摘要:
According to one embodiment, a photomask includes a mask substrate transparent to light, a light shielding pattern formed on the mask substrate, and a thin film portion that is provided at a part of the light shielding pattern and is thinned to have a higher light transmittance than the light shielding pattern, in which the thin film portion is arranged with respect to a light shielding pattern that is sensitive to a focus shift so that a sensitivity becomes stable and is not arranged with respect to a light shielding pattern whose sensitivity to a focus shift is stable.
摘要:
According to one embodiment, a template substrate includes a substrate and a mask. The substrate includes a mesa region formed in a central portion of an upper surface of the substrate. The mesa region is configured to protrude more than a region of the substrate around the mesa region. An impurity is introduced into an upper layer portion of a partial region of a peripheral portion of the mesa region. The mask film is provided on the upper surface of the substrate.
摘要:
A method for removing foreign matter attached to a photomask, includes: irradiating the foreign matter with an electron beam in an etching gas atmosphere in which the foreign matter or a bottom surface of the photomask is etched by irradiation with the electron beam; or irradiating the foreign matter with the electron beam in a deposition gas atmosphere in which a solid material is generated by irradiation with the electron beam to deposit the solid material on the foreign matter, and applying a force to the solid material with an AFM probe.
摘要:
A tip of a carbon nanotube is lowered toward a recess where a foreign object exists to cause the tip of the carbon nanotube to contact a bottom face of the recess. Subsequently, the carbon nanotube is further lowered to cause the carbon nanotube to sag, and a side face of the carbon nanotube is pressed against the bottom face of the recess. A force is applied to the foreign object by moving the carbon nanotube on the bottom face of the recess in a state where the side face is pressed against the bottom face of the recess.
摘要:
Disclosed is a mask comprising a first area including a first surrounding area in which a halftone phase shift film or a stacked film of a halftone phase shift film and an opaque film is provided on a transparent substrate, and a first opening area surrounded by the first surrounding area, and a second area including a second surrounding area in which a halftone phase shift film is provided on the transparent substrate and a second opening area surrounded by the second surrounding area, wherein a transparent film is provided in at least a part of the second opening area, the transparent film being configured to give a predetermined phase difference to exposure light passing through that part of the second opening area in which the transparent film is provided relative to exposure light passing through the second surrounding area.
摘要:
A method of correcting a photomask, comprises preparing a photomask substrate with a mask pattern including a phase shift pattern, forming a reference hole by removing a part of the mask pattern, applying an ion beam from an ion beam source to an area including the reference hole to allow secondary charged particles to be released from the reference hole, obtaining a position of the reference hole by detecting the secondary charged particles by a detector, calculating a positional relationship between the obtained position of the reference hole and a position of a defect of the mask pattern, and correcting the defect by applying an ion beam from the ion beam source to the defect, based on the calculated positional relationship, wherein a pattern of the reference hole, as viewed in a direction perpendicular to a top surface of the photomask substrate, is substantially rectangular, and a longitudinal direction of the rectangular pattern is parallel to a longitudinal direction of the phase shift pattern.
摘要:
According to one embodiment, an imprint mask includes a quartz plate. The quartz plate has a plurality of concave sections formed in part of an upper surface on the quartz plate, and impurities are contained in a portion between the concave sections in the quartz plate.
摘要:
According to an aspect of the present invention, there is provided a method for correcting a defect in an EUV mask, the method including: preparing an EUV mask including an absorption layer and an anti-reflection layer forming a pattern; recognizing a defect region in the pattern; defining a first region and a second region on the defect region, the second region extending from a desired pattern edge by a given distance, the first region being defined on the rest; removing the first region of the anti-reflection layer and the absorption layer by irradiating a beam in a first atmosphere; removing the second region of the anti-reflection layer and the absorption layer by irradiating the beam in a second atmosphere; and oxidizing an exposed side surface of the desired pattern edge of the absorption layer.
摘要:
According to one embodiment, a photomask includes a mask substrate transparent to light, a light shielding pattern formed on the mask substrate, and a thin film portion that is provided at a part of the light shielding pattern and is thinned to have a higher light transmittance than the light shielding pattern, in which the thin film portion is arranged with respect to a light shielding pattern that is sensitive to a focus shift so that a sensitivity becomes stable and is not arranged with respect to a light shielding pattern whose sensitivity to a focus shift is stable.
摘要:
According to one embodiment, an imprint mask includes a quartz plate. The quartz plate has a plurality of concave sections formed in part of an upper surface on the quartz plate, and impurities are contained in a portion between the concave sections in the quartz plate.