A method for forming a metal pattern, characterized in that it comprises applying a photosensitive resin composition containing a polysilane having a weight average molecular weight of 10,000 or more and being soluble in an organic solvent, a photosensitive radical generating agent, an oxidizing agent, an alkoxy group-containing silicone compound and an organic solvent on a substrate, to form a photosensitive layer, exposing a region of the photosensitive layer corresponding with the metal pattern to a light, followed by developing, to thereby form a groove in the photosensitive layer, contacting the photosensitive layer with a solution containing a palladium salt or the like, to thereby allow an exposed part in the groove to absorb palladium or the like, contacting the photosensitive layer with an electroless plating solution, to thereby deposit a metal film on the part in the groove having absorbed palladium or the like and form the metal pattern.