公开(公告)号：US20250040095A1

公开(公告)日：2025-01-30

申请号：US18660542

申请日：2024-05-10

Applicant: CHROMA ATE INC.

Inventor： Xin-Yi Wu ,  Yu-Wei Chuang ,  I-Ching Tsai

IPC: H05K7/20 ,  G01R1/04

Abstract: A phase-change temperature regulating system and an electronic device testing apparatus and method are described. In an embodiment, the system uses a temperature regulating fluid chamber containing a temperature regulating fluid to allow the temperature regulating fluid to cover at least a part of at least one surface of an electronic component. When a temperature of the electronic component reaches a boiling point of the temperature regulating fluid, the temperature regulating fluid becomes steam through a phase change to transfer heat energy outward from the electronic component, and condenses on an inner surface of the fluid chamber to further transfer heat energy of the steam to a temperature-regulating apparatus. The condensed temperature regulating fluid flows back to the temperature regulating fluid, thereby continuously circulating.

公开(公告)号：US20240192268A1

公开(公告)日：2024-06-13

申请号：US18511638

申请日：2023-11-16

Applicant: CHROMA ATE INC.

Inventor： Yu-Wei Chuang ,  Xin-Yi Wu ,  Jui-Che Chou

IPC: G01R31/28 ,  G05D23/20 ,  H01L21/66

CPC classification number: G01R31/2874 ,  G01R31/2863 ,  G05D23/20 ,  H01L22/12

Abstract: A multiphase thermal interface component, a method of forming the same, and an electronic device testing apparatus provided with the same are provided. The multiphase thermal interface component includes a thermal interface solid element and a thermal interface fluid material. The thermal conductive surface of the thermal interface solid element has an accommodation space, and the thermal interface fluid material is accommodated in the accommodation space. Therefore, the multiphase thermal interface component combines solid-phase and fluid-phase thermal interface materials. Since fluids have the properties of changing shape, flowing, and splitting arbitrarily, the thermal interface fluid material can completely fill up the air gaps between the thermal interface solid element and the thermal control device/the temperature-controlled component, so that the full surface temperature control of the contact interface can be achieved, thereby effectively improving the thermal conduction performance.