公开(公告)号：US11230644B1

公开(公告)日：2022-01-25

申请号：US17188460

申请日：2021-03-01

Applicant: MEC COMPANY LTD.

Inventor： Koki Morikawa ,  Masahiro Hayashizaki ,  Motohiro Nakano ,  Masataka Araki

IPC: C09D1/00 ,  B32B37/12 ,  B32B15/08 ,  B32B15/20

Abstract: Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.

公开(公告)号：US20180044801A1

公开(公告)日：2018-02-15

申请号：US15550752

申请日：2016-01-21

Applicant: MEC COMPANY LTD.

Inventor： Yuki Ogino ,  Mami Tojima ,  Masahiro Hayashizaki ,  Minoru Otani

IPC: C23F1/26 ,  C23F1/44

CPC classification number: C23F1/26 ,  C23F1/44 ,  H01L21/32133 ,  H05K3/108

Abstract: An object of the present invention is to provide: an etching liquid which is capable of etching titanium selectively in the presence of copper, and is further low in toxicity and excellent in storage stability; and an etching method using this etching liquid. The etching liquid of the present invention which is a liquid includes at least one acid selected from the group consisting of sulfuric acid, hydrochloric acid, and trichloroacetic acid, and at least one organic sulfur compound selected from the group consisting of a thioketone compound and a thioether compound, and makes it possible to etch titanium selectively in the presence of copper.