摘要:
A semiconductor memory cell and an associated fabrication method are provided in which a storage capacitor is connected to a selection transistor. The storage capacitor is formed in a trench of a semiconductor substrate. At the trench surface, a capacitor dielectric and an electrically conductive filling layer are formed thereon for realization of a capacitor counterelectrode. The filling layer has a projection that extends outside the trench as far as the drain region and is electrically connected thereto.
摘要:
One or more embodiments relate to an electronic device comprising a circuitry and a programmable resistive element. The programmable resistive element comprises a first and a second state, wherein the programmable resistive element is configured to allow switching from the second state into the first state in response to a signal comprising at least a predefined level. The circuitry is configured to provide signals up the predefined level, wherein the circuitry is configured to provide a switch signal to the programmable resistive element, wherein the switch signal causes switching from the first into the second state.
摘要:
An explanation is given of, inter alia, tunnel field effect transistors having a thicker gate dielectric (GD1) in comparison with other transistors (T2) on the same integrated circuit arrangement (10). As an alternative or in addition, said tunnel field effect transistors have gate regions at mutually remote sides of a channel forming region or an interface between the connection regions (D1, S1) of the tunnel field effect transistor.
摘要:
An integrated circuit has one or more logic gates and a control circuit. The control circuit has one or more control elements coupled to the logic gates. The control circuit controls the states of the one or more logic gates. The one or more control elements have one or more programmable resistance elements and/or one or more threshold switching elements.
摘要:
Embodiments of the invention describe compact memory arrays. In one embodiment, the memory cell array includes first, second, and third gate lines disposed over a substrate, the second gate lines are disposed between the first and the third gate lines. The first, the second, and the third gate lines form adjacent gate lines of the memory cell array. The memory cell array further includes first metal lines disposed over the first gate lines, the first metal lines coupled to the first gate lines; second metal lines disposed over the second gate lines, the second metal lines coupled to the second gate lines; and third metal lines disposed over the third gate lines, the third metal lines coupled to the third gate lines. The first metal lines, the second metal lines and the third metal lines are disposed in different metallization levels.
摘要:
A structure and method for increasing the operating speed and reducing the overall programming time of a memory array are provided herein. The method and structure reduce the maximum write current consumption, for writing a plurality of data bits to a NVM array, by writing the data bits sharing an activated word line at different times (e.g., activating bit lines associated with an activated word line at different times). The write operation of respective data bits, which individually utilize only a fraction of the overall write window of the bits, are interleaved so that the maximum write current of respective bits are offset in time from the maximum write current of another bit, allowing a larger number of data bits to be written without exceeding system specifications (e.g., maximum current) and reducing overall memory write time.
摘要:
One or more embodiments relate to an electronic device comprising a circuitry and a programmable resistive element. The programmable resistive element comprises a first and a second state, wherein the programmable resistive element is configured to allow switching from the second state into the first state in response to a signal comprising at least a predefined level. The circuitry is configured to provide signals up the predefined level, wherein the circuitry is configured to provide a switch signal to the programmable resistive element, wherein the switch signal causes switching from the first into the second state.
摘要:
In one embodiment, a bit-line driver has a first driver having a source terminal coupled to a high-voltage supply bus and a drain terminal coupled to the bit-line, and a second driver having a source terminal coupled to a high-voltage return bus and a drain terminal coupled to the bit line. The bit-line driver also has a first pre-driver coupled to a gate terminal of the first driver and a second pre-driver coupled to a gate terminal of the second driver. The first and second drivers use a first type of transistor, and the first and second pre-drivers use a second type of transistor. The first type of transistor is rated at a higher voltage than the second type of transistor.
摘要:
In one embodiment, a bit-line driver has a first driver having a source terminal coupled to a high-voltage supply bus and a drain terminal coupled to the bit-line, and a second driver having a source terminal coupled to a high-voltage return bus and a drain terminal coupled to the bit line. The bit-line driver also has a first pre-driver coupled to a gate terminal of the first driver and a second pre-driver coupled to a gate terminal of the second driver. The first and second drivers use a first type of transistor, and the first and second pre-drivers use a second type of transistor. The first type of transistor is rated at a higher voltage than the second type of transistor.
摘要:
A method of operating an integrated circuit includes determining a resistance value of at least one resistivity-changing memory cell when the memory cell is in a low-resistance state, the at least one resistivity-changing memory cell configured to be programmable to at least the low-resistance state and a high-resistance state, comparing the resistance value to a threshold value, selecting, based on the comparison, a cell reset process to be employed for programming the at least one resistivity-changing memory cell to the high-resistance state. The selecting includes selecting a predetermined reset process as the cell reset process when the resistance value is less than the threshold value, and adjusting the predetermined process and selecting the adjusted predetermined reset process as the cell reset process when the resistance value is at least equal to the threshold value.