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公开(公告)号：US20120189863A1
公开(公告)日：2012-07-26
申请号：US13219736
申请日：2011-08-29
申请人： William D. Houck , David W. Sherrer
发明人： William D. Houck , David W. Sherrer
CPC分类号： H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
摘要： Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
摘要翻译： 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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2.发明授权公开(公告)号：US07656256B2
公开(公告)日：2010-02-02
申请号：US12005936
申请日：2007-12-28
申请人： William D. Houck , David W. Sherrer
发明人： William D. Houck , David W. Sherrer
IPC分类号： H01P3/06
CPC分类号： H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
摘要： Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
摘要翻译： 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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3.发明授权公开(公告)号：US08933769B2
公开(公告)日：2015-01-13
申请号：US13219736
申请日：2011-08-29
申请人： William D. Houck , David W. Sherrer
发明人： William D. Houck , David W. Sherrer
CPC分类号： H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
摘要： Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
摘要翻译： 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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公开(公告)号：US20100109819A1
公开(公告)日：2010-05-06
申请号：US12608870
申请日：2009-10-29
申请人： William D. Houck , David W. Sherrer
发明人： William D. Houck , David W. Sherrer
IPC分类号： H01P3/06
CPC分类号： H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
摘要： Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
摘要翻译： 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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公开(公告)号：US20080199656A1
公开(公告)日：2008-08-21
申请号：US12005866
申请日：2007-12-28
CPC分类号： H01P11/005 , H01P3/06 , H05K1/0221 , H05K1/024 , H05K3/465 , H05K3/4661 , H05K3/4697 , H05K2201/09809 , H05K2203/0733 , Y10T428/24331
摘要： Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
摘要翻译： 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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公开(公告)号：US20080197946A1
公开(公告)日：2008-08-21
申请号：US12005936
申请日：2007-12-28
申请人： William D. Houck , David W. Sherrer
发明人： William D. Houck , David W. Sherrer
IPC分类号： H01P3/06
CPC分类号： H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
摘要： Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
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公开(公告)号：US08031037B2
公开(公告)日：2011-10-04
申请号：US12608870
申请日：2009-10-29
申请人： David W. Sherrer , William D. Houck
发明人： David W. Sherrer , William D. Houck
IPC分类号： H01P3/06
CPC分类号： H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
摘要： Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
摘要翻译： 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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