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    Coaxial waveguide microstructures having an active device and methods of formation thereof
    51.
    发明授权
    Coaxial waveguide microstructures having an active device and methods of formation thereof 有权
    具有有源器件的同轴波导微结构及其形成方法

    公开(公告)号：US08742874B2

    公开(公告)日：2014-06-03

    申请号：US13085124

    申请日：2011-04-12

    Applicant: David W. Sherrer ,  John J. Fisher

    Inventor： David W. Sherrer ,  John J. Fisher

    IPC: H01P3/06

    CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

    Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

    Coaxial waveguide microstructures having an active device and methods of formation thereof
    57.
    发明授权
    Coaxial waveguide microstructures having an active device and methods of formation thereof 有权
    具有有源器件的同轴波导微结构及其形成方法

    公开(公告)号：US07405638B2

    公开(公告)日：2008-07-29

    申请号：US11637629

    申请日：2006-12-12

    Applicant: David W. Sherrer ,  John J. Fisher

    Inventor： David W. Sherrer ,  John J. Fisher

    IPC: H01P3/06

    CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

    Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

    Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

    Multi-level optical structure and method of manufacture
    58.
    发明授权
    Multi-level optical structure and method of manufacture 有权
    多级光学结构及制造方法

    公开(公告)号：US07255978B2

    公开(公告)日：2007-08-14

    申请号：US09858999

    申请日：2001-05-16

    Applicant: Dan A. Steinberg ,  David W. Sherrer

    Inventor： Dan A. Steinberg ,  David W. Sherrer

    IPC: G03F7/26

    CPC classification number: G02B6/30 ,  G02B6/12004 ,  G02B6/136 ,  G02B6/138 ,  G03F1/38 ,  G03F1/50 ,  G03F1/60 ,  Y10T428/26

    Abstract: A multi-level optical device includes a substrate having a baseline level. At least one feature is disposed at a level above the baseline level. At least one feature is disposed at a level below the baseline level, or in the feature above the baseline level is located at a distance apart from the feature below the baseline level. The distance has an accuracy inn the range of approximately ±0.05 μm to less than approximately ±1.0 μm.A method of fabricating an optical device includes forming at least one feature at a level of above a baseline level of a substrate; and forming at least one feature at a baseline level below the baseline level of the substrate, wherein the feature at a level above the baseline level and the feature at a level below the baseline level are patterned in a single-mask step using a multi-level mask.

    Abstract translation: 多级光学器件包括具有基准电平的衬底。 至少一个特征被设置在高于基线水平的水平上。 至少一个特征被布置在低于基准水平的水平处，或者在基线水平以上的特征中位于距离基准水平以下的特征的距离处。 该距离的精度范围约为±0.05μm至小于约±1.0μm。 一种制造光学器件的方法包括在衬底的基线水平以上的水平上形成至少一个特征; 以及在低于所述基底的基线水平的基线水平处形成至少一个特征，其中，在所述基线水平以上的水平处的所述特征和所述基线水平以下的水平处的特征在单掩模步骤中被图案化， 级别面具。

    Optical device package
    59.
    发明授权
    Optical device package 有权
    光器件封装

    公开(公告)号：US07246953B2

    公开(公告)日：2007-07-24

    申请号：US11080002

    申请日：2005-03-15

    Applicant: Dan A. Steinberg ,  David W. Sherrer ,  Mindaugas F. Dautargas

    Inventor： Dan A. Steinberg ,  David W. Sherrer ,  Mindaugas F. Dautargas

    IPC: G02B6/36

    CPC classification number: G02B6/421 ,  G02B6/4201 ,  G02B6/423 ,  G02B6/4243 ,  G02B6/4245 ,  G02B6/4251 ,  H01L2224/16225

    Abstract: An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in said substrate such that the top surface of the optical fiber is substantially at or below the upper surface of the substrate and the optical fiber is operatively aligned with the optical semiconductor component for the transfer of optical signals therebetween. A frame is hermetically sealed to the upper surface of the substrate.

    Abstract translation: 光学器件封装包括具有顶部的基板，该顶部具有用于接收光学半导体部件的凹部和用于接收光纤的细长直线槽。 光纤位于所述基板中的凹槽内，使得光纤的顶表面基本上在基板的上表面上或下方，并且光纤与光半导体部件可操作地对准以在其间传输光信号 。 框架被密封到基板的上表面。

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