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88 条记录 (耗时 0.01 秒)

    Powder compositions of polynary oxides and copper
    81.
    发明授权
    Powder compositions of polynary oxides and copper 失效
    多晶氧化物和铜的粉末组成

    公开(公告)号：US3950597A

    公开(公告)日：1976-04-13

    申请号：US536319

    申请日：1974-12-24

    申请人： David Hitz Scheiber

    发明人： David Hitz Scheiber

    IPC分类号： H01C17/065 ,  H01L21/70 ,  H01L49/02 ,  H01B1/02 ,  B32B9/04

    CPC分类号： H01L21/705 ,  H01C17/0654 ,  H01L49/02

    摘要： This invention relates to improved powder compositions useful for forming resistors on dielectric substrates; the compositions comprise certain polynary oxides of silver and/or copper ions having a pyrochlore-related crystal structure, plus dielectric material, and 1-10% copper powder. Also dispersions thereof and resistors made by firing these compositions.

    摘要翻译： 本发明涉及用于在电介质基片上形成电阻器的改进的粉末组合物; 组合物包含某些具有烧绿石相关晶体结构的银和/或铜离子的多元氧化物，以及电介质材料和1-10％的铜粉末。 还有其分散体和通过焙烧这些组合物制成的电阻。

    Dual-etched refractory metallizing
    84.
    发明授权
    Dual-etched refractory metallizing 失效
    双重烧蚀金属化

    公开(公告)号：US3661635A

    公开(公告)日：1972-05-09

    申请号：US3661635D

    申请日：1970-02-20

    申请人： AMERICAN LAVA CORP

    发明人： HARRISON HENRY F

    IPC分类号： C04B41/51 ,  C04B41/88 ,  H01L21/70 ,  H05K1/09 ,  H05K3/02 ,  H05K3/06 ,  H05K3/04

    CPC分类号： C04B41/009 ,  C04B41/5133 ,  C04B41/5138 ,  C04B41/88 ,  H01L21/705 ,  H05K1/092 ,  H05K3/02 ,  H05K3/064 ,  H05K2203/025 ,  Y10T428/24802 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926 ,  C04B41/4505 ,  C04B41/4572 ,  C04B41/53 ,  C04B35/00

    摘要： A process for metallizing on ceramic substrates with fine detail patterns of refractory metal which includes a prefiring to effect oxidation of a portion of the metallizing coating, application of a photopolymerizable coating thereover followed by exposure in pattern form using a mask, removal of unpolymerized coating by conventional means, acid etching to remove the oxides formed during pre-firing in exposed portions of the metallizing coating and mechanical removal of unoxidized and unsintered metal remaining in etched portions. This is followed by a final firing which destroys the photoresist and sinters the metal remaining on the substrate.

    摘要翻译： 一种用于在陶瓷基片上金属化的难熔金属的精细细节图案的方法，其包括预先实现金属化涂层的一部分的氧化，在其上施加可光聚合涂层，然后使用掩模以图案形式曝光，通过使用掩模去除未聚合的涂层 常规方法，酸蚀刻以除去在金属化涂层的暴露部分中预焙烧期间形成的氧化物，并机械去除残留在蚀刻部分中的未氧化和未烧结的金属。 之后是最终的烧制，其破坏光致抗蚀剂并烧结剩余在基底上的金属。

    Tape transfer of sinterable conductive, semiconductive or insulating patterns to electronic component substrates
    85.
    发明授权
    Tape transfer of sinterable conductive, semiconductive or insulating patterns to electronic component substrates 失效
    电子元件基板的可变导体，半导体或绝缘图案的带状传输

    公开(公告)号：US3655496A

    公开(公告)日：1972-04-11

    申请号：US3655496D

    申请日：1969-09-25

    申请人： VITTA CORP

    发明人： ETTRE KITTY S ,  CASTLES GEORGE RICHARD

    IPC分类号： H01L21/70 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  B32B7/04

    CPC分类号： H05K3/207 ,  H01L21/705 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/0097 ,  H05K3/386 ,  H05K2203/0156 ,  H05K2203/1545 ,  Y10S206/813 ,  Y10S428/914 ,  Y10T29/4981 ,  Y10T428/149 ,  Y10T428/265

    摘要： Conductive, semiconductive or insulating patterns such as fine line, thick film circuitry, or dot configurations are applied to electronic component substrates from a continuous transfer tape. In the transfer tape the patterns are formed with prearranged spacing on a heat decomposable carrier film, which in turn is supported on a backing strip and covered by a protective strip. In use the protective strip is peeled off and the patterns, still adhered to the carrier film and supported by the backing strip, are adhesively secured to a group or a continuously fed series of pre-aligned substrates. The backing strip is then peeled off, and the substrates with the applied patterns, now supported only by the heat decomposable carrier film, are placed in an oven for sintering and decomposition of the carrier film. The transfer tape and method of the invention lend themselves readily to automated, production-line procedures.

    摘要翻译： 导电的，半导体的或绝缘的图案，例如细线，厚膜电路或点配置，从连续的转移带应用于电子元件衬底。 在转移带中，图案在可热分解的载体膜上以预定间隔形成，其又被支撑在背衬条上并被保护带覆盖。 在使用中，保护带被剥离，并且仍然粘附到载体膜并由背衬条支撑的图案被粘合地固定到一组或连续供给的一系列预对准基板。 然后将背衬剥离，并且现在仅由可热分解载体膜支撑的具有施加图案的基板被放置在烘箱中用于烧结和分解载体膜。 本发明的转移带和方法可以容易地自动化，生产线程序。