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公开(公告)号：US20230407486A1
公开(公告)日：2023-12-21
申请号：US18036313
申请日：2021-09-30
Applicant: MEC COMPANY LTD.
Inventor： Yu FUKUI , Daisaku AKIYAMA , Dai NAKANE , Kenji NISHIE
Abstract: The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.
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公开(公告)号：US20230232540A1
公开(公告)日：2023-07-20
申请号：US17998966
申请日：2021-11-16
Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , MEC COMPANY LTD.
Inventor： Shoichiro SAKAI , Ryuta OHSUKA , Koji NITTA , Yoshihito YAMAGUCHI , Masaharu YASUDA , Akira TSUCHIKO , Koji KASUYA , Kenji NISHIE , Yu FUKUI
CPC classification number: H05K3/103 , C22C19/05 , H05K1/0373 , H05K3/1258 , H05K2201/0212 , H05K2203/061 , H05K2203/176
Abstract: In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1) :
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.
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公开(公告)号：US20230212757A1
公开(公告)日：2023-07-06
申请号：US17998980
申请日：2021-11-16
Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , MEC COMPANY LTD.
Inventor： Ryuta OHSUKA , Koji NITTA , Shoichiro SAKAI , Yoshihito YAMAGUCHI , Masaharu YASUDA , Akira TSUCHIKO , Koji KASUYA , Kenji NISHIE , Yu FUKUI
Abstract: A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1):
where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.
