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公开(公告)号:US12020973B2
公开(公告)日:2024-06-25
申请号:US17287080
申请日:2019-10-24
发明人: Andreas Plöβl
IPC分类号: B25B11/00 , B29C65/78 , H01L21/67 , H01L21/683 , H05K13/04
CPC分类号: H01L21/6838 , B25B11/00 , B29C65/7841 , B29C65/785 , B29C65/7852 , H01L21/67 , H01L21/67132 , H05K13/0408 , H05K13/041 , H05K13/0478 , H01L2224/7565
摘要: In an embodiment a transfer tool includes an adhesive stamp having an adhesive surface configured to pick up a semiconductor chip and a device configured to adjust a surface area of the adhesive surface, wherein the adhesive stamp is deformable, wherein the adhesive surface is formed by a part of an outer surface of the adhesive stamp, wherein the surface area of the adhesive surface is adjustable by deformation of the adhesive stamp, and wherein the adhesive surface is free of interruptions.
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公开(公告)号:US11792968B2
公开(公告)日:2023-10-17
申请号:US17631815
申请日:2019-08-01
申请人: FUJI CORPORATION
发明人: Masaki Murai
CPC分类号: H05K13/021 , H05K13/0084 , H05K13/0408 , H05K13/0882
摘要: An automatic conveyance apparatus includes a first loading surface, an adjustment device, a movement device, and a control section. The control section drives the movement device to move the member between the first loading surface and the second loading surface when the automatic conveyance apparatus is positioned at a member delivery position and/or a member pickup position where the automatic conveyance apparatus delivers and/or picks up the member and when the height and the inclination of the first loading surface are adjusted in accordance with the height position and the inclination position of the second loading surface by the adjustment device. The automatic conveyance apparatus is configured to travel between multiple predetermined positions including the member delivery position and/or the member pickup position.
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公开(公告)号:US11780217B2
公开(公告)日:2023-10-10
申请号:US17561092
申请日:2021-12-23
发明人: Seoin Han , Minji Kim , Taehyun Jung , Ho Yun Kang , Sungwoo Cho
CPC分类号: B32B43/006 , B32B38/18 , H05K13/0408 , B32B43/003 , B32B2457/20 , G06F1/1652 , Y10T156/1132 , Y10T156/1944
摘要: A dummy removal device includes a picker picking a point of a dummy portion of a preliminary display module and moving in a first moving direction to separate a first portion of the dummy portion from the preliminary display module; and a separator disposed adjacent to the separated first portion and moving in a second moving direction intersecting the first moving direction to remove a second portion of the dummy portion from the preliminary display module, and the dummy portion is disposed around an effective portion of the preliminary display module.
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公开(公告)号:US20190254171A1
公开(公告)日:2019-08-15
申请号:US15893859
申请日:2018-02-12
申请人: Xerox Corporation
发明人: Chad S. Smithson , Ethan Shen , Johann Junginger , Tianxiao Xu
CPC分类号: H05K3/1275 , G06T17/05 , H05K13/0015 , H05K13/0408 , H05K13/046 , H05K13/08
摘要: An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.
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公开(公告)号:US20180301265A1
公开(公告)日:2018-10-18
申请号:US15822217
申请日:2017-11-27
发明人: Ming-Hsien Wu , Yen-Hsiang Fang , Chia-Hsin Chao
IPC分类号: H01F7/20
CPC分类号: H01F7/206 , B25J15/0608 , H01F13/006 , H01L21/67144 , H01L33/0095 , H05K13/0408 , H05K13/041
摘要: A magnetic transfer module adapted to transfer a plurality of electronic elements. The magnetic transfer module includes an electromagnet and a plurality of transfer unit. The transfer units are connected to the electromagnet, each of the transfer units includes a ferromagnetic material element, and at least one of the transfer units includes a heating element. The electromagnet magnetizes the ferromagnetic material element, such that the ferromagnetic material element magnetically attracts one of the electronic elements. The heating element is disposed between the electromagnet and the ferromagnetic material element, and heats the ferromagnetic material element to demagnetize the ferromagnetic material element while being actuated.
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公开(公告)号:US20180255670A1
公开(公告)日:2018-09-06
申请号:US15907979
申请日:2018-02-28
发明人: Hideaki WATANABE , Dai YOKOYAMA , Shigeki IMAFUKU , Yosuke NAGASAWA , Yew Song Danny NG , Yet Ling LOH
IPC分类号: H05K13/04
CPC分类号: H05K13/0408
摘要: A component mounting device mounting a component on a substrate comprises a pair of opening/closing members opening and closing, and a plurality of adapters detachably attached to the opening/closing members; the adapters are attached to the opening/closing members depending on the component to be mounted so as to clamp the component by using the adapters; and the plurality of adapters includes first adapters each having a flat clamping surface clamping a body of the component and second adapters each having a holding groove holding an axial portion of the component.
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公开(公告)号:US20180249606A1
公开(公告)日:2018-08-30
申请号:US15552394
申请日:2015-02-26
发明人: Kazuma ISHIKAWA , Shunji MORIKAWA , Toru MATSUMOTO
CPC分类号: H05K13/028 , B25J11/00 , B25J15/0616 , H05K13/02 , H05K13/0408 , H05K13/0434
摘要: A component supply device including a first posture component main body receiving recessed section corresponding to the shape of a component and a second posture component main body receiving recessed section the same shape as the first posture component main body receiving recessed section, rotated by 180°, and overlapping a portion of the first posture component main body receiving recessed section are formed in a component receiving member. A control device of the component mounting machine side is notified of information indicating the postures of the components which are placed on the component receiving member. Accordingly, the component holding tool of the component mounting machine side is capable of appropriately holding a component from the component receiving member based on the information indicating the postures of the components which are placed on the component receiving member.
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公开(公告)号:US20180122682A1
公开(公告)日:2018-05-03
申请号:US15792826
申请日:2017-10-25
发明人: Jong-An LEE
IPC分类号: H01L21/683 , H05K13/04 , B65G47/91
CPC分类号: H01L21/6838 , B25J15/0616 , B65G47/911 , B65G47/918 , H01L21/67144 , H05K13/0408 , H05K13/0409 , H05K13/041
摘要: An apparatus for picking up one or more semiconductor devices includes a body having an air chamber that communicates with surroundings outside of the body and at least a first supply line through which compressed air is supplied into the air chamber, a pickup cylinder penetrating through the body and movably installed in the body, a suction pad being provided at an end portion of the pickup cylinder, and a power transformer secured to the pickup cylinder and transforming an air pressure of the air chamber to a driving force for driving the pickup cylinder.
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公开(公告)号:US09901019B2
公开(公告)日:2018-02-20
申请号:US15217786
申请日:2016-07-22
申请人: Mycronic AB
CPC分类号: H05K13/02 , H05K13/021 , H05K13/0404 , H05K13/0408 , H05K13/0417 , H05K13/0419 , Y10T156/17
摘要: A tape feeder, including a tape feeder body and a feeder wagon/linear guide, is used to direct component tape in a linear movement towards a component pick position. The feeder wagon comprises a feeder wagon body slidably mounted to the tape feeder body for movement between a first, pickup position and a second, delivery position. The feeder wagon further comprises a feeder head mounted to the feeder wagon body for movement (1) with the feeder wagon body as it moves along the first path, and (2) along a second path transverse to the first path between a first, tape-engaged position and a second, tape-released position. The feeder head comprises a tape-engaging element engageable with component tape.
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公开(公告)号:US20180021959A1
公开(公告)日:2018-01-25
申请号:US15546690
申请日:2016-01-27
申请人: Kyocera Corporation
发明人: Minoru Nakasuga , Yasuyuki Hiromasa , Muneki Koga
CPC分类号: B25J15/0616 , B25J15/06 , C04B35/48 , C04B35/486 , C04B35/6261 , C04B35/632 , C04B35/63424 , C04B2235/3232 , C04B2235/3241 , C04B2235/3244 , C04B2235/3272 , C04B2235/5445 , C04B2235/785 , C04B2235/963 , C04B2235/9661 , C09C1/0009 , H05K13/04 , H05K13/0408
摘要: A suction nozzle is disclosed. The suction nozzle includes zirconia-based ceramics. The ceramics includes first grains and second grains. The first grains each contain zirconia, and the second grains each contain a black-colored component. The suction nozzle includes a suction face and a suction hole. The suction hole is in communication with the suction face. In the suction face, an area ratio of an area occupied by the second grains to a measurement face obtained by polishing the suction face is greater than or equal to 17% but less than or equal to 34%. A number of the second grains in an area of 90 μm2 in the measurement face is greater than or equal to 150 but less than or equal to 250.
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