公开(公告)号：US20220017755A1

公开(公告)日：2022-01-20

申请号：US17188460

申请日：2021-03-01

Applicant: MEC COMPANY LTD.

Inventor： Koki MORIKAWA ,  Masahiro HAYASHIZAKI ,  Motohiro NAKANO ,  Masataka ARAKI

IPC: C09D1/00 ,  B32B37/12 ,  B32B15/08 ,  B32B15/20

Abstract: Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.