摘要:
In a method and apparatus for the automatic joining of pins to the surfaces of articles, especially of ear pins to associated pieces of jewelry, the joining step utilizes flame soldering in the automatic joining process in order to reduce costs for small lot manufacturing and firm joining of the pin to the article. The apparatus has an article receptacle movably disposed on a base plate which also carries a solder supply gun, a pin supply and support structure and a soldering flame nozzle, all being movable between a remote rest position and an operating position in which they are properly located for performing the pin soldering task.
摘要:
A suction device, particularly intended for use as a soft-solder suction device in soldering operations. The suction device includes a housing (1) having a cylindrical chamber (2) and a suction pipe (11) connected to one end of the chamber. Arranged for axial movement in the chamber is piston (4). The piston is arranged to move extremely rapidly through the chamber, from a starting position located adjacent the suction pipe, in response to the release of a force acting automatically upon the piston. This piston movement creates a subpressure, which results in an effective suction effect at the tip of the suction pipe (11). In order to enable the suction device to be held absolutely still when movement of the piston (4) is initiated, the piston is arranged to be operated electromagnetically. The electromagnetic force is initiated by means of a switch which is separate from the suction device and which is foot-operated or arranged to be operated by some other part of the body. In order to simplify cleaning of the suction device, and to extend the intervals at which consecutive cleaning operations need be carried out, the suction pipe (11) is provided with a conically tapering suction channel (12).
摘要:
A method for producing a highly precise and inherently stable analyzer system for a multipole mass filter, wherein a tube of material that is electrically poorly conductive and thermally softenable is put over a core which is precise in size, has a higher expansion coefficient and has parallel grooves. The tube material is joined to the grooves of the core by heating and, subsequently, after cooling for the purposes of solidifying, is removed from the core with the impressed tube indentations. Before the tube is heated, layers of electrically higher conductive metallic components, which can be easily connected to the softenable tube material, are applied between the core and the tube in the region of the grooves. The layer material is connected to the tube material when the tube is softened and joined to the grooves of the tube. When removing the tube that has been shaped in this manner, the layers connected to the impressed tube indentations are also removed from the core. An analyzer system produced according to the inventive method is also disclosed.
摘要:
A method and apparatus for repairing a radiator having a header and tubes that extend into the header which may develop leaks. The apparatus is made up of a U-shaped rod or wire that is slipped over the tube adjacent the header and the U-shaped rod or wire is soldered in place around the tube.
摘要:
A process for soldering a metal substrate coated with an electrodeposited non-peelable coating comprising 35-65 wt parts of methacryl ester, 10-40 wt parts of acrylonitrile, 2-15 wt parts of methacrylic acid, 3-10 wt parts of acrylamide and/or vinyl acetate, in 100 parts of resin.
摘要:
To ensure good pressure distribution to the individual conductor pairs to be solder-joined when effecting infrared-light soldering of a set of conductors on a flexible infrared-pervious substrate to a second set of conductors on a second substrate, a strip-type focussed infra-red source is equipped with a pressure pad which is pivotally supported by trunnions resting on pressure application spring bars, and which consist of a quartz bar fitted at its pressure-transmission face with a pressure-distribution pad made of SYLGARD 182 silicone resin, a material which has a high infra-red transmission combined with good resilience and temperature resistance.
摘要:
A method for bonding silicon chips to a cold substrate including the steps of mounting the chip on a gold plated Kovar tab; placing a solder preform on a gold lane of the substrate, positioning the tab on the solder preform, and passing a welding pulse through the Kovar tab to melt and reflow the solder preform.
摘要:
This invention provides a machine for simultaneously soldering or unsoldering a multiple connection component on a printed circuit board. The machine consists of a pot suitable for holding liquid at a temperature above the melting point of solder. A piston is fitted in the pot, and there is a channel passing through the piston. When the piston is depressed the hot liquid held in the pot rises up through the channel. The component to be soldered or unsoldered is positioned so that the surface of the hot displaced liquid comes in contact with the joints to be soldered or unsoldered.
摘要:
A method and apparatus for stripping and soldering very fine insulated wire. A number of such wires may be stripped and soldered simultaneously whereby the insulated wires are each positioned above an associated terminal pad, a radiation transparent rod is firmly urged against all of the wires and is vibrated preferably in a reciprocating fashion, in a direction parallel to the length of the wires, substantially simultaneously with the application of radiation from a heat source which simultaneously irradiates all of the wires and their associated pads through the radiation-transmissive element. The radiation focused upon the wires causes a solder predeposited upon the terminal pads to melt and wet the pads, and also heat the wire whereby the insulation is softened to the point where it is split by the reciprocating force and is floated away by the solder which runs through the ruptured insulation and up and around the bare wire to form an excellent solder joint between the wire and pad, and wherein the heat applied is sufficient to form a good solder joint and yet insufficient to damage any neighboring heatsensitive elements.