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公开(公告)号：US20250054293A1
公开(公告)日：2025-02-13
申请号：US18718680
申请日：2022-11-29
Applicant: MEC COMPANY LTD.
Inventor： Masako AKAGI
Abstract: The physical property value prediction method include: inputting a plurality of prediction target images for each of which a measured value of the physical property value is known into a machine-learned prediction model, and outputting a predicted value and a feature map of each of the plurality of prediction target images; identifying, on a basis of prediction results from images almost identical in measured physical property value among the plurality of prediction target images, a poor prediction image and a good prediction image; and extracting a feature group representing a factor in poor prediction on a basis of a difference between a frequency distribution of a plurality of features constituting the feature map of the poor prediction image and a frequency distribution of a plurality of features constituting the feature map of the good prediction image.
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2.发明公开公开(公告)号：US20240270763A1
公开(公告)日：2024-08-15
申请号：US18411521
申请日：2024-01-12
Applicant: MEC COMPANY LTD.
Inventor： Koki MORIKAWA , Yuki Ogino , Jun Nishimine
CPC classification number: C07F7/1804 , B32B5/02 , B32B7/12 , B32B15/14 , B32B15/20 , C07D251/54 , C08J5/12 , B32B2260/021 , B32B2260/046 , B32B2262/101 , C08J2363/00
Abstract: Provided is a chemical compound represented by the general formula (A), in which each of substituents Q1 to Q6 is bonded to a nitrogen atom of melamine backbone. In the general formula (A), at least one of Q1 to Q6 is X, and at least one of Q1 to Q6 is Y. R1 is a hydrogen atom or an alkyl group having 1 to 12 carbon atoms. R2 is a hydrogen atom, or a monovalent hydrocarbon group selected from the group consisting of an alkyl group having 1 to 12 carbon atoms, an aryl group having 6 to 25 carbon atoms, and an aralkyl group having 7 to 30 carbon atoms. Each of R51 and R52 is a divalent organic group, and a is an integer of 1 to 3.
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公开(公告)号：US11230644B1
公开(公告)日：2022-01-25
申请号：US17188460
申请日：2021-03-01
Applicant: MEC COMPANY LTD.
Inventor： Koki Morikawa , Masahiro Hayashizaki , Motohiro Nakano , Masataka Araki
Abstract: Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.
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4.发明申请公开(公告)号：US20200325583A1
公开(公告)日：2020-10-15
申请号：US16753986
申请日：2018-10-11
Applicant: MEC COMPANY., LTD.
Inventor： Kenji Nisie , Yuki Oka , Tomoko Ichihashi , Takuto Fujii
Abstract: An object is to provide, for example, a method for manufacturing a film-forming substrate that can sufficiently improve both bleeding of a resin composition and adhesion between the resin composition and a metal substrate surface. For example, provided is a method for manufacturing a film-forming substrate having a film of a resin composition formed on a metal substrate surface, the method including: an etching step of etching a metal substrate surface with a micro-etching agent; a surface treatment step of bringing the etched metal substrate surface into contact with a surface treatment agent to perform a surface treatment such that a contact angle of water on the surface is 50° or more and 150° or less; and a film forming step of forming a film of a resin composition on the surface-treated metal substrate surface by an inkjet method.
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公开(公告)号：US09932678B2
公开(公告)日：2018-04-03
申请号：US15224825
申请日：2016-08-01
Applicant: MEC COMPANY LTD.
Inventor： Masayo Kurii , Kiyoto Tai , Mami Nakamura
CPC classification number: C23F1/18 , C23F1/34 , H05K3/0085 , H05K3/022 , H05K3/383 , H05K2203/0307 , H05K2203/0789
Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.
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Patent Agency Ranking
公开(公告)号：US20230407486A1
公开(公告)日：2023-12-21
申请号：US18036313
申请日：2021-09-30
Applicant: MEC COMPANY LTD.
Inventor： Yu FUKUI , Daisaku AKIYAMA , Dai NAKANE , Kenji NISHIE
Abstract: The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.
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公开(公告)号：US20220017755A1
公开(公告)日：2022-01-20
申请号：US17188460
申请日：2021-03-01
Applicant: MEC COMPANY LTD.
Inventor： Koki MORIKAWA , Masahiro HAYASHIZAKI , Motohiro NAKANO , Masataka ARAKI
Abstract: Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.
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8.发明授权公开(公告)号：US11208726B2
公开(公告)日：2021-12-28
申请号：US16646604
申请日：2018-08-20
Applicant: MEC COMPANY LTD.
Inventor： Yuki Ogino , Takahiro Sakamoto , Kaoru Urushibata
Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 μm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.
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9.发明申请公开(公告)号：US20200263308A1
公开(公告)日：2020-08-20
申请号：US16646604
申请日：2018-08-20
Applicant: MEC COMPANY LTD.
Inventor： Yuki OGINO , Takahiro SAKAMOTO , Kaoru URUSHIBATA
Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 μm or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.
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10.发明申请公开(公告)号：US20200157394A1
公开(公告)日：2020-05-21
申请号：US16611250
申请日：2018-03-02
Applicant: MEC COMPANY LTD.
Inventor： Itsuro TOMATSU , Kosuke KUMAZAKI , Yasutaka AMITANI , Yuko SHIBANUMA , Ikuyo KATAYAMA
IPC: C09J179/02 , B32B15/08 , B32B15/20 , B32B37/12 , C23C22/06 , C23C22/63 , C23C22/68 , C09J11/04 , C09J5/02 , H05K3/38
Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of −1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.
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