公开(公告)号：US20210098750A1

公开(公告)日：2021-04-01

申请号：US16992026

申请日：2020-08-12

Applicant: Samsung Display Co., Ltd.

Inventor： Geunwoo Yug ,  Mu-Hyun Kim ,  Bon-Joo Koo ,  Taehyun Jung

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  B23K26/70 ,  B23K26/08 ,  B23K26/38 ,  B23K26/0622

Abstract: A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.

公开(公告)号：US11508947B2

公开(公告)日：2022-11-22

申请号：US16992026

申请日：2020-08-12

Applicant: Samsung Display Co., Ltd.

Inventor： Geunwoo Yug ,  Mu-Hyun Kim ,  Bon-Joo Koo ,  Taehyun Jung

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/00 ,  B23K26/70 ,  B23K26/38 ,  B23K26/0622 ,  B23K26/08 ,  B23K101/36

Abstract: A method of manufacturing an electronic apparatus includes: providing a work substrate including a preliminary set module including an active area including a hole formation area; and a protective film covering at least one of an upper surface and a rear surface of the preliminary set module; radiating the laser beam to the work substrate from a first start point toward a moving path removing at least a portion of the work substrate to form a first start cutting line in the hole formation area, the moving path of the laser beam defined as a boundary between the hole formation area and the active area; radiating the laser beam along the moving path; and removing the hole formation area from the preliminary set module to form a module hole, wherein the first start cutting line forms a predetermined angle with respect to a tangential line of the moving path.