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1.
公开(公告)号:US12103789B2
公开(公告)日:2024-10-01
申请号:US17816086
申请日:2022-07-29
Applicant: CHROMA ATE INC.
Inventor: Chien-Ming Chen , Jui-Hsiung Chen , Yi-Sheng Xu
IPC: G01R31/28 , B65G47/90 , G01N3/04 , H01L21/67 , H01L21/673 , H01L21/683 , H05K13/04
CPC classification number: B65G47/905 , G01N3/04 , G01R31/2867 , G01R31/2874 , G01R31/2887 , G01R31/2893 , H01L21/67236 , H01L21/67333 , H01L21/6838 , H05K13/0408
Abstract: The present invention relates to an electronic device pick-and-place system and an electronic device testing apparatus having the same, comprising a plurality of pick-and-place heads, a plurality of negative pressure generators and an air pressure regulating valve. Each pick-and-place head has a pick-and-place port; the plurality of negative pressure generators are communicated with the plurality of pick-and-place ports of the plurality of pick-and-place heads respectively; an inlet end of the air pressure regulating valve is communicated with an air pressure source, and an outlet end of the air pressure regulating valve is communicated with the plurality of negative pressure generators; the air pressure regulating valve can be used to adjust the suction forces of the pick-and-place ports of the pick-and-place heads in a batch. Accordingly, the suction forces and blowing forces of the pick-and-place ports of the pick-and-place heads can be adjusted in a batch.
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公开(公告)号:US11970342B2
公开(公告)日:2024-04-30
申请号:US17930082
申请日:2022-09-07
Applicant: CHROMA ATE INC.
Inventor: Chien-Ming Chen , Jui-Hsiung Chen , Chi-Wei Wang
CPC classification number: B65G47/905 , G01N3/04 , G01N3/06 , G01N3/12 , G01R31/2867 , G01R31/2874 , G01R31/2887 , G01R31/2893 , H01L21/67333 , H05K13/0408 , G01N2203/0044 , G01N2203/0411
Abstract: The present invention relates to a chip tray positioning device, which mainly comprises a frame body, a tray conveying module, a pulling module, a pushing module and a controller. The tray conveying module is disposed on the frame body, electrically connected to the controller and controlled to convey a chip tray from the start area to the end area. The pulling module and the pushing module are disposed on the frame body, electrically connected to the controller and controlled to cause the chip tray to be abutted against the end wall and the lateral wall of the frame body, thereby realizing the positioning of the chip tray and eliminating an error formed in the transfer process of the chip tray. In addition, the controller also controls the pushing module to knock the chip tray at a specific frequency so that the chip tray is vibrated.
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