公开(公告)号：US11841381B2

公开(公告)日：2023-12-12

申请号：US17950467

申请日：2022-09-22

Applicant: CHROMA ATE INC.

Inventor： Tsun-I Wang ,  I-Shih Tseng ,  Min-Hung Chang ,  Tzu-Tu Chao

IPC: G01R31/20 ,  G01R1/073 ,  G01R1/067 ,  G01R1/28 ,  G01R31/3185

CPC classification number: G01R1/07385 ,  G01R1/06766 ,  G01R1/28 ,  G01R31/318511

Abstract: A wafer inspection method and inspection apparatus are provided. On a wafer having layout lines connecting electrode points of individual dies in series, the dies within a matrix range are inspected one after another in turn in a column/row control means by a first switch group and a second switch group of a probe card, so that each die is selectively configured in a test loop of a test process by turning on/off of a corresponding switch. Thus, after inspection of a die under inspection (a selected die) within the matrix range is complete, the column/row control means is used to switch to a next die to achieve fast switching. Accordingly, for the inspection procedure of each die within the matrix region, a conventional procedure of moving one after another in turn can be eliminated, significantly reducing the total test time needed and enhancing inspection efficiency.