公开(公告)号：US10723032B2

公开(公告)日：2020-07-28

申请号：US14136548

申请日：2013-12-20

Applicant: The Gillette Company

Inventor： Xiandong Wang ,  Neville Sonnenberg

IPC: B26B21/60 ,  C08J7/00 ,  B26B21/58

Abstract: The invention discloses utilizing isostatic-press (IP) processes apply a polymeric material (e.g, a PTFE foil) to uncoated razor blade edges forming thin, dense, and uniform coatings on blade edges which in turn exhibit low initial cutting forces correlating with more comfortable shaves. The isostatic press may be a hot isostatic press (HIP) or a cold isostatic press (CIP) or any other isostatic press process. The HIP conditions may include an environment of elevated temperatures and pressures in an inert atmosphere. The CIP conditions may include room temperature and elevated pressure. The polymeric material may be a fluoropolymer or non-fluoropolymeric material or any composite thereof. The lower surface of the polymeric material may be modified (e.g., chemical etching) to enhance adhesion to the blade edge. Two or more layers of polymeric material of similar or different properties may be isostatically pressed onto the uncoated blades.

公开(公告)号：US10370462B2

公开(公告)日：2019-08-06

申请号：US15316083

申请日：2015-06-02

Applicant: SOLVAY SPECIALTY POLYMERS ITALY S.P.A.

Inventor： Pasqua Colaianna ,  Valeriy Kapelyushko ,  Mattia Bassi ,  Marco Mirenda ,  Vincenzo Arcella

IPC: C08L27/18 ,  C08J7/00 ,  C08F6/00 ,  B29C71/02 ,  C08F214/26 ,  C08F6/28 ,  B29C35/04

Abstract: The invention mainly pertains to a method for heat treating a composition [composition (C)] which contains at least one melt-processible perfluoropolymer [polymer (F)] formed of tetrafluoroethylene (TFE) copolymer with one or more perfluorinated comonomers [comonomer (F)] containing at least one unsaturation of ethylene type in amounts from 0.5% to 13% by weight, preferably from 0.6% to 11% by weight, and more preferably from 0.8% to 9% by weight; said polymer (F) possessing reactive end groups comprising at least one of the group consisting of hydrogen atoms, oxygen atoms and ethylenically unsaturated double bonds in an amount of at least 4.5 mmol/kg, the process comprising at least the step of heat-treating the composition (C) at a temperature of at least 260° C.

公开(公告)号：US10336976B2

公开(公告)日：2019-07-02

申请号：US15303930

申请日：2015-04-10

Applicant: TOKYO OHKA KOGYO CO., LTD.

Inventor： Takahiro Senzaki

IPC: G03F7/031 ,  G03F7/028 ,  C12M3/00 ,  C12M1/00 ,  B29C41/12 ,  C08F2/46 ,  C08J7/00 ,  B29C35/00 ,  B29C35/08 ,  B29C41/00 ,  B29C41/42 ,  B29C71/00 ,  B29C71/04 ,  B29D7/00 ,  B29K33/04 ,  B29K67/00 ,  B29K71/00 ,  B29L7/00

Abstract: A photosensitive resin composition for cell culture substrates that enables the low-cost manufacture of a cell culture substrate, that can easily form patterns of various shapes when providing a pattern on the surface of a cell culture substrate, has low cytotoxicity, and that can form a cell culture substrate; a cell culture substrate that is formed using the photosensitive resin composition; and a cell culture substrate manufacturing method that uses the photosensitive resin composition. The photosensitive resin composition includes a photopolymerizable monomer and a photopolymerization initiator. The photopolymerizable monomer contains a defined amount of a polyfunctional monomer that is at least trifunctional, and the content of the photopolymerization initiator is within a prescribed range.

公开(公告)号：US10233204B2

公开(公告)日：2019-03-19

申请号：US15234014

申请日：2016-08-11

Applicant: Guangdong Guangshan New Materials Co., Ltd.

Inventor： Qingchong Pan

IPC: C07F9/659 ,  C08J7/00 ,  C09K21/12 ,  C07F9/6593 ,  C08K5/5399 ,  C08J5/24

Abstract: The present invention relates to a phosphazene compound and a composite metal laminate. The phosphazene compound with a partial structure of carboxylic esters has a structure as shown in Formula (I). The present invention obtains a phosphazene compound with a partial structure of carboxylic esters using an M group having specific components. The cured products of the phosphazene compound have good flame retardancy, heat resistance, mechanical properties, flame retardancy, and low dielectric constant, and are a low dielectric flame retardant material having great economic properties and being environmental friendly.

公开(公告)号：US20180341044A1

公开(公告)日：2018-11-29

申请号：US16053865

申请日：2018-08-03

Applicant: Johnson & Johnson Vision Care, Inc.

Inventor： Charles W. Scales ,  Kevin P. McCabe ,  Brent Matthew Healy

IPC: G02B1/04 ,  B82Y30/00 ,  C08J7/00 ,  C08F293/00 ,  C08L53/00 ,  C08L101/14 ,  C08L83/04 ,  C08L81/00

Abstract: Provided are compositions comprising a block copolymer of the following formula: [A]-B-[Q], wherein [A] is a polymer that has an affinity for a substrate; B is a linking group comprising an optionally-substituted, polyvalent linking group having a molecular weight of no more than 1000 g/mole; and [Q] comprises a semi-crosslinked, ungelled polymer derived from copolymerization of an ethylenically unsaturated monomer with a poly-functional ethylenically unsaturated monomer. Such block copolymers are cross-linked via the [Q] segment, but not macroscopically gelled. The [Q] segment is hydrophilic and has a degree of polymerization in the range of about 10 to about 10,000. The [A] segment is located on at least one terminal end of said block copolymer, comprises between about 1 and about 200 repeating units. The block copolymer is associated, via the linear substrate associative segment with a surface comprising at least one hydrophobic site, such as a silicone hydrogel. The polymers may be incorporated into a formulation from which the silicone hydrogel is made or may be contacted with the silicone hydrogel post-formation.

公开(公告)号：US09982664B2

公开(公告)日：2018-05-29

申请号：US14815467

申请日：2015-07-31

Applicant: TEL FSI, Inc.

Inventor： William P. Inhofer ,  Lance Van Elsen

IPC: C23F1/00 ,  F04B23/04 ,  C08J7/00 ,  B05B11/00 ,  B81C1/00 ,  F04B19/00 ,  H01L21/306

CPC classification number: F04B23/04 ,  B05B11/3032 ,  B81C1/00539 ,  C08J7/00 ,  F04B19/006 ,  H01L21/30604

Abstract: The disclosure relates to systems and methods for metering a dose volume of fluid that may be used to treat microelectronic substrates. The system enables precision dispensing of relatively small amounts of a liquid chemical into a chemical bath or processing chamber for microelectronic substrates. The dispensing device may include a fluid conduit with a plurality of actuation devices that may limit fluid communication between the actuation devices and store a portion of the fluid in expandable membrane. The actuation devices may push or pull the fluid within the fluid conduit when the expandable membrane expands or contracts. The configuration and operation of the actuation devices may enable the collection, isolation, and dispensing of the dose volume.

公开(公告)号：US09982101B2

公开(公告)日：2018-05-29

申请号：US15145821

申请日：2016-05-04

Applicant: HANGZHOU FREETRON INDUSTRIAL CO., LTD.

Inventor： Ming Xie ,  Kaixiang Shu

IPC: C08J5/12 ,  C08J3/24 ,  B65D43/00 ,  C08J7/00 ,  C09J5/02 ,  C09J5/06 ,  B29C65/48 ,  B29C65/00 ,  B29L31/56 ,  B29C65/02

CPC classification number: C08J5/12 ,  B29C65/02 ,  B29C65/48 ,  B29C66/028 ,  B29C66/612 ,  B29C66/71 ,  B29C66/7392 ,  B29C66/919 ,  B29C66/949 ,  B29L2031/565 ,  B65D43/00 ,  C08J3/247 ,  C08J7/00 ,  C08J2323/06 ,  C08J2323/12 ,  C08J2383/04 ,  C09J5/02 ,  C09J5/06 ,  C09J2423/046 ,  C09J2423/048 ,  C09J2423/106 ,  C09J2423/108 ,  C09J2483/006 ,  B29K2083/00 ,  B29K2023/12 ,  B29K2023/06

Abstract: This invention discloses a method to fuse silicone and thermoplastic resin, comprising the following steps: Step A: conducting treatment twice on thermoplastic resin lid upon molding in plasma equipment under normal temperature, and opening the inert molecular chain of thermoplastic resin; wherein the power for treating the thermoplastic resin lid ranges 500 to 800 W, the time of treatment ranges from 5 s to 60 s; Step B: applying glue on the place for laying silicone gasket on thermoplastic resin lid, baking in the oven for 15-20 min; Step C: putting the treated thermoplastic resin lid and silicone gasket in step B into the over mold for encapsulation, the time of which is 2-3 min; conducting post vulcanization for 2 h after completing the encapsulation.

公开(公告)号：US09371427B2

公开(公告)日：2016-06-21

申请号：US14636034

申请日：2015-03-02

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Katsutoshi Kobayashi ,  Yusuke Kasahara ,  Hiroki Yonemitsu ,  Hitoshi Kubota ,  Ayako Kawanishi

IPC: C23F1/00 ,  C08J7/00 ,  B81C1/00 ,  C23F4/00

CPC classification number: C23F1/00 ,  B81C1/00396 ,  C23F4/00 ,  G03F7/0002

Abstract: A pattern is formed by forming a first pattern on a first film, forming a block copolymer layer including a first block chain and a second block chain on the first pattern, forming a second pattern, forming a second film on the second pattern, selectively removing the second film until the second pattern is exposed, forming a third pattern, and processing the first film using the third pattern as a mask. The second pattern is formed by microphase-separating the block copolymer layer, and removing the first block chain or the second block chain. The second film is formed by applying a material having an etch rate that is less than an etch rate of a material of the first pattern and the second pattern. The third pattern is formed by selectively removing the second pattern and the first pattern using the second film as a mask.

Abstract translation: 通过在第一膜上形成第一图案形成图案，在第一图案上形成包含第一嵌段链和第二嵌段链的嵌段共聚物层，形成第二图案，在第二图案上形成第二膜，选择性地除去 直到第二图案曝光的第二膜，形成第三图案，并且使用第三图案作为掩模来处理第一膜。 第二图案通过微相分离嵌段共聚物层并除去第一嵌段链或第二嵌段链形成。 通过施加具有小于第一图案和第二图案的材料的蚀刻速率的蚀刻速率的材料来形成第二膜。 通过使用第二膜作为掩模选择性地去除第二图案和第一图案来形成第三图案。

公开(公告)号：US09120293B2

公开(公告)日：2015-09-01

申请号：US13582214

申请日：2011-03-31

Applicant: Reona Yokota ,  Koichi Shibayama ,  Akihiro Uenishi ,  Hidenobu Deguchi ,  Tomoki Kunikawa ,  Tatsushi Hayashi

Inventor： Reona Yokota ,  Koichi Shibayama ,  Akihiro Uenishi ,  Hidenobu Deguchi ,  Tomoki Kunikawa ,  Tatsushi Hayashi

IPC: B32B5/16 ,  B32B27/20 ,  B32B27/38 ,  C08J7/00 ,  G11B5/64 ,  B32B15/092 ,  C08G59/40 ,  C08G59/42 ,  C08G59/62 ,  C08G59/68 ,  C08L63/00 ,  C08K3/36

CPC classification number: B32B15/092 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/38 ,  B32B2264/102 ,  B32B2307/538 ,  C08G59/4014 ,  C08G59/42 ,  C08G59/621 ,  C08G59/686 ,  C08J7/00 ,  C08K3/36 ,  C08L63/00 ,  Y10T428/259 ,  Y10T428/268 ,  C08L71/12

Abstract: A preliminary-cured material permits reduced surface roughness of a roughening-treated surface, and increase of an adhesive strength between a cured object and a metal layer. The preliminary-cured material is obtained by advancing curing of an epoxy resin material that contains an epoxy resin, a curing agent, and a silica. The preliminary-cured material includes a first principal surface to be roughening-treated, and a second principal surface. The silica includes a first small particle-diameter silica whose particle diameter is not smaller than 0.01 μm but smaller than 0.5 μm, and a second large particle-diameter silica whose particle diameter is not smaller than 0.5 μm but not larger than 20 μm. The first small particle-diameter silica is localized to exist in large quantity on a side of the first principal surface, and the second large particle-diameter silica is localized to exist in large quantity on a side of the second principal surface.

Abstract translation: 预固化材料允许粗糙化处理的表面的表面粗糙度降低，并且增加固化物体和金属层之间的粘合强度。 预固化材料是通过使包含环氧树脂，固化剂和二氧化硅的环氧树脂材料进行固化而得到的。 预固化材料包括待粗化处理的第一主表面和第二主表面。 二氧化硅包括粒径不小于0.01μm但小于0.5μm的第一小粒径二氧化硅和粒径不小于0.5μm但不大于20μm的第二大粒径二氧化硅。 第一小粒径二氧化硅被定位成大量存在于第一主表面的一侧，第二大颗粒直径二氧化硅在第二主表面的一侧大量存在。

公开(公告)号：US08765862B2

公开(公告)日：2014-07-01

申请号：US13581800

申请日：2011-02-08

Applicant: Yasufumi Matsumura ,  Ryuzo Shinta ,  Yasushi Enomoto

Inventor： Yasufumi Matsumura ,  Ryuzo Shinta ,  Yasushi Enomoto

IPC: C08J7/00 ,  C08J7/12 ,  C08J7/14 ,  C08K3/08 ,  C08L79/08

CPC classification number: C08J7/00 ,  B22F9/20 ,  C08G73/1042 ,  C08G73/1067 ,  C08J7/08 ,  C08J7/14 ,  C08K3/08 ,  C08L79/08 ,  C09D5/30 ,  C09D5/32 ,  C09D7/69 ,  C22C1/1026 ,  C22C32/0094 ,  C22C2001/1089 ,  C23C18/08 ,  H01B1/22 ,  Y10S977/778 ,  Y10S977/90

Abstract: A metal nanoparticle composite is provided, in which a matrix resin layer and metal nanoparticles are immobilized on the matrix resin layer. The metal nanoparticle composite has the following characteristics: a) the metal nanoparticles are obtained by heat-reducing metal ions or metal salts contained in the matrix resin layer or a precursor resin layer thereof; b) the metal nanoparticles exist within a region from the surface of the matrix resin layer to a depth of at least 50 nm; c) particle diameters of the metal nanoparticles are in the range of 1 nm to 100 nm with the mean particle diameter of greater than and equal to 3 nm; and d) a spacing between adjacent metal nanoparticles is greater than and equal to the particle diameter of a larger one of the adjacent metal nanoparticles.

Abstract translation: 提供了一种金属纳米颗粒复合材料，其中将基体树脂层和金属纳米颗粒固定在基体树脂层上。 金属纳米粒子复合体具有以下特征：a）金属纳米粒子是通过将金属离子或基体树脂层中含有的金属盐或其前体树脂层进行还原而得到的， b）金属纳米粒子存在于从基体树脂层的表面到至少50nm的深度的区域内; c）金属纳米粒子的粒径在1nm〜100nm的范围内，平均粒径大于等于3nm; 和d）相邻的金属纳米颗粒之间的间距大于并且等于较大的相邻金属纳米颗粒的粒径。