公开(公告)号：US3663276A

公开(公告)日：1972-05-16

申请号：US3663276D

申请日：1970-05-25

申请人： RCA CORP

发明人： ALLINGTON TREVOR RICHARD ,  MCCLELLAN JAMES RICHARD

IPC分类号： H01C17/30 ,  H01C17/065 ,  H01C17/26 ,  B44D1/18 ,  B44D1/02 ,  H01B1/02

CPC分类号： H01C17/265 ,  H01C17/065

摘要： Method of adjusting the resistivity of a thick-film resistor of the type made by screen printing on a substrate a composition comprising metal particles, glass frit, a temporary organic binder and a temporary solvent, drying to remove the solvent, and firing the composition to fuse the glass frit and burn off the binder, said method comprising determining the relationship between the resistivity of the fired composition and the drying time that elapses between screen printing the composition on the substrate and the beginning of the firing cycle, and setting this elapsed time in accordance with a desired resistivity value.

摘要翻译： 将通过丝网印刷形成的类型的厚膜电阻器的电阻率调整到基板上的方法，所述组合物包括金属颗粒，玻璃料，临时有机粘合剂和临时溶剂，干燥以除去溶剂，并将组合物烧成 熔化玻璃料并烧掉粘合剂，所述方法包括确定焙烧组合物的电阻率与在丝网印刷基材上的组合物与烧制周期开始之间经过的干燥时间之间的关系，并设定该经过时间 根据期望的电阻率值。

公开(公告)号：US3669733A

公开(公告)日：1972-06-13

申请号：US3669733D

申请日：1969-12-12

申请人： RCA CORP

发明人： ALLINGTON TREVOR RICHARD

IPC分类号： H05K3/28 ,  H01B3/30 ,  H01B3/46 ,  H01C1/032 ,  H01C1/034 ,  H01C17/24 ,  H01G4/018 ,  H01G4/12 ,  H01G4/255 ,  H01G4/33 ,  H01L21/70 ,  H01L27/01 ,  H01C7/00 ,  B44D1/18 ,  H01C17/00

CPC分类号： H01G4/255 ,  H01B3/30 ,  H01B3/46 ,  H01C1/032 ,  H01C1/034 ,  H01C17/24 ,  H01L21/705 ,  Y10T29/49099

摘要： A TRANSPARENT, SCREEN-PRINTABLE INSULATION COMPOSITION FOR PROTECTING COMPONENTS OF A HYBRIDE INTEGRATED CIRCUIT COMPRISING A TRANSPARENT SYNTHETIC RESIN, MICA FLAKE AND RESIN SOLVENT IN SUCH PROPORTIONS AS TOBE SCREEN-PRINTABLE. ALSO A METHOD OF MAKING A HYBRID INTEGRATED CIRCUIT IN WHICH PASSIVE COMPONENTS ARE TRIMMED AFTER THE PROTECTIVE COATING IS APPLIED.

公开(公告)号：US3676252A

公开(公告)日：1972-07-11

申请号：US3676252D

申请日：1970-04-13

申请人： RCA CORP

发明人： ALLINGTON TREVOR RICHARD

IPC分类号： H01L49/02 ,  H05K1/18 ,  H05K3/32 ,  B32B33/00

CPC分类号： H05K3/321 ,  H01L49/02 ,  H05K1/181 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T156/1089

摘要： IN MOUNTING COMPONENTS SUCH AS CERAMIC CHIP CAPACITORS ON INSULATING SUBSTRATES SO AS TO MAKE GOOD ELECTRICAL CONNECTION WITH A CONDUCTING AREA OF THE SUBSTRATE, A SOLVENTLESS CONDUCTING COMPOSITION IS SCREEN PRINTED ON THE MOUNTING SURFACE AND THE CHIP IS PRESSED INTO THE COMPOSITION. THE COMPOSITION COMPRISES A LOW VISCOSITY LIQUID EPOXY RESIN, A HARDENER FOR THE RESIN, AND A RELATIVELY HIGH PROPORTION OF SILVER POWDER.