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公开(公告)号：US20110267084A1
公开(公告)日：2011-11-03
申请号：US12770948
申请日：2010-04-30
CPC分类号： G01R31/2884 , G01R31/2874
摘要： Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115° C. without staining or leaving residue on the device under test after baking.
摘要翻译： 用于测试结构和使用方法的非腐蚀性热界面材料。 测试结构包括散热器，用于从被测设备中散热。 测试结构还包括设置在散热器和被测器件之间的非腐蚀性热界面材料。 非腐蚀性热界面材料能够耐受至少60分钟的测试条件至少115℃，而不会在烘烤后在被测设备上污染或留下残留物。
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公开(公告)号：US07908906B2
公开(公告)日：2011-03-22
申请号：US11468089
申请日：2006-08-29
申请人： Govindarajan Natarajan , Emmanuel Delamarche , Eric A Eckberg , James N Humenik , Kathleen A McGroddy-Goetz , Scott Partington , Christopher F Perrera , Marco G Trivella , Timothy M Wiwel
发明人： Govindarajan Natarajan , Emmanuel Delamarche , Eric A Eckberg , James N Humenik , Kathleen A McGroddy-Goetz , Scott Partington , Christopher F Perrera , Marco G Trivella , Timothy M Wiwel
IPC分类号： G01N13/04
CPC分类号： G01N13/04 , A61B2010/0067
摘要： An apparatus, system and method for determining the osmolarity of a fluid. The system includes an apparatus having: a chip with a substantially planar top surface; a first circuit portion and a second circuit portion, each having a plurality of redundant electrically conductive lines disposed on the top surface; and a gap disposed between the first circuit portion and the second circuit portion, wherein a circuit is created when a fluid sample bridges the gap and connects the first circuit portion and the second circuit portion.
摘要翻译： 用于测定流体渗透压的装置，系统和方法。 该系统包括具有：具有基本平坦的顶表面的芯片的装置; 第一电路部分和第二电路部分，每个具有设置在顶表面上的多个冗余导电线; 以及设置在第一电路部分和第二电路部分之间的间隙，其中当流体样品桥接间隙并连接第一电路部分和第二电路部分时产生电路。
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3.发明授权公开(公告)号：US06742530B2
公开(公告)日：2004-06-01
申请号：US10294236
申请日：2002-11-14
IPC分类号： B08B308
CPC分类号： H01L21/02063 , B23K35/025 , C11D7/263 , C11D11/0047 , C11D11/007 , C23G5/032 , H05K3/1233 , H05K3/26 , Y10S134/902
摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。
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4.发明授权公开(公告)号：US08297222B2
公开(公告)日：2012-10-30
申请号：US11931096
申请日：2007-10-31
申请人： Thomas Weiss , James N Humenik , Mark J LaPlante , David C Long
发明人： Thomas Weiss , James N Humenik , Mark J LaPlante , David C Long
CPC分类号： B05C11/1034 , H05K1/092 , H05K3/1241 , H05K2203/0126
摘要： A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet. The method then provides for retracting the punch until the punch face is substantially coplanar with the orifice member second surface, and then cleaning the punch face and coplanar orifice member second surface to remove any residual paste thereon.
摘要翻译： 一种从分配装置将可流动的导电膏分配到毛坯上的方法，该分配装置包括具有第一表面和第二表面的孔口构件和在其之间的孔，在邻近孔口构件第一表面的加压室和含有该糊料的冲头， 面可通过孔口构件孔移动。 该方法包括将冲头定位在孔口构件孔的外部，使得冲头表面与孔构件第一表面间隔开，将期望量的浆料流动到冲头表面上，通过孔口构件孔移动冲压面上的浆料，直到 冲头面延伸超过孔口构件第二表面，并且在仍然在冲压面上的同时使工件与浆料接触以将浆料沉积在毛坯上。 该方法然后提供回缩冲头，直到冲头表面与孔口构件第二表面基本共面，然后清洁冲头面和共面孔构件第二表面以去除其上的残留糊料。
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5.发明授权公开(公告)号：US06569252B1
公开(公告)日：2003-05-27
申请号：US09609283
申请日：2000-06-30
IPC分类号： C23G502
CPC分类号： H01L21/02063 , B23K35/025 , C11D7/263 , C11D11/0047 , C11D11/007 , C23G5/032 , H05K3/1233 , H05K3/26 , Y10S134/902
摘要： A process of cleaning of objects that relate to semiconductor fabrication processes, such as, for example, conductive paste screening in the production of multilayer ceramic substrates and composite solder paste by stencil printing in electronic circuit assembly. Specifically, the process removes a metal/polymer composite paste from screening masks and associated paste making and processing equipment used in printing conductive metal pattern onto ceramic green sheet in the fabrication of semiconductor packaging substrates. The process also cleans solder paste residue from stencil printing equipment used in electronic module assembly surface mount technology for SMT discretes, solder column attachment, and BGA (Ball Grid Array) attachment on ceramic chip carrier or for screening solder paste onto printed circuit board. More particularly, paste residue is cleaned from metal, ceramic, and plastic substrates by a non-alkaline semi-aqueous cleaning method employing high boiling propylene glycol alkyl ether or mixtures of propylene glycol alkyl ether and propylene glycol solvents.
摘要翻译： 清洁与半导体制造工艺有关的物体的过程，例如通过在电子电路组件中的模版印刷生产多层陶瓷衬底中的导电糊料和复合焊膏。 具体地说，该方法在半导体封装衬底的制造中，将金属/聚合物复合糊剂从掩模掩模和用于印刷导电金属图案的相关糊剂制造和加工设备移除到陶瓷生片上。 该工艺还可以将陶瓷芯片载体上用于SMT离散，焊料柱附件和BGA（球栅阵列）附件的电子模块组件表面贴装技术中使用的模版印刷设备的焊膏残留物清理或用于将焊膏屏蔽到印刷电路板上。 更具体地，通过使用高沸点丙二醇烷基醚或丙二醇烷基醚和丙二醇溶剂的混合物的非碱性半水洗涤方法，从金属，陶瓷和塑料基材中清除糊状残余物。
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公开(公告)号：US06528145B1
公开(公告)日：2003-03-04
申请号：US09606359
申请日：2000-06-29
申请人： Daniel George Berger , Shaji Farooq , Lester Wynn Herron , James N. Humenik , John Ulrich Knickerbocker , Robert William Pasco , Charles H. Perry , Krishna G. Sachdev
发明人： Daniel George Berger , Shaji Farooq , Lester Wynn Herron , James N. Humenik , John Ulrich Knickerbocker , Robert William Pasco , Charles H. Perry , Krishna G. Sachdev
IPC分类号： G02B600
CPC分类号： H05K1/0373 , H01L21/4857 , H01L23/49894 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0306 , H05K3/4611 , H05K2201/0129 , H05K2201/0141 , H05K2201/015 , H05K2201/0154 , H05K2201/0209 , H05K2201/0212 , H05K2201/068 , Y10S428/901 , Y10T428/24273 , Y10T428/24479 , Y10T428/24917 , Y10T428/24942 , Y10T428/249955 , Y10T428/249956 , Y10T428/251 , Y10T428/254 , Y10T428/259 , H01L2924/00
摘要： A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.
摘要翻译： 包括聚合物和陶瓷材料的复合电子和/或光学基底，其中复合基底具有小于4的介电常数和8-14ppm /℃的热膨胀系数。 在100℃下。复合衬底可以是陶瓷填充的聚合材料或聚合物填充的陶瓷材料。
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公开(公告)号：US06277799B1
公开(公告)日：2001-08-21
申请号：US09344886
申请日：1999-06-25
IPC分类号： C11D172
CPC分类号： C11D11/0047 , C11D1/008 , C11D1/02 , C11D1/24 , C11D1/29 , C11D1/66 , C11D1/662 , C11D1/72 , C11D1/88 , C11D1/90 , C11D3/2086 , H05K3/1216 , H05K3/26
摘要： This invention relates to an aqueous cleaning method for removal of metal-organic composite paste residue from the surface of components, such as, screening masks, associated paste screening equipment, substrates, to name a few. The invention is particularly concerned with aqueous alkaline cleaning solutions comprising alkali metal salt and/or quaternary ammonium salt of an organic acid preferably &agr;-hydroxy carboxylic acid in the presence of excess alkali and optionally a surface active agent for use in cleaning components, such as, screening masks, associated screening equipment, substrates, etc., which are used in the production of electronic components.
摘要翻译： 本发明涉及从组分表面除去金属 - 有机复合糊状残留物的水性清洗方法，例如筛选掩模，相关的糊状物筛选设备，底物等等。 本发明特别涉及含有碱金属盐和/或季铵盐的含水碱性清洗溶液，所述碱性金属盐和/或有机酸优选为α-羟基羧酸的季铵盐，所述碱性金属盐和/或季铵盐在过量碱和任选的表面活性剂存在下用于清洁组分，例如 ，筛选掩模，相关筛选设备，基材等，用于生产电子元件。
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公开(公告)号：US5277725A
公开(公告)日：1994-01-11
申请号：US881448
申请日：1992-05-11
申请人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
发明人： John Acocella , Peter A. Agostino , Arnold I. Baise , Richard A. Bates , Ray M. Bryant , Jon A. Casey , David R. Clarke , George Czornyj , Allen J. Dam , Lawrence D. David , Renuka S. Divakaruni , Werner E. Dunkel , Ajay P. Giri , Liang-Choo Hsia , James N. Humenik , Steven M. Kandetzke , Daniel P. Kirby , John U. Knickerbocker , Sarah H. Knickerbocker , Anthony Mastreani , Amy T. Matts , Robert W. Nufer , Charles H. Perry , Srinivasa S. N. Reddy , Salvatore J. Scilla , Mark A. Takacs , Lovell B. Wiggins
IPC分类号： H05K1/03 , C04B41/48 , C04B41/49 , H01L21/48 , H01L23/08 , H01L23/538 , H05K3/40 , C04B37/00 , B05D5/12
CPC分类号： H01L21/4857 , C04B41/488 , C04B41/4961 , H01L23/5383 , H05K3/4061 , C04B2111/00672 , C04B2111/00844 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H05K1/0306 , H05K2201/09581 , H05K2203/1147 , H05K2203/308
摘要： The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable cracks with a flexible material. Uniform gaps between the metal and dielectric materials can similarly be filled with flexible materials to provide stress relief, bulk compressibility and strength to the package. Furthermore, a permeable, skeletal dielectric can be fabricated as a fired, multilayer structure having sintered metallurgy and subsequently infused with a flexible, temperature-stable material to provide hermeticity and strength.
摘要翻译： 在金属的热循环过程中经历的裂纹：电介质半导体封装是由热膨胀系数不匹配引起的。 与这种开裂相关的非气密性可以通过用柔性材料回填可渗透裂缝来解决。 金属和电介质材料之间的均匀间隙可以类似地填充柔性材料，以提供应力消除，体积可压缩性和包装的强度。 此外，可渗透的骨架电介质可以被制造为具有烧结冶金的烧结多层结构，并随后注入柔性的温度稳定的材料以提供气密性和强度。
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9.发明授权Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate 失效用于将互连针钎焊到位于脆性电介质基底上的金属化图案的方法
公开(公告)号：US4672739A
公开(公告)日：1987-06-16
申请号：US721885
申请日：1985-04-11
CPC分类号： H01L21/4853 , Y10T29/49149 , Y10T428/12542
摘要： A method for use in brazing an interconnect pin to a portion of metallization pattern (e.g. a pad) existing on a brittle dielectric substrate, such as a multi-layered ceramic (MLC) substrate, is disclosed. A dielectric layer is formed with appropriate annular openings. Each opening provides a closed containment wall, which extends around and above the pad, to hold the brazing alloy. Each circular containment wall is concentrically aligned with its associated pad and exposes an area, of each pad, having a smaller diameter than that of the entire pad. The containment walls serve to prevent the brazing alloy from coming into contact with any edge of the pads.
摘要翻译： 公开了一种用于将互连销钎焊到存在于脆性电介质基板（例如多层陶瓷（MLC）基板）上的金属化图案（例如，焊盘）的一部分的方法。 电介质层由合适的环形开口形成。 每个开口提供封闭的容纳壁，其围绕和移动焊盘延伸以保持钎焊合金。 每个圆形容纳壁与其相关联的垫同心地对齐，并且暴露每个垫的面积小于整个垫的直径的区域。 容纳壁用于防止钎焊合金与焊盘的任何边缘接触。
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公开(公告)号：US08686749B2
公开(公告)日：2014-04-01
申请号：US12770948
申请日：2010-04-30
IPC分类号： G01R31/02
CPC分类号： G01R31/2884 , G01R31/2874
摘要： Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115° C. without staining or leaving residue on the device under test after baking.
摘要翻译： 用于测试结构和使用方法的非腐蚀性热界面材料。 测试结构包括散热器，用于从被测设备中散热。 测试结构还包括设置在散热器和被测器件之间的非腐蚀性热界面材料。 非腐蚀性热界面材料能够耐受至少60分钟的测试条件至少115℃，而不会在烘烤后在被测设备上污染或留下残留物。
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