公开(公告)号：US5993591A

公开(公告)日：1999-11-30

申请号：US991128

申请日：1997-12-16

Applicant: Jesus S. Buendia ,  Katherine Gail Heinen ,  Gonzalo Amador ,  Leslie E. Stark

Inventor： Jesus S. Buendia ,  Katherine Gail Heinen ,  Gonzalo Amador ,  Leslie E. Stark

IPC: C08J7/00 ,  B29C35/04 ,  B29C35/08 ,  B29C35/16 ,  C09J5/00 ,  F26B3/28 ,  H01L21/00 ,  H01L21/52 ,  H01L21/58 ,  B32B31/26

CPC classification number: H01L24/83 ,  B29C35/08 ,  F26B3/283 ,  H01L21/67144 ,  H01L24/26 ,  H01L24/75 ,  B29C2035/1658 ,  B29C35/045 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/07802

Abstract: A method and system for curing a die attach material for attachment of a semiconductor die to a leadframe which includes a carrier receiving location for receiving at least one carrier(1) wherein each carrier contains at least one leadframe strip (3) therein, a die attach material (15) on the leadframe strip and a semiconductor die (13) on the die attach material. A heat source (5) is provided for radiating thermal energy to the carrier receiving location. A reflector (9) is disposed around the heat source and the carrier receiving location for reflecting thermal energy from the heat source to the carrier receiving location. A source of flowing cool gas (11) is provided in heat exchange relationship with the reflector for cooling the reflector while heating the gas. The heated gas is passed through the carrier receiving location to provide a source of heat by convection at the carrier receiving location and purge the carrier receiving location of volatiles. The heat source provides radiations principally in the range of from about 0.5.mu. to about 2.0.mu. and is preferably a tungsten halogen lamp. The heat source is controllable responsive to a function of the instantaneous temperature of the die attach material and the leadframe strip to control the intensity and profile of the heat source. Cooling air is optionally injected into the system upon completion of curing.

Abstract translation: 一种用于固化用于将半导体管芯附接到引线框架的管芯附接材料的方法和系统，其包括用于接收至少一个载体（1）的载体接收位置，其中每个载体在其中包含至少一个引线框条（3），模具 将引线框带上的材料（15）和芯片附接材料上的半导体管芯（13）连接。 提供热源（5）用于将热能辐射到载体接收位置。 反射器（9）围绕热源和载体接收位置设置，用于将热能从热源反射到载体接收位置。 以与反射器的热交换关系提供流动的冷气体源（11），用于在加热气体的同时冷却反射器。 加热的气体通过载体接收位置，以在载体接收位置处通过对流提供热源，并清除载体接收位置的挥发物。 热源提供主要在约0.5至约2.0μm的范围内的辐射，并且优选为卤钨灯。 响应于管芯附接材料和引线框条的瞬时温度的功能，热源是可控的，以控制热源的强度和轮廓。 在完成固化后，可选择地将冷却空气注入系统。

公开(公告)号：US06227353B1

公开(公告)日：2001-05-08

申请号：US09512846

申请日：2000-02-25

Applicant: Gonzalo Amador ,  Katherine Gail Heinen ,  Jessie Buendia ,  Leslie E. Stark ,  Chill Go

Inventor： Gonzalo Amador ,  Katherine Gail Heinen ,  Jessie Buendia ,  Leslie E. Stark ,  Chill Go

IPC: B65G1510

CPC classification number: H01L21/67115 ,  H01L21/67778

Abstract: A system for applying a rotary force to strips of varying widths. The system includes a plurality of adjacent tracks of progressively greater width, each of the tracks disposed at a height above all tracks of lesser width. A plurality of rotating members are provided, one rotating member extending into one of the tracks and extending to the surface of the associated track. An adjustable drive disc is adjusted to be disposed over a preselected one of the rotating members and is movable toward the rotating members to apply a rotary force to a strip disposed between the rotating member and the disc. Each of the tracks is defined by a pair of spaced apart surfaces with all of the rotating members being on a common rotating shaft.

Abstract translation: 用于将旋转力施加到不同宽度的条带上的系统。 该系统包括逐渐更大宽度的多个相邻轨道，每个轨道设置在高于所有较小宽度的轨道的高度处。 设置有多个旋转构件，一个旋转构件延伸到一个轨道中并延伸到相关轨道的表面。 可调节的驱动盘被调节以设置在预定的一个旋转构件中，并且可朝向旋转构件移动，以向设置在旋转构件和盘之间的条带施加旋转力。 每个轨道由一对间隔开的表面限定，所有旋转构件都在共同的旋转轴上。

公开(公告)号：US06226452B1

公开(公告)日：2001-05-01

申请号：US09213883

申请日：1998-12-17

Applicant: Paul Joseph Hundt ,  Katherine Gail Heinen ,  Kwan Yew Kee ,  Ming-Jang Hwang ,  Leslie E. Stark ,  Gonzalo Amador

Inventor： Paul Joseph Hundt ,  Katherine Gail Heinen ,  Kwan Yew Kee ,  Ming-Jang Hwang ,  Leslie E. Stark ,  Gonzalo Amador

IPC: A21B200

CPC classification number: H01L24/83 ,  H01L21/50 ,  H01L21/67115 ,  H01L21/67144 ,  H01L24/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29298 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/83805 ,  H01L2924/0001 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01054 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/157 ,  H01L2924/16152 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/0133 ,  H01L2924/01049 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: In integrated semiconductor manufacturing, semiconductor dies may be packaged in ceramic packages. Such packages typically have a base into which the semiconductor die is securedly placed and typically have a lead frame securedly attached to base so that electrical connection may be made to the semiconductor die. A halagen lamp radiant chamber significantly reduces the time it takes to attach the die and lead frame to the ceramic base while reducing particles commonly associated with open belt converyor furnaces.

Abstract translation: 在集成半导体制造中，半导体管芯可以封装在陶瓷封装中。 这样的封装通常具有基座，半导体管芯被固定地放置在其中，并且通常具有固定地附接到基座的引线框架，使得可以对半导体管芯进行电连接。 卤素灯辐射室显着减少了将模具和引线框架连接到陶瓷基座上所需的时间，同时减少通常与开放式带式熔融炉相关联的颗粒。

公开(公告)号：US5994169A

公开(公告)日：1999-11-30

申请号：US12753

申请日：1998-01-23

Applicant: Michael Anthony Lamson ,  Katherine Gail Heinen

Inventor： Michael Anthony Lamson ,  Katherine Gail Heinen

IPC: H01L23/495 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025

Abstract: A lead frame (10) is connected over an integrated circuit (40) by adhesives (42) and (44). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to provide identical capacitances. A metal shield may be provided on adhesives (42) and (44) to provide noise shielding for the integrated circuit (40).

Abstract translation: 引线框架（10）通过粘合剂（42）和（44）连接在集成电路（40）上。 为了提供相同的电容，引线框架（10）的每个引线导体（16）和（18）具有相同的几何面积。 可以在粘合剂（42）和（44）上提供金属屏蔽，以为集成电路（40）提供噪声屏蔽。

公开(公告)号：US06234296B1

公开(公告)日：2001-05-22

申请号：US09679146

申请日：2000-10-05

Applicant: Gonzalo Amador ,  Katherine Gail Heinen ,  Jessie Buendia ,  Leslie E. Stark ,  Chill Go

Inventor： Gonzalo Amador ,  Katherine Gail Heinen ,  Jessie Buendia ,  Leslie E. Stark ,  Chill Go

IPC: B65G1564

CPC classification number: H01L21/67115 ,  H01L21/67778

Abstract: A system for positioning a carrier relative to a travel path which includes a base having a pair of opposing side walls extending normal to the base and defining a path therebetween. A force applying device is disposed in one of the side walls and extends into the path for applying a force in the direction of the other side wall. A pair of rotatable eccentric members is secured to the other of the walls and extends into the path for selectively positioning a carrier between the eccentric members and the force applying device.

Abstract translation: 一种用于相对于行进路径定位载体的系统，该系统包括具有垂直于基座延伸并在其间限定路径的一对相对的侧壁的底座。 力施加装置设置在一个侧壁中并延伸到用于在另一侧壁的方向上施加力的路径中。 一对可旋转的偏心构件固定到另一个壁上并延伸到路径中，用于选择性地将载架定位在偏心构件和施力装置之间。

公开(公告)号：US6069342A

公开(公告)日：2000-05-30

申请号：US999062

申请日：1997-12-16

Applicant: Gonzalo Amador ,  Katherine Gail Heinen ,  Jessie Buendia ,  Leslie E. Stark ,  Chill Go

Inventor： Gonzalo Amador ,  Katherine Gail Heinen ,  Jessie Buendia ,  Leslie E. Stark ,  Chill Go

IPC: H01L21/00 ,  H01L21/677 ,  B65G25/08 ,  B65G1/06 ,  F27B9/38 ,  H01L21/52

CPC classification number: H01L21/67115 ,  H01L21/67778

Abstract: A method of curing a die attach material for a semiconductor device which includes providing a carrier containing a plurality of stacked leadframe strips, each leadframe strip with a die attach material thereon. One leadframe strip is ejected from the carrier, travels into a chamber and is centered therein. The leadframe strip is then heated and the die attach material is cured selective to the leadframe strip using a tungsten-halogen lamp. Simultaneously volatile products of the cure are exhausted from the chamber. The leadframe strip is then returned to its original position in the carrier, the carrier is elevated so that a different leadframe strip is in position for ejection from the carrier and is ejected.

Abstract translation: 一种固化用于半导体器件的管芯附着材料的方法，其包括提供包含多个堆叠的引线框条的载体，每个引线框带上具有管芯附接材料。 一个引线框带从载体中弹出，进入一个腔室并居中。 然后将引线框条加热，并且使用钨卤素灯对管芯附接材料选择性地固化到引线框条。 固化的同时挥发性产物从室中排出。 引线框带然后返回到其在载体中的原始位置，载体被升高，使得不同的引线框条在位置上用于从载体喷射并被弹出。

公开(公告)号：US6030859A

公开(公告)日：2000-02-29

申请号：US818730

申请日：1997-03-14

Applicant: Ichiro Anjoh ,  Gen Murakami ,  Michael Anthony Lamson ,  Katherine Gail Heinen

Inventor： Ichiro Anjoh ,  Gen Murakami ,  Michael Anthony Lamson ,  Katherine Gail Heinen

IPC: H01L23/50 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L23/4951 ,  H01L23/49541 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85207 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49121

Abstract: A lead frame for a semiconductor IC device has a pair of common elongated leads and first and second groups of slender leads arranged on opposite sides of the common elongated leads and generally extending transverse to the common elongated leads. The common elongated leads have as their integral parts slender leads extending therefrom generally transverse thereto and substantially linear extensions from both ends of the common elongated leads. The linear extensions serve to firmly support a semiconductor chip to be packaged along with parts of the leads. The common elongated leads may further have as their integral parts projections extending from their sides for enhancement of the heat dissipation capability. A semiconductor chip may have bonding pads arranged thereon such that bonding wires and the common elongated leads do not cross each other for electrical connection between the common elongated leads and bonding pads of the semiconductor chip.

Abstract translation: 用于半导体IC器件的引线框架具有一对公共细长引线和布置在公共细长引线的相对侧上的第一和第二组细长引线，并且通常横向于公共细长引线延伸。 共同的细长引线具有作为它们的整体部分的细长引线，其大致横向延伸，并且从公共细长引线的两端基本上线性延伸。 线性扩展件用于牢固地支撑要与引线的一部分一起封装的半导体芯片。 共同的细长引线还可以具有作为它们的一体部分的突起从其侧面延伸以增强散热能力。 半导体芯片可以具有布置在其上的接合焊盘，使得接合线和公共细长引线彼此不交叉以在公共细长引线和半导体芯片的接合焊盘之间进行电连接。

公开(公告)号：US5840599A

公开(公告)日：1998-11-24

申请号：US330171

申请日：1994-10-27

Applicant: Michael Anthony Lamson ,  Katherine Gail Heinen

Inventor： Michael Anthony Lamson ,  Katherine Gail Heinen

IPC: H01L23/495 ,  H01L23/552 ,  H01L23/58 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L23/552 ,  H01L23/585 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/85399 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10S438/926 ,  Y10T29/49121

Abstract: A process for manufacturing a lead frame (10) connected over an integrated circuit (40) by adhesives (42) and (44). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to provide identical capacitances. A metal shield may be provided on adhesives (42) and (44) to provide noise shielding for the integrated circuit (40).

Abstract translation: 一种制造通过粘合剂（42）和（44）连接在集成电路（40）上的引线框架（10）的方法。 为了提供相同的电容，引线框架（10）的每个引线导体（16）和（18）具有相同的几何面积。 可以在粘合剂（42）和（44）上提供金属屏蔽，以为集成电路（40）提供噪声屏蔽。

公开(公告)号：US5650915A

公开(公告)日：1997-07-22

申请号：US660386

申请日：1996-06-07

Applicant: Rafael Cesar Alfaro ,  Katherine Gail Heinen ,  Paul Joseph Hundt

Inventor： Rafael Cesar Alfaro ,  Katherine Gail Heinen ,  Paul Joseph Hundt

IPC: H01L21/50 ,  H01L23/057 ,  H01L23/14 ,  H01L23/367 ,  H01L23/433 ,  H05K7/20

CPC classification number: H01L23/057 ,  H01L21/50 ,  H01L23/142 ,  H01L23/3675 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2924/01079 ,  H01L2924/16195

Abstract: The present invention provides a thermally enhanced molded cavity package (10) having a package body (12) with upper (40) and lower (42) sections. The package body (12) has a cavity (22) with the cavity opening (32) in the upper section (40) of the package body (12). The present package (10) includes a lead frame (14) with a plurality of individual leads (16) that are external to the cavity (22) and a plurality of lead fingers (28) that are internal to the cavity (22). The present package (10) also includes a heat spreader (34) for increasing heat dissipation from the package (10) in the lower section (42) of the package body (12) and coupled to the lead frame (14). The heat spreader (34) has a first surface (26) forming a floor of the cavity upon which a microcircuit chip (24) may be mounted and a second surface forming a base (36) of the package body (12). The upper section (40) of the package body (12) includes a lid seat (33) for supporting a lid (30) and for maintaining the lid (30) parallel to the floor (26) of the cavity when the lid (30) is placed in the cavity opening (32).

Abstract translation: 本发明提供一种具有上部（40）和下部（42）部分的封装主体（12）的热增强模制腔封装（10）。 包装体（12）具有在包装体（12）的上部（40）中具有空腔开口（32）的空腔（22）。 本封装（10）包括引线框架（14），其具有在空腔（22）的外部的多个单独引线（16）和在空腔（22）内部的多个引线指（28）。 本包装（10）还包括散热器（34），用于增加从封装体（12）的下部（42）中的封装（10）的散热并耦合到引线框架（14）。 散热器（34）具有第一表面（26），其形成空腔的底板，微型电路芯片（24）可以安装在该底板上，第二表面形成封装主体（12）的基座（36）。 包装体（12）的上部（40）包括用于支撑盖（30）的盖座（33），并且当盖（30）和盖（30）平行于空腔的地板 ）放置在空腔开口（32）中。

公开(公告)号：US5648299A

公开(公告)日：1997-07-15

申请号：US658128

申请日：1996-06-04

Applicant: Ichiro Anjoh ,  Gen Murakami ,  Michael Anthony Lamson ,  Katherine Gail Heinen

Inventor： Ichiro Anjoh ,  Gen Murakami ,  Michael Anthony Lamson ,  Katherine Gail Heinen

IPC: H01L23/50 ,  H01L23/495 ,  H01L21/60

CPC classification number: H01L23/4951 ,  H01L23/49541 ,  H01L23/49568 ,  H01L24/06 ,  H01L24/83 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05647 ,  H01L2224/06136 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/73215 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2224/85207 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  Y10T29/49121

Abstract: A lead frame for a semiconductor IC device has a pair of common elongated leads and first and second groups of slender leads arranged on opposite sides of the common elongated leads and generally extending transverse to the common elongated leads. The common elongated leads have as their integral parts slender leads extending therefrom generally transverse thereto and substantially linear extensions from both ends of the common elongated leads. The linear extensions serve to firmly support a semiconductor chip to be packaged along with parts of the leads. The common elongated leads may further have as their integral parts projections extending from their sides for enhancement of the heat dissipation capability. A semiconductor chip may have bonding pads arranged thereon such that bonding wires and the common elongated leads do not cross each other for electrical connection between the common elongated leads and bonding pads of the semiconductor chip.

Abstract translation: 用于半导体IC器件的引线框架具有一对公共细长引线和布置在公共细长引线的相对侧上的第一和第二组细长引线，并且通常横向于公共细长引线延伸。 共同的细长引线具有作为它们的整体部分的细长引线，其大致横向延伸，并且从公共细长引线的两端基本上线性延伸。 线性扩展件用于牢固地支撑要与引线的一部分一起封装的半导体芯片。 共同的细长引线还可以具有作为它们的一体部分的突起从其侧面延伸以增强散热能力。 半导体芯片可以具有布置在其上的接合焊盘，使得接合线和公共细长引线彼此不交叉以在公共细长引线和半导体芯片的接合焊盘之间进行电连接。