L21/00

CPC分类号： H01L23/4334 ,  H01L21/566 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A method for packaging a semiconductor die or assembling a semiconductor device that includes a heat spreader begins with attaching the heat spreader to a film and dispensing a mold compound in granular form onto the film such that the mold compound at least partially covers the film and the heat spreader. The film with the attached heat spreader is placed in a first mold section. A substrate having a semiconductor die attached and electrically coupled to it are placed in a second mold section and then the first and second mold sections are mated such that the die is covered by the heat spreader. The granular mold compound is then melted so that the mold compound covers the die and sides of the heat spreader. The first and second mold sections then are separated. The film, which adheres to the substrate, is removed to expose a top surface of the heat spreader, and thus a semiconductor device is formed.

摘要翻译： 一种用于封装半导体管芯或组装包括散热器的半导体器件的方法开始于将散热器附接到膜上，并将颗粒状的模具化合物分散到膜上，使得模制化合物至少部分地覆盖膜和 散热器 具有附接的散热器的膜被放置在第一模具部分中。 将具有附接并电耦合到其上的半导体管芯的衬底放置在第二模具部分中，然后将第一和第二模具部分配合，使得模具被散热器覆盖。 然后将颗粒状模具化合物熔化，使得模具化合物覆盖模具和散热器的侧面。 然后分离第一和第二模具部分。 去除附着在基板上的膜，露出散热器的顶面，形成半导体器件。

公开(公告)号：US09129951B2

公开(公告)日：2015-09-08

申请号：US14056930

申请日：2013-10-17

申请人： Seng Kiong Teng ,  Ly Hoon Khoo ,  Wen Shi Koh

发明人： Seng Kiong Teng ,  Ly Hoon Khoo ,  Wen Shi Koh

IPC分类号： H01L29/40 ,  H01L23/495

CPC分类号： H01L23/49586 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A lead frame includes a lead formed of a conductive material and having first and second ends, opposing first and second main surfaces, and opposing first and second side surfaces each extending between the first and second main surfaces. A polymeric layer is formed at least on the first main surface and the first and second side surfaces of the lead at least proximate the second end of the lead. An opening in the polymeric layer on the first main surface of the lead proximate the second end is provided for connecting the lead to, for example, a semiconductor die via a bond wire.

摘要翻译： 引线框架包括由导电材料形成的引线，其具有第一和第二端，相对的第一和第二主表面以及相对的第一和第二侧表面，每个在第一和第二主表面之间延伸。 至少在引线的第二端附近，至少在引线的第一主表面和引线的第一和第二侧表面上形成聚合物层。 提供靠近第二端的引线的第一主表面上的聚合物层中的开口，用于通过接合线将导线连接到例如半导体管芯。

公开(公告)号：US20150118802A1

公开(公告)日：2015-04-30

申请号：US14464719

申请日：2014-08-21

申请人： Boon Yew Low ,  Teck Beng Lau ,  Seng Kiong Teng ,  Shufeng Zhao

发明人： Boon Yew Low ,  Teck Beng Lau ,  Seng Kiong Teng ,  Shufeng Zhao

IPC分类号： B29C45/27 ,  B29C45/34 ,  H01L21/56 ,  B29C45/14

CPC分类号： H01L21/565 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A mold die includes a side wall forming a hollow cavity and opposing first and second axial ends. The side wall has first and second openings respectively at the first and second axial ends. Each of the first and second openings accesses the hollow cavity. A main wall is coupled to the side wall at the first end thereof and spans the first opening. A center of the main wall is aligned with a longitudinal axis of the side wall. The main wall defines a plane oriented generally perpendicularly with respect to the longitudinal axis of the side wall. First and second gates are formed through the main wall to access the hollow cavity. The first and second gates define a first line lying in the plane of the main wall. The center of the main wall is located on the first line between the first and second gates.

摘要翻译： 模具包括形成中空腔的侧壁和相对的第一和第二轴向端。 侧壁在第一和第二轴向端部分别具有第一和第二开口。 第一和第二开口中的每一个进入中空腔。 主壁在其第一端处联接到侧壁并跨越第一开口。 主壁的中心与侧壁的纵向轴线对准。 主壁限定了相对于侧壁的纵向轴线大致垂直定向的平面。 第一和第二门通过主壁形成以进入中空腔。 第一和第二门限定位于主墙平面中的第一行。 主墙的中心位于第一和第二门之间的第一条线上。

公开(公告)号：US20150108623A1

公开(公告)日：2015-04-23

申请号：US14056930

申请日：2013-10-17

申请人： Seng Kiong Teng ,  Ly Hoon Khoo ,  Wen Shi Koh

发明人： Seng Kiong Teng ,  Ly Hoon Khoo ,  Wen Shi Koh

IPC分类号： H01L23/495

CPC分类号： H01L23/49586 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A lead frame includes a lead formed of a conductive material and having first and second ends, opposing first and second main surfaces, and opposing first and second side surfaces each extending between the first and second main surfaces. A polymeric layer is formed at least on the first main surface and the first and second side surfaces of the lead at least proximate the second end of the lead. An opening in the polymeric layer on the first main surface of the lead proximate the second end is provided for connecting the lead to, for example, a semiconductor die via a bond wire.

摘要翻译： 引线框架包括由导电材料形成的引线，其具有第一和第二端，相对的第一和第二主表面以及相对的第一和第二侧表面，每个在第一和第二主表面之间延伸。 至少在引线的第二端附近，至少在引线的第一主表面和引线的第一和第二侧表面上形成聚合物层。 提供靠近第二端的引线的第一主表面上的聚合物层中的开口，用于通过接合线将导线连接到例如半导体管芯。

公开(公告)号：US08987881B2

公开(公告)日：2015-03-24

申请号：US13938232

申请日：2013-07-10

申请人： Seng Kiong Teng ,  Ly Hoon Khoo ,  Navas Khan Oratti Kalandar

发明人： Seng Kiong Teng ,  Ly Hoon Khoo ,  Navas Khan Oratti Kalandar

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/28 ,  H01L23/00

CPC分类号： H01L23/4952 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/08 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/1405 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/45144 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48611 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/49113 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/81 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/85013 ,  H01L2224/85411 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/013 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2224/852 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a first substrate having opposing first and second main surfaces, a first die disposed on the first main surface of the first substrate, a first bond wire coupled to the first die, a first packaging material encapsulating the first die and the first bond wire, and a lead frame disposed on the first main surface of the first substrate and in electrical communication with the first bond wire. At least a portion of the lead frame extends outside of the packaging material. A top package includes first and second main surfaces and an electrical contact on the second main surface. The electrical contact is electrically connected to the lead frame and connects the top package to either the first die and/or external circuitry.

摘要翻译： 半导体器件包括具有相对的第一和第二主表面的第一衬底，设置在第一衬底的第一主表面上的第一裸片，耦合到第一裸片的第一接合线，封装第一裸片的第一封装材料和第一裸片 接合线，以及设置在第一基板的第一主表面上并与第一接合线电连通的引线框架。 引线框架的至少一部分延伸到包装材料的外部。 顶部包装包括第一和第二主表面以及第二主表面上的电接触。 电触点电连接到引线框架，并将顶部封装连接到第一管芯和/或外部电路。

公开(公告)号：US20150014834A1

公开(公告)日：2015-01-15

申请号：US13938232

申请日：2013-07-10

申请人： Seng Kiong Teng ,  Ly Hoon Khoo ,  Navas Khan Oratti Kalandar

发明人： Seng Kiong Teng ,  Ly Hoon Khoo ,  Navas Khan Oratti Kalandar

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/4952 ,  H01L23/145 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/08 ,  H01L24/10 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/08225 ,  H01L2224/131 ,  H01L2224/1405 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/45144 ,  H01L2224/48177 ,  H01L2224/48227 ,  H01L2224/48611 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/49113 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/81 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2224/8385 ,  H01L2224/85013 ,  H01L2224/85411 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1047 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2924/014 ,  H01L2924/013 ,  H01L2924/01046 ,  H01L2924/01083 ,  H01L2224/852 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a first substrate having opposing first and second main surfaces, a first die disposed on the first main surface of the first substrate, a first bond wire coupled to the first die, a first packaging material encapsulating the first die and the first bond wire, and a lead frame disposed on the first main surface of the first substrate and in electrical communication with the first bond wire. At least a portion of the lead frame extends outside of the packaging material. A top package includes first and second main surfaces and an electrical contact on the second main surface. The electrical contact is electrically connected to the lead frame and connects the top package to either the first die and/or external circuitry.

摘要翻译： 半导体器件包括具有相对的第一和第二主表面的第一衬底，设置在第一衬底的第一主表面上的第一裸片，耦合到第一裸片的第一接合线，封装第一裸片的第一封装材料和第一裸片 接合线，以及设置在第一基板的第一主表面上并与第一接合线电连通的引线框架。 引线框架的至少一部分延伸到包装材料的外部。 顶部包装包括第一和第二主表面以及第二主表面上的电接触。 电触点电连接到引线框架，并将顶部封装连接到第一管芯和/或外部电路。