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240 条记录 (耗时 0.048 秒)

    Method for detecting and compensating for positional displacements in photolithographic mask units and apparatus for carrying out the method
    64.
    发明授权
    Method for detecting and compensating for positional displacements in photolithographic mask units and apparatus for carrying out the method 有权
    用于检测和补偿光刻掩模单元中的位置位移的方法和用于执行该方法的装置

    公开(公告)号：US07087910B2

    公开(公告)日：2006-08-08

    申请号：US10835217

    申请日：2004-04-29

    申请人： Jens Schneider ,  Tarek Lutz

    发明人： Jens Schneider ,  Tarek Lutz

    IPC分类号： H01J37/304

    CPC分类号： H01J37/3174 ,  B82Y10/00 ,  B82Y40/00 ,  H01J2237/30438 ,  H01J2237/30461 ,  H01J2237/31788 ,  H01J2237/31793

    摘要： A method for detecting and compensating for positional displacements of a photolithographic mask unit, includes providing mask production data for the writing of the mask unit with an electron beam. A structure density of the mask unit is input and an electron beam deflection is brought about on the mask unit in dependence on the determined structure density of the mask unit. The mask production data are corrected through the use of the determined electron beam deflection, in order to obtain corrected mask production data, and the corrected mask production data are output. A lithography apparatus for mask units with correction of positional displacements of the mask unit, is also provided.

    摘要翻译： 一种用于检测和补偿光刻掩模单元的位置位移的方法，包括提供用于用电子束写入掩模单元的掩模生产数据。 输入掩模单元的结构密度，并根据确定的掩模单元的结构密度在掩模单元上产生电子束偏转。 通过使用确定的电子束偏转来校正掩模生产数据，以获得校正的掩模生产数据，并且输出校正的掩模生产数据。 还提供了一种用于具有校正掩模单元的位置位移的掩模单元的光刻设备。

    Thin-film magnetic recording head manufacture
    65.
    发明授权
    Thin-film magnetic recording head manufacture 有权

    公开(公告)号：US07045275B2

    公开(公告)日：2006-05-16

    申请号：US10462389

    申请日：2003-06-16

    申请人： Randall Grafton Lee ,  Charles J. Libby

    发明人： Randall Grafton Lee ,  Charles J. Libby

    IPC分类号： G11B5/187 ,  G03C5/00

    CPC分类号： G11B5/3967 ,  G11B5/1871 ,  G11B5/3116 ,  G11B5/3163 ,  G11B5/3166 ,  H01J37/3056 ,  H01J2237/30438 ,  Y10S430/143 ,  Y10T428/11 ,  Y10T428/1186

    摘要： This invention relates to a multi-layer lithographically fabricated device used to produce improved thin-film recording heads. It further relates to a focused particle beam system for milling a recording head pole-tip assembly without irradiating a sensitive structure, e.g. a read head, of the recording head. The invention precisely forms a pole-tip assembly by milling a second structural element without irradiating a first structural element. The invention avoids irradiating the first structural element by placing a first marker element, which can be imaged and/or damaged, in the same layer of a multi-layer lithographically fabricated device as the first structural element. The marker element has a fixed spatial relationship to the first structural element. Thus, by imaging the first marker element and the second structural element, and knowing the separation between the first structural element and the first marker element, a focused particle beam system can determine the relative location of the first and second structural elements. Consequently, the focused particle beam system can determine, without irradiating the sensitive first structural element, which portions of the second structural element require milling. In this manner, the focused particle beam system mills the second structural element to produce a desired pole-tip configuration. By producing a desired pole-tip configuration, these methods and apparatus produce an improved recording head capable of higher storage density than prior art techniques.

    Wafer alignment method for dual beam system
    66.
    发明申请
    Wafer alignment method for dual beam system 失效

    公开(公告)号：US20060091321A1

    公开(公告)日：2006-05-04

    申请号：US11258939

    申请日：2005-10-27

    申请人： Hiroyasu Kaga ,  Hiroyuki Suzuki ,  Yutaka Hojyo

    发明人： Hiroyasu Kaga ,  Hiroyuki Suzuki ,  Yutaka Hojyo

    IPC分类号： G01N23/00

    CPC分类号： G01N23/225 ,  H01J2237/30438 ,  H01J2237/3045

    摘要： A gradient charged particle beam apparatus capable of moving highly accurately to a specific position by eliminating influences of warp inside a wafer surface is provided. A portion 46 having a mark 47 for aligning visual field alignment positioned in advance to the same horizontal and the same height as a stage plane as a reference point is arranged on a wafer holder. A height of an observation point on a sample is adjusted to the height of the mark 47 and the visual field of a gradient column is brought into conformity with the visual field of a vertical column by use of a known offset between the gradient column and the vertical column at that time.

    System and method for integrated multi-use optical alignment
    68.
    发明授权
    System and method for integrated multi-use optical alignment 有权

    公开(公告)号：US06952255B2

    公开(公告)日：2005-10-04

    申请号：US10636086

    申请日：2003-08-06

    申请人： Andrew Perry ,  Robert Steger ,  Neil Benjamin

    发明人： Andrew Perry ,  Robert Steger ,  Neil Benjamin

    IPC分类号： G01C1/00 ,  H01L21/68 ,  G01B11/26

    CPC分类号： G01C1/00 ,  H01J2237/30438 ,  H01L21/681

    摘要： An optical alignment system for use in a semiconductor processing system is provided. The optical alignment system includes a wafer chuck that has an alignment feature integrated into the top surface of the wafer chuck. In addition, a beam-forming system, which is capable of emitting an optical signal onto the alignment feature, is disposed above the wafer chuck. Also, a detector is included that can detect an amplitude of the optical signal emitted onto the alignment feature. In one aspect, the alignment feature can be a reflective alignment feature that reflects a portion of the optical signal back to the beam detector. In additional aspect, the alignment feature can be a transmittance alignment feature capable of allowing a portion of the optical signal to pass through the wafer chuck to the detector. In this aspect, the detector can be disposed below the wafer chuck.

    Thin-film magnetic recording head manufacture using selective imaging
    69.
    发明授权
    Thin-film magnetic recording head manufacture using selective imaging 失效
    使用选择性成像制造薄膜磁记录头

    公开(公告)号：US06824644B2

    公开(公告)日：2004-11-30

    申请号：US10024639

    申请日：2001-12-18

    申请人： Gregory J. Athas ,  Russel Mello

    发明人： Gregory J. Athas ,  Russel Mello

    IPC分类号： C23F1000

    CPC分类号： G11B5/3967 ,  G11B5/1871 ,  G11B5/3116 ,  G11B5/3163 ,  G11B5/3166 ,  H01J37/3056 ,  H01J2237/30438

    摘要： A focused particle beam system, according to one embodiment of the invention, precisely shapes a pole-tip assembly formed by a multi-layer device having a first layer with a first structural element, a second layer with a second structural element, and a shielding layer with a shielding element, the shielding element being located between the first layer and the second layer. The system images a selected portion of the multi-layer device to locate the shielding element and thereby avoids irradiating the first structural element. Based on the location of the shielding element, the system images and mills the second structural element without irradiating the first structural element. In this manner, the focused particle beam system mills the second structural element to produce a desired pole-Up configuration. By producing a desired pole-tip configuration, these methods and apparatus produce a recording transducer capable of high storage density.

    摘要翻译： 根据本发明的一个实施例的聚焦粒子束系统精确地形成由具有第一层与第一结构元件的多层器件形成的极尖组件，具有第二结构元件的第二层和屏蔽层 所述屏蔽元件位于所述第一层和所述第二层之间。 系统对多层设备的选定部分进行成像以定位屏蔽元件，从而避免照射第一结构元件。 基于屏蔽元件的位置，系统对第二结构元件进行成像和研磨，而不照射第一结构元件。 以这种方式，聚焦的粒子束系统研磨第二结构元件以产生期望的极点配置。 通过产生期望的极尖构造，这些方法和装置产生能够高存储密度的记录换能器。

    Charged-particle-beam mapping projection-optical systems and methods for adjusting same
    70.
    发明授权
    Charged-particle-beam mapping projection-optical systems and methods for adjusting same 有权
    带电粒子束映射投影光学系统及其调整方法

    公开(公告)号：US06765217B1

    公开(公告)日：2004-07-20

    申请号：US09302075

    申请日：1999-04-28

    申请人： Hiroshi Nishimura ,  Naoto Kihara ,  Kinya Kato ,  Toru Takagi ,  Akihiro Goto ,  Junji Ikeda ,  Kazuya Okamoto

    发明人： Hiroshi Nishimura ,  Naoto Kihara ,  Kinya Kato ,  Toru Takagi ,  Akihiro Goto ,  Junji Ikeda ,  Kazuya Okamoto

    IPC分类号： G01N2100

    CPC分类号： H01J37/26 ,  G01N23/225 ,  H01J37/1471 ,  H01J37/226 ,  H01J37/265 ,  H01J2237/0492 ,  H01J2237/057 ,  H01J2237/1501 ,  H01J2237/2482 ,  H01J2237/2538 ,  H01J2237/262 ,  H01J2237/2806 ,  H01J2237/2817 ,  H01J2237/282 ,  H01J2237/2823 ,  H01J2237/2826 ,  H01J2237/30438

    摘要： Charged-particle-beam (CPB) mapping projection-optical systems and adjustment methods for such systems are disclosed that can be performed quickly and accurately. In a typical system, an irradiation beam is emitted from a source, passes through an irradiation optical system, and enters a Wien filter (“E×B”). Upon passing through the E×B, the irradiation beam passes through an objective optical system and is incident on an object surface. Such impingement generates an observation beam that returns through the objective optical system and the E×B in a different direction to a detector via an imaging optical system. An adjustment-beam source emits an adjustment beam used for adjusting and aligning the position of, e.g., the object surface and/or the Wien's condition of the E×B. The adjustment beam can be off-axis relative to the objective-optical system. For such adjusting and aligning, fiducial marks (situated, e.g., in the plane of the object surface) can be used that are optimized for the CPB optical system and the off-axis optical system. Desirably, the image formed on the detector when electrical voltage and current are not applied to the E×B is in the same position as the image formed on the detector when electrical voltage and current are applied to the E×B. Also provided are “evaluation charts” for use in such alignments that do not require adjustment of the optical axis of the irradiation optical system, and from which the kinetic-energy distribution of the emitted adjustment beam is stable.

    摘要翻译： 公开了可以快速且准确地执行这种系统的带电粒子束（CPB）映射投影光学系统和调整方法。 在典型的系统中，照射光束从光源发射，通过照射光学系统，并进入维恩滤光片（“ExB”）。 当通过ExB时，照射光束通过物镜光学系统并入射到物体表面上。 这种冲击产生观察光束，该观察光束经由成像光学系统通过物镜光学系统和ExB以不同的方向返回到检测器。 调整光束源发射用于调整和对准例如物体表面的位置和/或ExB的维恩状态的调节光束。 调节光束可以相对于物镜光学系统偏轴。 对于这种调整和对准，可以使用为CPB光学系统和离轴光学系统优化的基准标记（例如位于物体表面的平面中）。 理想地，当电压和电流未施加到ExB时，在检测器上形成的图像与当将电压和电流施加到ExB时形成在检测器上的图像位于相同的位置。 还提供了用于这种对准的“评估图”，其不需要调整照射光学系统的光轴，并且发射的调节光束的动能分布从该距离稳定。