公开(公告)号：US20250040095A1

公开(公告)日：2025-01-30

申请号：US18660542

申请日：2024-05-10

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Yu-Wei Chuang ,  I-Ching Tsai

IPC: H05K7/20 ,  G01R1/04

Abstract: A phase-change temperature regulating system and an electronic device testing apparatus and method are described. In an embodiment, the system uses a temperature regulating fluid chamber containing a temperature regulating fluid to allow the temperature regulating fluid to cover at least a part of at least one surface of an electronic component. When a temperature of the electronic component reaches a boiling point of the temperature regulating fluid, the temperature regulating fluid becomes steam through a phase change to transfer heat energy outward from the electronic component, and condenses on an inner surface of the fluid chamber to further transfer heat energy of the steam to a temperature-regulating apparatus. The condensed temperature regulating fluid flows back to the temperature regulating fluid, thereby continuously circulating.

公开(公告)号：US12103789B2

公开(公告)日：2024-10-01

申请号：US17816086

申请日：2022-07-29

Applicant: CHROMA ATE INC.

Inventor： Chien-Ming Chen ,  Jui-Hsiung Chen ,  Yi-Sheng Xu

IPC: G01R31/28 ,  B65G47/90 ,  G01N3/04 ,  H01L21/67 ,  H01L21/673 ,  H01L21/683 ,  H05K13/04

CPC classification number: B65G47/905 ,  G01N3/04 ,  G01R31/2867 ,  G01R31/2874 ,  G01R31/2887 ,  G01R31/2893 ,  H01L21/67236 ,  H01L21/67333 ,  H01L21/6838 ,  H05K13/0408

Abstract: The present invention relates to an electronic device pick-and-place system and an electronic device testing apparatus having the same, comprising a plurality of pick-and-place heads, a plurality of negative pressure generators and an air pressure regulating valve. Each pick-and-place head has a pick-and-place port; the plurality of negative pressure generators are communicated with the plurality of pick-and-place ports of the plurality of pick-and-place heads respectively; an inlet end of the air pressure regulating valve is communicated with an air pressure source, and an outlet end of the air pressure regulating valve is communicated with the plurality of negative pressure generators; the air pressure regulating valve can be used to adjust the suction forces of the pick-and-place ports of the pick-and-place heads in a batch. Accordingly, the suction forces and blowing forces of the pick-and-place ports of the pick-and-place heads can be adjusted in a batch.

公开(公告)号：US12093014B2

公开(公告)日：2024-09-17

申请号：US17580705

申请日：2022-01-21

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi Ouyang ,  Wei-Cheng Kuo ,  Chien-Ming Chen ,  Xin-Yi Wu

IPC: G05B19/401 ,  G01B21/04

CPC classification number: G05B19/401 ,  G01B21/042

Abstract: A position calibration system and method are disclosed, in which a control unit is provided to control a positioner sensing module to scan a circular positioner provided on a positioning substrate in a first direction and a second direction so as to acquire midpoints of two scanned line segments and acquire an intersection of lines extending from the two center points in a direction perpendicular to the first and the second directions as a calibration reference point, which correspond to a centroid (a center) of the circular positioner. The calibration reference point functions as a reference point for positioning the positioning substrate with respect to the positioner sensing module and is stored in a memory unit. The calibration reference point can be used as a positioning point during installation of a machine and can also be used for calibration of a position of the machine.

公开(公告)号：US20240219229A1

公开(公告)日：2024-07-04

申请号：US18400686

申请日：2023-12-29

Applicant: CHROMA ATE INC.

Inventor： Chien-Hsun CHU

IPC: G01J1/42 ,  C12Q1/6848

CPC classification number: G01J1/4228 ,  C12Q1/6848

Abstract: A composite calibration plate includes a control board, a light detection board, a diffusion board, a light-emitting sheet, and a fluorescent sheet. The control board has a first setting surface and a second setting surface. The light detection board is stacked on the first setting surface. The diffusion board is stacked on the light detection board. The light-emitting sheet is stacked on the second setting surface and includes a plurality of self-luminous sources. The fluorescent sheet is optionally stacked on the light-emitting sheet or the diffusion board, and has a plurality of fluorescent chips. When calibrating the lighting device, the fluorescent sheet is disposed on the light-emitting sheet; and, when calibrating the imaging device, the fluorescent sheet is disposed on the light-emitting sheet, such that the fluorescent sheet is located at a focus position of an optical imaging path.

公开(公告)号：US20240194926A1

公开(公告)日：2024-06-13

申请号：US18516682

申请日：2023-11-21

Applicant: CHROMA ATE INC.

Inventor： Ying-Cheng Chen ,  Wen-Chuan Chang ,  Ying-Chi Chen ,  Chuan-Tse Lin

IPC: H01M10/04

CPC classification number: H01M10/0404

Abstract: A containment apparatus for battery tray rack includes a pressing module, a securing module, and a controller. In response to that the containment apparatus is to form the containment on the battery tray rack, the controller controls the pressing module to apply a compressive force, so that the battery tray rack withstands a clamping pressure, and the controller controls the securing module to lock the battery tray rack to maintain the clamping pressure. In response to that the containment apparatus is to release the containment from the battery tray rack, the controller controls the pressing module to apply the compressive force, and the controller controls the securing module to unlock the battery tray rack, and then the controller controls the pressing module to cancel the compressive force.

公开(公告)号：US20240151746A1

公开(公告)日：2024-05-09

申请号：US18307866

申请日：2023-04-27

Applicant: CHROMA ATE INC.

Inventor： I-Shih TSENG ,  I-Ching TSAI ,  Xin-Yi WU ,  Chin-Yi OUYANG

IPC: G01R1/44 ,  G01R1/04 ,  G01R1/067 ,  H01R13/24 ,  H05K7/20

CPC classification number: G01R1/44 ,  G01R1/0458 ,  G01R1/06722 ,  H01R13/2421 ,  H05K7/202 ,  H05K7/20272 ,  H01R2201/20

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.

公开(公告)号：US20240142492A1

公开(公告)日：2024-05-02

申请号：US18050500

申请日：2022-10-28

Applicant: CHROMA ATE INC.

Inventor： I-Shih TSENG ,  Xin-Yi WU ,  I-Ching TSAI ,  Chin-Yi OUYANG

IPC: G01R1/04 ,  G01R31/28

CPC classification number: G01R1/0466 ,  G01R31/2877

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

公开(公告)号：US11841381B2

公开(公告)日：2023-12-12

申请号：US17950467

申请日：2022-09-22

Applicant: CHROMA ATE INC.

Inventor： Tsun-I Wang ,  I-Shih Tseng ,  Min-Hung Chang ,  Tzu-Tu Chao

IPC: G01R31/20 ,  G01R1/073 ,  G01R1/067 ,  G01R1/28 ,  G01R31/3185

CPC classification number: G01R1/07385 ,  G01R1/06766 ,  G01R1/28 ,  G01R31/318511

Abstract: A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.

公开(公告)号：US20230349968A1

公开(公告)日：2023-11-02

申请号：US18299173

申请日：2023-04-12

Applicant: CHROMA ATE INC.

Inventor： Chin-Yi OUYANG ,  Xin-Yi WU ,  Chien-Ming CHEN ,  Meng-Kung LU ,  Chia-Hung CHIEN

IPC: G01R31/28

CPC classification number: G01R31/2896 ,  G01R31/2887 ,  G01R31/2893

Abstract: The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.

公开(公告)号：US20230134013A1

公开(公告)日：2023-05-04

申请号：US17938055

申请日：2022-10-05

Applicant: CHROMA ATE INC.

Inventor： Cheng Chung LEE ,  Szu Chieh SU ,  Wen Chih CHEN ,  Chih Hsing LIN ,  Jhen Wei GONG

IPC: H02M5/44 ,  H02M1/00

Abstract: Systems and methods for switching between a power supply mode and an electronic load mode are disclosed. For switching from the power supply mode to the electronic load mode, the method comprises the steps of: deactivating a power element; activating a current control module and a phase-locked loop to obtain a voltage phase of a device under test; calculating a turn-on amount of the power element according to a current setting value and the voltage phase; and causing the power element to generate a load current for the device under test. For switching from the electronic load mode to the power supply mode, the method comprises the steps of: deactivating the power element; activating a voltage control module; calculating the turn-on amount of the power element according to a voltage setting value; and causing the power element to input a corresponding voltage to the device under test.