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    Electroless gold plating liquid
    62.
    发明授权
    Electroless gold plating liquid 有权
    化学镀金液

    公开(公告)号：US07419536B2

    公开(公告)日：2008-09-02

    申请号：US10558173

    申请日：2004-02-18

    Applicant: Akihiro Aiba ,  Yoshiyuki Hisumi ,  Kazumi Kawamura

    Inventor： Akihiro Aiba ,  Yoshiyuki Hisumi ,  Kazumi Kawamura

    IPC: C23C18/31

    CPC classification number: C23C18/42 ,  C23C18/54

    Abstract: There is provided a cyanide-free immersion type electroless gold plating liquid that is low in toxicity, can be used near a neutral ph, and has a good solder adhesion and plating film adhesion. The electroless gold plating liquid contains a cyanide-free water-soluble gold compound and a pyrosulfurous acid compound. The plating liquid may further contain a sulfurous acid compound and an aminocarboxylic acid compound. Pyrosulfurous acid or an alkali metal, alkaline earth metal, ammonium, or another such salt thereof can be used as the pyrosulfurous acid compound.

    Abstract translation: 提供了一种毒性低的无氰浸没式无电镀金液，可以在中性PH附近使用，具有良好的焊接粘附性和电镀膜附着力。 化学镀金液含有不含氰化物的水溶性金化合物和焦亚硫酸化合物。 电镀液还可以含有亚硫酸化合物和氨基羧酸化合物。 可以使用焦亚磺酸或其碱金属，碱土金属，铵或其它盐作为焦亚硫酸化合物。

    Solution and process for improving the solderability of a metal surface
    65.
    发明申请
    Solution and process for improving the solderability of a metal surface 有权
    解决方案和改进金属表面可焊性的工艺

    公开(公告)号：US20070056464A1

    公开(公告)日：2007-03-15

    申请号：US11226613

    申请日：2005-09-14

    Applicant: Roger Bernards

    Inventor： Roger Bernards

    IPC: C23C18/31 ,  B05D5/12

    CPC classification number: B23K35/3006 ,  B23K35/3613 ,  C23C18/42

    Abstract: The invention is directed to a solution and process for improving the solderability of a metal surface. In one embodiment, the invention is a silver deposit solution comprising an acid, a source of silver ions, and an additive selected from among pyrroles, triazoles, and tetrazoles, as well as derivatives and mixtures of those components. In another embodiment, the silver deposit solution also includes a 6-membered heterocyclic ring compound, wherein three members of the 6-membered heterocyclic ring are nitrogen atoms. Still another embodiment is a process for improving the solderability of a metal surface which involves applying a silver deposit solution as previously described to a metal surface.

    Abstract translation: 本发明涉及一种用于改善金属表面的可焊性的方法和方法。 在一个实施方案中，本发明是包含酸，银离子源和选自吡咯，三唑和四唑的添加剂的银沉积溶液，以及这些组分的衍生物和混合物。 在另一个实施方案中，银沉积溶液还包括6元杂环化合物，其中6元杂环的3个成员为氮原子。 另一个实施方案是一种用于改善金属表面的可焊性的方法，其涉及如前所述向金属表面施加银沉积溶液。

    Plating method
    66.
    发明授权
    Plating method 失效
    电镀方法

    公开(公告)号：US06911230B2

    公开(公告)日：2005-06-28

    申请号：US10303687

    申请日：2002-11-23

    Applicant: Miriana Kanzler

    Inventor： Miriana Kanzler

    IPC: C23C18/54 ,  C23C18/28 ,  C23C18/42 ,  C23C18/44 ,  H05K3/24 ,  B05D1/18 ,  B05D1/36 ,  B05D3/10

    CPC classification number: H05K3/244 ,  C23C18/28 ,  C23C18/42

    Abstract: Disclosed are methods of depositing electroless gold layers on a metal substrate using a catalytic palladium deposit. Such electroless gold layers have increased adhesion as compared to conventional electroless gold deposits.

    Abstract translation: 公开了使用催化钯沉积物在金属基底上沉积无电镀金层的方法。 与常规的无电金沉积物相比，这种无电金层具有增加的粘附力。

    Bath and method of electroless plating of silver on metal surfaces
    67.
    发明授权
    Bath and method of electroless plating of silver on metal surfaces 失效
    银和金属表面化学镀银的方法

    公开(公告)号：US06869637B2

    公开(公告)日：2005-03-22

    申请号：US10362087

    申请日：2001-09-21

    Applicant: Carl Hutchinson ,  Hartmut Mahlkow ,  Christian Sparing

    Inventor： Carl Hutchinson ,  Hartmut Mahlkow ,  Christian Sparing

    IPC: C23C18/42 ,  H05K3/24 ,  B05D7/14 ,  B05D7/24 ,  C23C18/54

    CPC classification number: H05K3/244 ,  C23C18/42

    Abstract: Known methods of improving the solderability of copper surfaces on printed circuit boards present the disadvantage that outer layers of an irregular thickness are formed at the metal surfaces, that these layers are very expensive or that the constituents used in manufacturing them are harmful to the environment. Furthermore, the metal surfaces are to be suited to form bond connections as well as electrical contacts. To overcome these problems there are disclosed a bath and a method of electroless plating of silver by way of charge exchange reaction on surfaces of metals that are less noble than silver, more particularly on copper, that contain at least one silver halide complex and not containing any reducing agent for Ag+ ions.

    Abstract translation: 改善印刷电路板上铜表面的可焊性的已知方法存在这样的缺点，即在金属表面形成不规则厚度的外层，这些层非常昂贵，或者用于制造它们的组分对环境有害。 此外，金属表面也适合于形成接合连接以及电接点。 为了克服这些问题，公开了一种浴和一种通过电荷交换反应在金属表面上进行化学镀银的方法，所述金属的表面比银，更特别地在铜上，比含有至少一个卤化银配合物的不贵， 任何Ag +离子还原剂。

    Method for forming metal pattern
    68.
    发明申请
    Method for forming metal pattern 审中-公开
    金属图案形成方法

    公开(公告)号：US20040086806A1

    公开(公告)日：2004-05-06

    申请号：US10469841

    申请日：2003-09-04

    Inventor： Hiroshi Tsushima

    IPC: G03F007/20 ,  G03F007/30 ,  G03F007/40

    CPC classification number: C23C18/31 ,  C23C18/1605 ,  C23C18/1844 ,  C23C18/42 ,  C23C18/54 ,  G03F7/0757 ,  G03F7/405 ,  H05K3/185

    Abstract: A method for forming a metal pattern, characterized in that it comprises applying a photosensitive resin composition containing a polysilane having a weight average molecular weight of 10,000 or more and being soluble in an organic solvent, a photosensitive radical generating agent, an oxidizing agent, an alkoxy group-containing silicone compound and an organic solvent on a substrate, to form a photosensitive layer, exposing a region of the photosensitive layer corresponding with the metal pattern to a light, followed by developing, to thereby form a groove in the photosensitive layer, contacting the photosensitive layer with a solution containing a palladium salt or the like, to thereby allow an exposed part in the groove to absorb palladium or the like, contacting the photosensitive layer with an electroless plating solution, to thereby deposit a metal film on the part in the groove having absorbed palladium or the like and form the metal pattern.

    Abstract translation: 一种形成金属图案的方法，其特征在于，它包括涂覆含有重均分子量为10,000或更大并且可溶于有机溶剂的聚硅烷的感光性树脂组合物，感光性自由基产生剂，氧化剂， 含有烷氧基的硅氧烷化合物和有机溶剂形成感光层，将与金属图案对应的感光层的区域曝光，然后显影，从而在感光层上形成凹槽， 使感光层与含有钯盐等的溶液接触，从而允许凹槽中的暴露部分吸收钯等，使感光层与化学镀溶液接触，从而在部件上沉积金属膜 在吸收钯等的槽中形成金属图案。

    Method for forming a metallic mirror surface on a receiving surface
    69.
    发明申请
    Method for forming a metallic mirror surface on a receiving surface 失效
    在接收面上形成金属镜面的方法

    公开(公告)号：US20030197961A1

    公开(公告)日：2003-10-23

    申请号：US10439903

    申请日：2003-05-16

    Inventor： Akihiro TAkahagi ,  Yuji Kanomata

    IPC: G02B005/08 ,  G02B007/182

    CPC classification number: C23C18/285 ,  C23C18/165 ,  C23C18/1841 ,  C23C18/1889 ,  C23C18/2086 ,  C23C18/24 ,  C23C18/30 ,  C23C18/42 ,  C23C18/44 ,  G02B5/08 ,  Y10S359/90

    Abstract: A method for forming a metallic mirror surface on a receiving surface is shown. The method comprises the steps of: cleaning the underlay surface; spraying on the receiving surface an activating treatment agent solution wherein the activating treatment agent solution contains a hydrochloric acid solution including about 10 cc to about 44 cc of hydrochloric acid, about 1.5 g to about 5 g of stannous chloride and about 0.001 g to about 0.005 g of a precious metal salt of at least one of a silver nitrate, palladium chloride, gold chloride and platinum chloride per 1 liter of water for use as an activating treatment agent for forming a metallic mirror surface on a receiving surface which is treated with the hydrochloric acid solution as an activating treatment agent solution; and separately spraying concurrently on the underlay surface a reacting metal salt and a reducing agent to form the metallic mirror surface.

    Abstract translation: 示出了在接收表面上形成金属镜面的方法。 该方法包括以下步骤：清洁底层表面; 在接收表面上喷涂活化处理剂溶液，其中活化处理剂溶液含有包含约10cc至约44cc盐酸的盐酸溶液，约1.5g至约5g氯化亚锡和约0.001g至约0.005 g每1升水中的硝酸银，氯化钯，氯化金和氯化铂中的至少一种的贵金属盐，用作在接收表面上形成金属镜面的活化处理剂，该接收表面用 盐酸溶液作为活化处理剂溶液; 并且在底层表面上分别喷涂反应性金属盐和还原剂以形成金属镜面。

    Activation of a cathode
    70.
    发明申请
    Activation of a cathode 失效
    活化阴极

    公开(公告)号：US20030159923A1

    公开(公告)日：2003-08-28

    申请号：US10332048

    申请日：2003-02-25

    Inventor： Lars-Erik Bergman ,  Erik Zimmerman ,  Tomas Widenfalk ,  Bernd Busse

    IPC: C25B011/04

    CPC classification number: C25B11/04 ,  C23C18/42 ,  C25B11/00 ,  C25B11/0473

    Abstract: The present invention relates to a method for activation of a cathode comprising at least a cathode substrate wherein the cathode is cleaned by means of an acid, the cleaned cathode is coated with at least one electrocatalytic coating solution, drying the coated cathode until it is at least substantially dry, and thereafter contacting the cathode with a solvent redissolving precipitated electrocatalytic salts or acids formed on the cathode, originating from the electrocatalytic solution, to form dissolved electrocatalytic metal ions on the cathode surface, so that said electrocatalytic metal ions can precipitate as metals on the cathode. The invention also comprises a cathode obtainable by the method and the use of an activated cathode in an electrolytic cell for producing chlorine and alkali hydroxide.

    Abstract translation: 本发明涉及一种活化阴极的方法，其至少包括阴极基底，其中阴极通过酸进行清洁，清洁的阴极涂覆有至少一种电催化涂层溶液，干燥涂覆的阴极直至其处于 至少基本上干燥，然后使阴极与源自电催化剂溶液的在阴极上形成的沉淀的电催化盐或酸的溶剂再溶解形成溶解的电催化金属离子，使得所述电催化金属离子可以作为金属沉淀 在阴极上。 本发明还包括通过该方法获得的阴极和在用于生产氯和碱性氢氧化物的电解池中使用活性阴极。

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