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    Tape transfer of sinterable conductive, semiconductive or insulating patterns to electronic component substrates
    3.
    发明授权
    Tape transfer of sinterable conductive, semiconductive or insulating patterns to electronic component substrates 失效
    电子元件基板的可变导体，半导体或绝缘图案的带状传输

    公开(公告)号：US3655496A

    公开(公告)日：1972-04-11

    申请号：US3655496D

    申请日：1969-09-25

    申请人： VITTA CORP

    发明人： ETTRE KITTY S ,  CASTLES GEORGE RICHARD

    IPC分类号： H01L21/70 ,  H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/20 ,  H05K3/38 ,  B32B7/04

    CPC分类号： H05K3/207 ,  H01L21/705 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/0097 ,  H05K3/386 ,  H05K2203/0156 ,  H05K2203/1545 ,  Y10S206/813 ,  Y10S428/914 ,  Y10T29/4981 ,  Y10T428/149 ,  Y10T428/265

    摘要： Conductive, semiconductive or insulating patterns such as fine line, thick film circuitry, or dot configurations are applied to electronic component substrates from a continuous transfer tape. In the transfer tape the patterns are formed with prearranged spacing on a heat decomposable carrier film, which in turn is supported on a backing strip and covered by a protective strip. In use the protective strip is peeled off and the patterns, still adhered to the carrier film and supported by the backing strip, are adhesively secured to a group or a continuously fed series of pre-aligned substrates. The backing strip is then peeled off, and the substrates with the applied patterns, now supported only by the heat decomposable carrier film, are placed in an oven for sintering and decomposition of the carrier film. The transfer tape and method of the invention lend themselves readily to automated, production-line procedures.

    摘要翻译： 导电的，半导体的或绝缘的图案，例如细线，厚膜电路或点配置，从连续的转移带应用于电子元件衬底。 在转移带中，图案在可热分解的载体膜上以预定间隔形成，其又被支撑在背衬条上并被保护带覆盖。 在使用中，保护带被剥离，并且仍然粘附到载体膜并由背衬条支撑的图案被粘合地固定到一组或连续供给的一系列预对准基板。 然后将背衬剥离，并且现在仅由可热分解载体膜支撑的具有施加图案的基板被放置在烘箱中用于烧结和分解载体膜。 本发明的转移带和方法可以容易地自动化，生产线程序。