公开(公告)号：US20130052425A1

公开(公告)日：2013-02-28

申请号：US13296502

申请日：2011-11-15

申请人： Hung-Yin TSAI ,  Cheng-Kuo Sung ,  Cheng-Huan Chen ,  Ching-Wen Liu

发明人： Hung-Yin TSAI ,  Cheng-Kuo Sung ,  Cheng-Huan Chen ,  Ching-Wen Liu

IPC分类号： B32B3/30 ,  B29C59/02 ,  C25D7/00

CPC分类号： C25D11/08 ,  B82Y10/00 ,  B82Y40/00 ,  C25D11/045 ,  G03F7/0002 ,  Y10T428/24612

摘要： A micro-nano composite structure and production method thereof, whereby a micro structure is fabricated by a first layer material, and then a second layer material (such as: aluminum) covers the micro structure which conducts current through the second layer material forming an anodized aluminum to produce a nanostructure, and this nanostructure is layered on the micro structure. This structure, when completed, can be used as a mold, moreover by using nano-imprinting technology this structure can be transferred onto a transparent polymer material in a one-time production process to produce one micro-nano composite structure, and achieving a reduction of the reflection coefficients and an increased transmittance, as well as raising the usage rate of the integrated light.

摘要翻译： 微纳米复合结构及其制造方法，其中通过第一层材料制造微结构，然后第二层材料（例如：铝）覆盖微结构，该微结构通过形成阳极氧化的第二层材料传导电流 铝以产生纳米结构，并且该纳米结构层叠在微结构上。 这种结构在完成时可以用作模具，而且通过使用纳米压印技术，该结构可以在一次生产过程中转移到透明聚合物材料上以产生一个微纳米复合结构，并实现减少 的反射系数和增加的透射率，以及提高集成光的使用率。

公开(公告)号：US20120007285A1

公开(公告)日：2012-01-12

申请号：US12914240

申请日：2010-10-28

申请人： Hung-Yin Tsai ,  Tien-Li Chang ,  Shao-Wei Luo

发明人： Hung-Yin Tsai ,  Tien-Li Chang ,  Shao-Wei Luo

IPC分类号： B29C35/08

CPC分类号： G03F7/0017 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/352 ,  B23K2103/42 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/70375

摘要： A mold making system for surface patterning of a roller mold is provided. The roller mold includes a transparent hollow roller and a polymer layer disposed at an outer surface of the transparent hollow roller. The mold making system includes a laser generation device, an optical path changing device, and a control device connected to the optical path changing device. The laser generation device is used for generating an ultrafast laser. The optical path changing device is disposed at an inner space of the transparent hollow roller to receive the ultrafast laser. The control device controls the optical path changing device to guide the ultrafast laser to pass through the transparent hollow roller and to be focused at a focus position in the polymer layer.

摘要翻译： 提供了一种用于辊模的表面图案化的模具制造系统。 辊模具包括透明中空辊和设置在透明中空辊的外表面处的聚合物层。 模具制造系统包括激光产生装置，光路改变装置和连接到光路改变装置的控制装置。 激光产生装置用于产生超快激光。 光路改变装置设置在透明中空辊的内部空间以接收超快激光。 控制装置控制光路改变装置以引导超快激光穿过透明中空辊并聚焦在聚合物层中的聚焦位置。

公开(公告)号：US07329364B2

公开(公告)日：2008-02-12

申请号：US10978566

申请日：2004-11-02

申请人： Shih-Shian Ho ,  Hung-Yin Tsai ,  Chia-Jen Ting ,  Chun-Fa Lan ,  Chii-Chang Chen

发明人： Shih-Shian Ho ,  Hung-Yin Tsai ,  Chia-Jen Ting ,  Chun-Fa Lan ,  Chii-Chang Chen

IPC分类号： B44C1/22

CPC分类号： C30B29/30 ,  C30B29/32 ,  C30B33/06

摘要： A method for manufacturing a bonded wafer with ultra-thin single crystal ferroelectric film is provided, comprising the following steps: providing a single crystal ferroelectric wafer and a carrier wafer while activating the surfaces of the single crystal ferroelectric wafer and the carrier wafer; bonding the activated surface of the single crystal ferroelectric wafer to the activated surface of the carrier wafer; and thinning the single crystal ferroelectric wafer for forming an ultra-thin single crystal ferroelectric film. Wherein, the thinning process in the aforesaid preferred embodiment is the method of polishing, grinding, chemical mechanical polishing, or etching. And the bonding force generated in the bonding process is strong enough to resist the shearing force.

摘要翻译： 提供一种制造具有超薄单晶铁电体膜的接合晶片的方法，包括以下步骤：在激活单晶铁电晶片和载体晶片的表面的同时提供单晶铁电晶片和载体晶片; 将单晶铁电晶片的活化表面结合到载体晶片的活化表面; 并使用于形成超薄单晶铁电体膜的单晶铁电晶片变薄。 其中，上述优选实施方式中的变薄处理是抛光，研磨，化学机械抛光或蚀刻的方法。 并且在接合过程中产生的结合力足够强以抵抗剪切力。

公开(公告)号：US06909187B2

公开(公告)日：2005-06-21

申请号：US10063630

申请日：2002-05-06

申请人： Yuangtsang Liaw ,  Hung-Yin Tsai ,  Kenny Chang

发明人： Yuangtsang Liaw ,  Hung-Yin Tsai ,  Kenny Chang

IPC分类号： H01L23/485 ,  H01L23/48

CPC分类号： H01L24/06 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48666 ,  H01L2224/49431 ,  H01L2924/01005 ,  H01L2924/01009 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/00

摘要： A conductive wiring layer structure, applied to the conductive wiring layer structure under bonding pads of a die. The die has a substrate and can be partitioned into a central core circuit and a peripheral bonding pad area. The conductive wire layer structure has a plurality of trapezium conductive wiring regions and a plurality of inverse trapezium conductive wiring regions alternately arranged in the bonding pad area. Each of the equilateral and inverse trapezium conductive wiring regions has a plurality of dielectric layers and a plurality of conductive wiring layers alternately overlaying each other on the substrate. The conductive wiring layers of the trapezium conductive wiring region are wider as approaching the substrate, and become narrower as distant away from the substrate. The conductive wiring layers of the inverse trapezium conductive wiring region are narrower as approaching the substrate, and wider as distant away from the substrate.

摘要翻译： 一种导体布线层结构，其被应用于在管芯的接合焊盘下方的导电布线层结构。 芯片具有基板，并且可以分为中心芯电路和周边焊盘区域。 导线层结构具有多个梯形导电布线区域和交替布置在焊盘区域中的多个反向梯形导电布线区域。 每个等边和反向梯形导电布线区域具有多个介电层和多个导电布线层，在基片上彼此交替叠置。 梯形导电布线区域的导电布线层越靠近基片越宽，越远离基片越窄。 反向梯形导电布线区域的导电布线层越靠近基片越窄，越远离基片。

公开(公告)号：US06798075B2

公开(公告)日：2004-09-28

申请号：US10064452

申请日：2002-07-16

申请人： Yuang-Tsang Liaw ,  Wen-Yuan Chang ,  Hung-Yin Tsai

发明人： Yuang-Tsang Liaw ,  Wen-Yuan Chang ,  Hung-Yin Tsai

IPC分类号： H01L2348

CPC分类号： H01L24/06 ,  H01L23/49838 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05093 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/49431 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01031 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/45099

摘要： A grid array packaged integrated circuit includes a substrate and a chip with a core circuit. The chip is disposed on the substrate. The chip includes I/O devices, bonding pad arranged on the chip in a multi-tier manner surrounding the I/O devices, metal traces and vias on metal layers of the chip for electrically connecting each I/O device and each bonding pad, rings and fingers surrounding the chip on the substrate, and bonding wires for electrically connecting each bonding pad to a corresponding finger or to a corresponding ring. Bonding pads electrically connected to different voltage levels can share the same I/O device.

摘要翻译： 网格阵列封装的集成电路包括基板和具有核心电路的芯片。 芯片设置在基板上。 该芯片包括I / O设备，以围绕I / O设备的多层方式布置在芯片上的接合焊盘，用于电连接每个I / O设备和每个接合焊盘的芯片的金属层上的金属迹线和通孔， 围绕基板上的芯片的环和指状物，以及用于将每个接合焊盘电连接到相应的手指或相应的环上的接合线。 电连接到不同电压电平的接合焊盘可以共享相同的I / O设备。

公开(公告)号：US20130032211A1

公开(公告)日：2013-02-07

申请号：US13196900

申请日：2011-08-03

申请人： Dein Shaw ,  Hung-Yin Tsai ,  Chien-Ting Liu ,  Feng-Ting Liu ,  Bo-Han Zeng ,  Jyun-Yu Cai ,  Yi-Shen Chen ,  Ting-Kang Yen ,  Jyun-Jhe Yu ,  Pei-Yao Hong ,  Mu-Chun Huang ,  Shun-Hsin Hsiao ,  Shao-Wei Luo

发明人： Dein Shaw ,  Hung-Yin Tsai ,  Chien-Ting Liu ,  Feng-Ting Liu ,  Bo-Han Zeng ,  Jyun-Yu Cai ,  Yi-Shen Chen ,  Ting-Kang Yen ,  Jyun-Jhe Yu ,  Pei-Yao Hong ,  Mu-Chun Huang ,  Shun-Hsin Hsiao ,  Shao-Wei Luo

IPC分类号： E03B5/00

CPC分类号： F03D9/17 ,  F03D9/12 ,  F03D9/13 ,  F03D9/28 ,  F03D15/10 ,  F05B2260/42 ,  Y02E10/72 ,  Y02E60/15 ,  Y02E60/17 ,  Y10T137/0318 ,  Y10T137/86051

摘要： The present invention discloses an air compression system having a characteristic of storing unstable energy and a method for controlling the same. The air compression system comprises an energy conversion system, an energy storage device, a compression device, and an air storage device. The control method comprises the steps of: the energy conversion system collecting the unstable natural energy and converting the unstable energy into a mechanical energy; the energy conversion system transmitting the mechanical energy to the energy storage device for storage; the energy storage device transmitting the energy to the compression device; the compression device utilizing the energy for compressing air for at least one whole stroke; and the compression device storing the compressed air in the air storage device.

摘要翻译： 本发明公开了一种具有储存不稳定能量的特性的空气压缩系统及其控制方法。 空气压缩系统包括能量转换系统，能量存储装置，压缩装置和空气存储装置。 控制方法包括以下步骤：能量转换系统收集不稳定的自然能量，将不稳定能量转化为机械能; 能量转换系统将机械能传递到储能装置进行存储; 能量存储装置将能量传送到压缩装置; 所述压缩装置利用用于将空气压缩至少一个整体冲程的能量; 并且压缩装置将压缩空气存储在空气存储装置中。

公开(公告)号：US20110032386A1

公开(公告)日：2011-02-10

申请号：US12851925

申请日：2010-08-06

申请人： Hung-Yin Tsai ,  Chih-Ming Kuo

发明人： Hung-Yin Tsai ,  Chih-Ming Kuo

IPC分类号： H04N5/225 ,  H04N5/76 ,  H04N5/335

CPC分类号： H04N5/3572 ,  H04N5/2254

摘要： An image capturing system and a sensing module are provided. The image capturing system includes a lens module, an image sensing element, and an adjustment element. The lens module is used for converging light of an object to an imaging surface. The image sensing element has a receiving surface for receiving the light of the object to form an image. The adjustment element is connected to the image sensing element and used for adjusting a curvature value of the receiving surface, so that the receiving surface matches the imaging surface.

摘要翻译： 提供了图像捕获系统和感测模块。 图像拍摄系统包括透镜模块，图像感测元件和调节元件。 透镜模块用于将物体的光会聚到成像表面。 图像感测元件具有用于接收物体的光以形成图像的接收表面。 调整元件连接到图像感测元件并用于调节接收表面的曲率值，使得接收表面与成像表面匹配。

公开(公告)号：US06972049B2

公开(公告)日：2005-12-06

申请号：US10635606

申请日：2003-08-07

申请人： Ping-Yin Liu ,  Chun-Hao Hsieh ,  Chin-Hon Fan ,  Hung-Yin Tsai ,  Chien-Chang Su

发明人： Ping-Yin Liu ,  Chun-Hao Hsieh ,  Chin-Hon Fan ,  Hung-Yin Tsai ,  Chien-Chang Su

IPC分类号： C30B25/22 ,  C30B29/04 ,  C30B25/12

CPC分类号： C30B25/22 ,  C30B29/04

摘要： A process for making a diamond film with low surface roughness. A substrate is provided. A diamond layer is deposited on the substrate. A binder layer is coated over the diamond layer. A carrier plate is provided to join with the binder layer, thereby forming a laminate structure. The substrate is then removed, thereby obtaining a diamond film with a low surface roughness with respect to the surface roughness of the removed substrate.

摘要翻译： 一种制备具有低表面粗糙度的金刚石膜的方法。 提供基板。 金刚石层沉积在基底上。 粘合剂层涂覆在金刚石层上。 提供承载板以与粘合剂层接合，从而形成层压结构。 然后去除衬底，从而获得相对于去除的衬底的表面粗糙度具有低表面粗糙度的金刚石膜。

公开(公告)号：US20050126490A1

公开(公告)日：2005-06-16

申请号：US10880546

申请日：2004-07-01

申请人： Chun-Hao Hsieh ,  Chin-Hon Fan ,  Ping-Yin Liu ,  Hung-Yin Tsai

发明人： Chun-Hao Hsieh ,  Chin-Hon Fan ,  Ping-Yin Liu ,  Hung-Yin Tsai

IPC分类号： C23C16/458 ,  C23C16/46 ,  C23C16/00

CPC分类号： C23C16/4586 ,  C23C16/46

摘要： A substrate temperature control apparatus adopted for use in plasma diamond coating of a substrate to reduce warping caused by excessive temperature variations includes a holding dock with a temperature sensor, a cooler and a heater installed therein. During the plasma process, if the detected temperature variation is excessive, the cooler or heater is activated to control the temperature of the upper surface and the lower surface of the substrate so that the temperature on two sides are controlled within a selected range to reduce warping.

摘要翻译： 采用用于基板的等离子体金刚石涂层的基板温度控制装置，以减少由温度变化过大引起的翘曲，包括安装有温度传感器，冷却器和加热器的保持台。 在等离子体处理期间，如果检测到的温度变化过大，则启动冷却器或加热器以控制基板的上表面和下表面的温度，使得两侧的温度被控制在选定范围内以减少翘曲 。

公开(公告)号：US20050012226A1

公开(公告)日：2005-01-20

申请号：US10737011

申请日：2003-12-15

申请人： Kenny Chang ,  Hung-Yin Tsai ,  Nicola Li

发明人： Kenny Chang ,  Hung-Yin Tsai ,  Nicola Li

IPC分类号： H01L21/302 ,  H01L21/60 ,  H01L23/50 ,  H01L25/16

CPC分类号： H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19105 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A chip package structure comprising a carrier, a chip, a plurality of passive components, a plurality of conductive wires and some insulating material is provided. The passive components are attached to the surface of the carrier with its electrodes connected to a power contact and a ground contact respectively. The conductive wires cross over the passive components with its ends connected respectively to a bonding pad on the chip and a signal contact close to the edge of the carrier. With the wires crossing over the passive components that are positioned close to a chip bonding area of the carrier, contact between the wires and the electrodes is prevented and the space for accommodating conductive wires is increased.

摘要翻译： 提供了包括载体，芯片，多个无源部件，多个导电线和一些绝缘材料的芯片封装结构。 被动部件被附着到载体的表面，其电极分别连接到电源触点和接地触头。 导线跨过无源部件，其端部分别连接到芯片上的焊盘和靠近载体边缘的信号触点。 当导线穿过靠近载体的芯片接合区域的无源部件时，可以防止导线与电极之间的接触，并且增加用于容纳导线的空间。