公开(公告)号：US20230400478A1

公开(公告)日：2023-12-14

申请号：US18327148

申请日：2023-06-01

申请人： CHROMA ATE INC.

发明人： I-Shih TSENG ,  Chin-Yi OUYANG ,  I-Ching TSAI ,  Xin-Yi WU ,  Yan-Lin WU

IPC分类号： G01R1/04

CPC分类号： G01R1/0458

摘要： A liquid cooling system, a liquid cooling method, and an electronic device-testing apparatus having the system are disclosed. When an electronic device is accommodated in a chip slot of a test socket, a cooling liquid supply device supplies a cooling liquid to the chip slot through a fluid inlet portion, and the cooling liquid at least flows over parts of the upper and lower surfaces of the electronic device and then flows out from a fluid outlet portion. The chip slot of the test socket serves as the flow space for the cooling liquid so that the cooling liquid can flow over the upper and lower surfaces of the electronic device, and the electronic device can be immersed in the continuously flowing cooling liquid. The flowing cooling liquid can also take away foreign matter, avoiding the influence of the foreign matter on the test.

公开(公告)号：US20240151746A1

公开(公告)日：2024-05-09

申请号：US18307866

申请日：2023-04-27

申请人： CHROMA ATE INC.

发明人： I-Shih TSENG ,  I-Ching TSAI ,  Xin-Yi WU ,  Chin-Yi OUYANG

IPC分类号： G01R1/44 ,  G01R1/04 ,  G01R1/067 ,  H01R13/24 ,  H05K7/20

CPC分类号： G01R1/44 ,  G01R1/0458 ,  G01R1/06722 ,  H01R13/2421 ,  H05K7/202 ,  H05K7/20272 ,  H01R2201/20

摘要： The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.

公开(公告)号：US20240142492A1

公开(公告)日：2024-05-02

申请号：US18050500

申请日：2022-10-28

申请人： CHROMA ATE INC.

发明人： I-Shih TSENG ,  Xin-Yi WU ,  I-Ching TSAI ,  Chin-Yi OUYANG

IPC分类号： G01R1/04 ,  G01R31/28

CPC分类号： G01R1/0466 ,  G01R31/2877

摘要： The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system mainly comprises a coolant circulation module, which includes a coolant supply channel communicated with an inlet of a chip socket and a coolant recovery channel communicated with an outlet of the chip socket. When an electronic device is accommodated in the chip socket, the coolant circulation module supplies a coolant into the chip socket through the coolant supply channel and the inlet, and the coolant passes through the pogo pins and then flows into the coolant recovery channel through the outlet.

公开(公告)号：US20230400506A1

公开(公告)日：2023-12-14

申请号：US18316691

申请日：2023-05-12

申请人： CHROMA ATE INC.

发明人： Chin-Yi OUYANG ,  I-Ching TSAI ,  Xin-Yi WU ,  Yan-Lin WU

IPC分类号： G01R31/28

CPC分类号： G01R31/2877 ,  G01R31/2863

摘要： The present invention relates to a temperature control system and a temperature control method for an electronic device-testing apparatus. The temperature control system mainly includes a test socket, a temperature-controlling fluid supply device and a temperature-controlling fluid recovery device. A temperature-controlling fluid is supplied to a chip slot of the test socket by the temperature-controlling fluid supply device and drawn from the chip slot by the temperature-controlling fluid recovery device. In the present invention, the temperature-controlling fluid is forced to flow through the chip slot loaded with an electronic device so as to forcibly exchange heat with the electronic device and components in the chip slot, thereby achieving the constant temperature test. After the test is completed, the temperature-controlling fluid can be effectively recovered so that the contamination of the electronic device or the testing apparatus can be avoided.