公开(公告)号：US20210098750A1

公开(公告)日：2021-04-01

申请号：US16992026

申请日：2020-08-12

Applicant: Samsung Display Co., Ltd.

Inventor： Geunwoo Yug ,  Mu-Hyun Kim ,  Bon-Joo Koo ,  Taehyun Jung

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  B23K26/70 ,  B23K26/08 ,  B23K26/38 ,  B23K26/0622

Abstract: A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

公开(公告)号：US11780217B2

公开(公告)日：2023-10-10

申请号：US17561092

申请日：2021-12-23

Applicant: Samsung Display Co., Ltd.

Inventor： Seoin Han ,  Minji Kim ,  Taehyun Jung ,  Ho Yun Kang ,  Sungwoo Cho

IPC: B32B43/00 ,  H05K13/04 ,  B32B38/18 ,  G06F1/16

CPC classification number: B32B43/006 ,  B32B38/18 ,  H05K13/0408 ,  B32B43/003 ,  B32B2457/20 ,  G06F1/1652 ,  Y10T156/1132 ,  Y10T156/1944

Abstract: A dummy removal device includes a picker picking a point of a dummy portion of a preliminary display module and moving in a first moving direction to separate a first portion of the dummy portion from the preliminary display module; and a separator disposed adjacent to the separated first portion and moving in a second moving direction intersecting the first moving direction to remove a second portion of the dummy portion from the preliminary display module, and the dummy portion is disposed around an effective portion of the preliminary display module.

公开(公告)号：US11522155B2

公开(公告)日：2022-12-06

申请号：US16936954

申请日：2020-07-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Geunwoo Yug ,  Taehyun Jung ,  Seoin Han

IPC: H01L51/52 ,  H01L51/00 ,  H01L51/56 ,  B23K26/38 ,  B23K26/08 ,  B23K26/06 ,  B23K103/00

Abstract: A method for manufacturing a display device including a display panel having a folding area to be folded along a virtual folding axis and first and second non-folding areas adjacent to both sides of the folding area, and a window disposed on the display panel, the method including preparing a mother substrate having an effective area and a non-effective area divided by a cutting line, performing a first laser process along a first cutting line disposed in the first non-folding area, performing a second laser process along a second cutting line disposed in the second non-folding area, and performing a third laser process along a third cutting line disposed in the folding area, in which one end of the third cutting line overlaps a first end of the first cutting line, and the other end of the third cutting line overlaps a first end of the second cutting line.

公开(公告)号：US11508947B2

公开(公告)日：2022-11-22

申请号：US16992026

申请日：2020-08-12

Applicant: Samsung Display Co., Ltd.

Inventor： Geunwoo Yug ,  Mu-Hyun Kim ,  Bon-Joo Koo ,  Taehyun Jung

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  B23K26/70 ,  B23K26/38 ,  B23K26/0622 ,  B23K26/08 ,  B23K101/36

Abstract: A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.