公开(公告)号：US08525314B2

公开(公告)日：2013-09-03

申请号：US11666975

申请日：2005-11-03

Applicant: Belgacem Haba ,  Craig S. Mitchell ,  Masud Beroz

Inventor： Belgacem Haba ,  Craig S. Mitchell ,  Masud Beroz

IPC: H01L23/02

CPC classification number: H01L24/81 ,  H01L21/56 ,  H01L21/78 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/97 ,  H01L25/105 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A plurality of microelectronic assemblies (60) are made by severing an in-process unit including an upper substrate (40) and lower substrate (20) with microelectronic elements (36) disposed between the substrates. In a further embodiment, a lead frame (452) is joined to a substrate (440) so that the leads project from this substrate. Lead frame (452) is joined to a further substrate (470) with one or more microelectronic elements (436, 404, 406) disposed between the substrates.

公开(公告)号：US20110269272A1

公开(公告)日：2011-11-03

申请号：US13183122

申请日：2011-07-14

Applicant: Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

Inventor： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

IPC: H01L21/56

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.

Abstract translation: 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。

公开(公告)号：US20100258956A1

公开(公告)日：2010-10-14

申请号：US12789683

申请日：2010-05-28

Applicant: Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

Inventor： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

IPC: H01L23/48

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.

Abstract translation: 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超出微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。

公开(公告)号：US07745943B2

公开(公告)日：2010-06-29

申请号：US11799771

申请日：2007-05-03

Applicant: Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

Inventor： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John B. Riley, III ,  Ilyas Mohammed

IPC: H01L23/52 ,  H01L23/48 ,  H01L29/40

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.

Abstract translation: 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。

公开(公告)号：US20090071000A1

公开(公告)日：2009-03-19

申请号：US12291853

申请日：2008-11-14

Applicant: Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David B. Tuckerman

Inventor： Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David B. Tuckerman

IPC: H01R43/20

CPC classification number: H01L24/48 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/49 ,  H01L2224/0233 ,  H01L2224/02377 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/49208 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.

Abstract translation: 用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其他方式减小至少一些柱的高度从电介质元件突出的柱。

公开(公告)号：US07462936B2

公开(公告)日：2008-12-09

申请号：US10959465

申请日：2004-10-06

Applicant: Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David B. Tuckerman

Inventor： Belgacem Haba ,  Masud Beroz ,  Young-Gon Kim ,  David B. Tuckerman

IPC: H01L23/48

CPC classification number: H01L24/48 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/49 ,  H01L2224/0233 ,  H01L2224/02377 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  Y10T29/49208 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A connection component for mounting a chip or other microelectronic element is formed from a starting unit including posts projecting from a dielectric element by crushing or otherwise reducing the height of at least some of the posts.

Abstract translation: 用于安装芯片或其他微电子元件的连接部件由起动单元形成，起动单元包括通过压碎或以其它方式减小至少一些柱的高度从电介质元件伸出的柱。

公开(公告)号：US07427423B2

公开(公告)日：2008-09-23

申请号：US09942386

申请日：2001-08-30

Applicant: Masud Beroz ,  Belgacem Haba

Inventor： Masud Beroz ,  Belgacem Haba

IPC: B05D5/12 ,  B23K31/00

CPC classification number: H01L24/16 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/73 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05551 ,  H01L2224/05555 ,  H01L2224/13021 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0201 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/062 ,  H05K2201/0715 ,  H05K2201/2081 ,  H05K2203/0315 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of fabricating solder assemblies for forming solder connections that include a dielectric base having a non solder-wettable surface, a plurality of solder-wettable pads exposed to said surface, and an electrically conductive potential plane element having a non solder-wettable surface overlying the surface of the base in proximity to the pads but spaced from said pads. The non-wettable surface of the potential plane element may include a metal such as nickel or a metal oxide. The potential plane element thus performs the functions of a solder mask to prevent solder from forming short circuits between adjacent pads, and may also act as a ground plane, power plane or shielding element.

Abstract translation: 一种制造用于形成焊接连接​​的焊料组件的方法，其包括具有不可焊接润湿表面的电介质基底，暴露于所述表面的多个焊料可润湿焊盘以及具有不可焊接润湿表面的导电电位平面元件 基部的表面靠近焊盘，但与所述焊盘间隔开。 电位平面元件的不可润湿表面可以包括诸如镍或金属氧化物的金属。 因此，电位平面元件执行焊接掩模的功能，以防止焊料在相邻焊盘之间形成短路，并且还可以用作接地层，电源层或屏蔽元件。

公开(公告)号：US07351641B2

公开(公告)日：2008-04-01

申请号：US11201726

申请日：2005-08-11

Applicant: Belgacem Haba ,  Masud Beroz ,  Glenn Urbish ,  David B. Tuckerman

Inventor： Belgacem Haba ,  Masud Beroz ,  Glenn Urbish ,  David B. Tuckerman

IPC: H01L21/76 ,  H01L21/30

CPC classification number: B81B7/007 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1092

Abstract: As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern is formed on a chip insulated from wiring of the chip, and a cap is formed including a metal. The cap is joined to the metal base pattern on the chip to form the capped chip. In one embodiment, a front surface of the chip is exposed which extends from a contact of the chip to an edge of the chip. In another embodiment, a conductive connection is formed to the contact, the conductive connection extending from the contact to a terminal at an exposed plane above the front surface of the chip.

Abstract translation: 如本文所公开的，提供了用于形成加盖芯片的结构和方法。 通过所公开的方法提供，在与芯片的布线绝缘的芯片上形成金属基底图案，并且形成包括金属的盖。 盖子连接到芯片上的金属基底图案以形成封盖的芯片。 在一个实施例中，芯片的前表面被暴露，其从芯片的触点延伸到芯片的边缘。 在另一个实施例中，导电连接形成于接触件，导电连接件从接触件延伸到芯片前表面上的暴露平面处的端子。

公开(公告)号：US07332068B2

公开(公告)日：2008-02-19

申请号：US10856723

申请日：2004-05-28

Applicant: Belgacem Haba ,  Irina Poukhova ,  Masud Beroz

Inventor： Belgacem Haba ,  Irina Poukhova ,  Masud Beroz

IPC: C25F3/00

CPC classification number: H01L21/4828 ,  C25D7/12 ,  H05K3/062 ,  H05K3/108 ,  H05K3/4092 ,  H05K2203/0597 ,  H05K2203/095 ,  H05K2203/105 ,  H05K2203/1184

Abstract: A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.

Abstract translation: 在聚合物组分上提供金属，并且在存在电场的情况下对组分进行诸如等离子体或液体蚀刻的去除处理。 蚀刻剂在金属和聚合物之间的边界选择性地攻击聚合物，从而在金属旁边形成间隙。 覆盖金属可以镀在间隙中的金属上。 覆盖金属在随后的蚀刻过程中保护主要金属。

公开(公告)号：US07262368B2

公开(公告)日：2007-08-28

申请号：US10917978

申请日：2004-08-13

Applicant: Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

Inventor： Belgacem Haba ,  Masud Beroz ,  David B. Tuckerman ,  Giles Humpston ,  Richard Dewitt Crisp

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H01L23/49838 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/115 ,  H05K3/041 ,  H05K3/06 ,  H05K3/202 ,  H05K3/4038 ,  H05K2201/09609 ,  H05K2201/097 ,  H05K2201/09827 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165 ,  H01L2924/00

Abstract: Provided are connection structures for a microelectronic device and methods for forming the structure. A substrate is included having opposing surfaces and a plurality of holes extending through the surfaces. Also included is a plurality of electrically conductive posts. Each post extends from a base to a tip located within a corresponding hole of the substrate. An additional substrate may be provided such that the base of each post is located on a surface thereof. Additional electrically conductive posts may be provided having tips in corresponding holes of the additional substrate. Optionally, a dielectric material may be placed between the substrate and the posts.

Abstract translation: 提供了用于微电子器件的连接结构和用于形成结构的方法。 包括具有相对表面的基板和延伸穿过该表面的多个孔。 还包括多个导电柱。 每个柱从基部延伸到位于基板的相应孔内的尖端。 可以提供另外的基底，使得每个柱的基部位于其表面上。 可以提供额外的导电柱，其具有在附加衬底的相应孔中的尖端。 可选地，介电材料可以放置在基板和柱之间。