公开(公告)号：US4499360A

公开(公告)日：1985-02-12

申请号：US513020

申请日：1983-07-12

申请人： Reinhard Rottenbacher

发明人： Reinhard Rottenbacher

IPC分类号： B23K35/30 ,  C04B37/00 ,  B23K1/02

CPC分类号： C04B37/006 ,  B23K35/30 ,  C04B2235/604 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/666 ,  C04B2237/16 ,  C04B2237/365 ,  C04B2237/704 ,  C04B2237/708 ,  C04B2237/765 ,  C04B2237/88

摘要： A high-temperature reaction solder, for silicon carbide materials, containing 20-45% cobalt and 80-55% silicon by weight, and a process for brazing are disclosed.

摘要翻译： 公开了用于碳化硅材料的高温反应焊料，其含有20-45％重量的钴和80-55％的硅，以及一种用于钎焊的方法。

公开(公告)号：US4496098A

公开(公告)日：1985-01-29

申请号：US361612

申请日：1982-03-25

申请人： Ichiro Kawakatsu

发明人： Ichiro Kawakatsu

IPC分类号： B23K35/36 ,  B23K1/02

CPC分类号： B23K35/3612

摘要： Surfaces of copper or brass which are to be joined by tin/lead alloy soldering in a non-oxydizing atmosphere are first wetted by a treating liquid containing an organic solvent typified by ethyl alcohol; a polyhydric alcohol derivative typified by ethylene glycol; and an organic, halogen-containing activator typified by aniline hydrochloride. In the resulting soldered joint, the solder has spread acceptably well and little oxidation or wetting agent resident is formed.

摘要翻译： 首先用含有以乙醇为代表的有机溶剂的处理液润湿要在非氧化气氛中通过锡/铅合金焊接而接合的铜或黄铜的表面; 以乙二醇为代表的多元醇衍生物; 和以苯胺盐酸盐为代表的有机的含卤素活化剂。 在所得到的焊接接头中，焊料可以良好地扩展，并且形成少量氧化或润湿剂。

公开(公告)号：US4352450A

公开(公告)日：1982-10-05

申请号：US188699

申请日：1980-09-19

申请人： Robert E. Edgington

发明人： Robert E. Edgington

IPC分类号： B23K1/19 ,  B23K35/00 ,  B23K1/02 ,  B23K1/20

CPC分类号： B23K35/002 ,  B23K1/19

摘要： A method for soldering aluminum or aluminum alloys is disclosed, together with an alloy useful in the method. The method includes heating, for example by using a torch, at least one aluminum piece to a temperature within the range of 90-150 degrees celsius, cleaning at least one heated surface thereof, for example by wire brushing, further heating the cleaned piece to a temperature within the range of 350-490 degrees celsius, and applying, for example by rub soldering, to the cleaned and further-heated piece a quantity sufficient to enable subsequent soldering, as required, of a tin/lead/zinc alloy consisting essentially of, by weight, from 1.7 to 2.2 percent aluminum, from 0.01 to 0.02 percent magnesium, from 45.9 to 50.4 percent zinc, from 14.2 to 34 percent tin, and from 16.6 to 36.7 percent lead. A surface of the alloy so applied is then cleaned, for example by wire brushing; the aluminum piece is cooled to a soldering temperature and the alloy surface is soldered, for example by rub soldering, with a suitable lead-tin solder. According to the invention, single pieces of aluminum or aluminum alloy can be repaired, or a plurality of such pieces can be joined by intimately contacting soldered surfaces thereof and further heating to provide a repair or solder joint of high tensile strength.

摘要翻译： 公开了一种用于焊接铝或铝合金的方法，以及在该方法中有用的合金。 该方法包括例如通过使用手电筒将至少一个铝片加热到90-150摄氏度的温度，例如通过丝网刷洗清洁其至少一个加热表面，进一步将清洁的片材加热至 温度在350-490摄氏度的范围内，并且例如通过摩擦焊接施加到清洁和进一步加热的片上，其量足以使得能够根据需要随后根据需要焊接锡/铅/锌合金 重量百分比为1.7至2.2％的铝，0.01至0.02％的镁，45.9％至50.4％的锌，14.2％至34％的锡和16.6％至36.7％的铅。 然后如此施加的合金的表面被清洁，例如通过丝刷; 铝片被冷却到焊接温度，合金表面通过例如通过摩擦焊接与合适的铅锡焊料进行焊接。 根据本发明，可以修复单片铝或铝合金，或者通过使其焊接表面紧密接触并且进一步加热来连接多个这样的片，以提供具有高拉伸强度的修补或焊接接头。

公开(公告)号：US4332342A

公开(公告)日：1982-06-01

申请号：US246525

申请日：1981-03-23

申请人： Henricus C. A. van Der Put

发明人： Henricus C. A. van Der Put

IPC分类号： B21H1/18 ,  B23K1/00 ,  B23K1/08 ,  H05K1/03 ,  H05K1/09 ,  H05K3/34 ,  B23K1/02

CPC分类号： B23K1/085 ,  H05K3/3494 ,  H05K1/0306 ,  H05K1/092 ,  H05K2203/0776 ,  H05K2203/111 ,  H05K2203/1581

摘要： A method of and a device for soldering components on thick-film substrates according to the reflow method. Successively, the substrates are preheated, followed by heating to the soldering temperature, after which they are cooled. A wave of molten metal of a given temperature is used for preheating, heating and cooling of the substrates.

摘要翻译： 根据回流法在厚膜基板上焊接部件的方法和装置。 接着将衬底预热，然后加热至焊接温度，然后冷却。 使用给定温度的熔融金属波进行基板的预热，加热和冷却。

公开(公告)号：US4331282A

公开(公告)日：1982-05-25

申请号：US64526

申请日：1979-08-06

申请人： Theo Janssens ,  Victor Willems

发明人： Theo Janssens ,  Victor Willems

IPC分类号： C03C27/06 ,  E06B3/673 ,  B23K1/02 ,  B23K1/18

CPC分类号： E06B3/67334 ,  E06B3/67339 ,  E06B3/6736 ,  E06B3/67386

摘要： In the manufacture of glazing panels comprising sheets marginally bonded together, in order to simplify and speed up production, a method of effecting bonding between at least one such sheet and one or more members assembled in marginal contact therewith, comprising bringing the assembly within the sphere of treatment means which is carried by a frame and causing the treatment means to act simultaneously on each side margin of the assembly to bond it together. In an apparatus for performing the method, in order to accommodate assemblies of different sizes carried by a support, each beam of the frame is coupled at one end relative to a movable coupling, whereby the end of each beam is movable along another beam in the direction of whose length its end coupling is movable, so that the size of the frame can be adjusted.

摘要翻译： 在制造包括片材边缘粘合在一起的玻璃板时，为了简化和加速生产，一种在至少一个这样的片材与一个或多个与其边缘接触组装的部件之间进行粘合的方法，包括将组件带入球体内 处理装置由框架承载并使处理装置同时在组件的每个侧边缘上起作用以将其粘合在一起。 在用于执行该方法的装置中，为了容纳由支撑件携带的不同尺寸的组件，框架的每个梁相对于可移动联接器在一端联接，由此每个梁的端部可沿着另一个梁移动 其端部联接器的长度方向可移动，从而可以调节框架的尺寸。

公开(公告)号：US4188524A

公开(公告)日：1980-02-12

申请号：US925117

申请日：1978-07-17

申请人： Luigi Trinchera

发明人： Luigi Trinchera

IPC分类号： B23D65/00 ,  B23K31/02 ,  B23K1/02

CPC分类号： B23K31/025 ,  B23D65/00

摘要： The disclosure relates to brazing tips to circular saw blades. The tips are first heated red hot between carbon electrodes. After heating brazing paste is applied to the hot tips and the tips are reheated and brazed to the saw blade.

摘要翻译： 本公开涉及到圆锯片的钎焊尖端。 首先在碳电极之间首先加热红热。 加热后将钎焊膏施加到热端，并将尖端再加热并钎焊到锯片上。

公开(公告)号：US4101066A

公开(公告)日：1978-07-18

申请号：US829559

申请日：1977-08-31

申请人： Vincent A. Corsaro ,  Ernst A. Gutbier

发明人： Vincent A. Corsaro ,  Ernst A. Gutbier

IPC分类号： B23K3/06 ,  H05K3/34 ,  B23K1/02

CPC分类号： B23K3/0653 ,  B23K2201/42 ,  H05K3/3468

摘要： In the wave soldering of terminals of an electrical device, such as a miniaturized printed circuit board assembly, the board is moved along a predetermined path so that it initially engages a first solder wave flowing counter to the direction of the board movement and subsequently engages a second solder wave flowing in the direction of board movement. The velocity of the solder in each of the solder waves is controlled independently by having separate independent pumping systems. Thus, the solder waves can be set at different independent velocities to achieve proper soldering of the terminals and associated conductor paths while reducing crossovers or bridges (i.e., shorts) between the terminals and the conductor paths as a result of the close spacing thereof.

摘要翻译： 在诸如小型化印刷电路板组件的电气设备的端子的波峰焊中，板沿着预定路径移动，使得其最初接合与板移动的方向相反流动的第一焊波，并且随后接合 第二焊波沿板移动方向流动。 每个焊波中焊料的速度由独立的独立泵送系统独立控制。 因此，可以将焊波设定为不同的独立速度，以实现端子和相关导体路径的适当焊接，同时由于其紧密间隔而减小端子与导体路径之间的交叉或桥接（即短路）。

公开(公告)号：US4033668A

公开(公告)日：1977-07-05

申请号：US674857

申请日：1976-04-08

申请人： Herman Melvin Presby

发明人： Herman Melvin Presby

IPC分类号： C03C27/08 ,  B23K1/20 ,  C03C27/02 ,  G02B6/255 ,  G02B6/42 ,  G02B5/14 ,  B23K1/02

CPC分类号： C03C27/02 ,  G02B6/2551 ,  G02B6/4202 ,  G02B6/4248 ,  Y10S228/904 ,  Y10T29/49885 ,  Y10T403/479

摘要： The present invention relates to the joining of a first glass member, such as an optical fiber, to a second member by means of solderable splices and terminations which additionally can form hermetic seals. To form the splice, termination or seal, the peripheral surface of the glass member is coated in the area of the intended joint between members with a thin adhering metallic layer. The coated glass member is properly positioned adjacent the second member and solder is flowed around the joint between the members. Where the second member is also formed of glass, a thin adhering metallic coating layer is similarly formed on the peripheral surface thereof in the area of the intended joint prior to solder being applied.

摘要翻译： 本发明涉及通过可焊接接头和另外可以形成气密密封的端子将第一玻璃构件（例如光纤）接合到第二构件。 为了形成接头，端接或密封，玻璃构件的外围表面被涂覆在具有薄的附着金属层的构件之间的预期接头的区域中。 涂覆的玻璃构件适当地邻近第二构件定位，并且焊料围绕构件之间的接头流动。 在第二构件也由玻璃形成的情况下，在施加焊料之前，在预期接头的区域中类似地在其周向表面上形成薄的附着金属涂层。

公开(公告)号：US4023725A

公开(公告)日：1977-05-17

申请号：US554969

申请日：1975-03-03

申请人： Peter Robert Ivett ,  Christopher Tooth ,  Leslie Charles Davis

发明人： Peter Robert Ivett ,  Christopher Tooth ,  Leslie Charles Davis

IPC分类号： H01L21/52 ,  H01L21/00 ,  H01L21/60 ,  H01L21/607 ,  B23K1/02 ,  H01L21/58

CPC分类号： H01L24/29 ,  H01L21/00 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32245 ,  H01L2224/83101 ,  H01L2224/8319 ,  H01L2224/83444 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/15747 ,  H01L2924/15787

摘要： A method of bonding a semiconductor body to a supporting member where the whole back face of the semiconductor body is covered with a thin evaporated layer of chromium or titanium, which layer is then covered with a thin evaporated layer of rhodium, platinum or palladium, which is in turn bonded by a film of solder to the supporting member.

摘要翻译： 将半导体本体连接到半导体主体的整个背面的薄膜蒸镀层覆盖着半导体本体的方法，然后用薄的蒸发的铑，铂或钯的蒸镀层覆盖该层。 又被一块焊料粘结到支撑件上。

公开(公告)号：US3916139A

公开(公告)日：1975-10-28

申请号：US50829174

申请日：1974-09-23

申请人： SCHANTZ SPENCER C

发明人： SCHANTZ SPENCER C

IPC分类号： B23K1/00 ,  H01R43/02 ,  B23K1/02 ,  H01F15/10

CPC分类号： H01R43/0228 ,  B23K1/0004

摘要： A tab is die cut from an internal portion of an electrical terminal strip and is offset outwardly therefrom to accommodate one end of an enameled electrical conductor which is inserted thereunder, the tab being then pressed down to clamp the conductor to the terminal, any projecting end of the conductor being simultaneously cut off. One side of an electric power source is then coupled to the main portion of the terminal and the other side of the power source is momentarily coupled to the tab. The current flow through the tab heats it above soldering temperature with the heat burning the enamel off of the conductor end adjacent the tab and melting solder which is applied to the conductor end and to adjacent surfaces to solder the conductor to the terminal.