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公开(公告)号：US20120189863A1
公开(公告)日：2012-07-26
申请号：US13219736
申请日：2011-08-29
Applicant: William D. Houck , David W. Sherrer
Inventor： William D. Houck , David W. Sherrer
CPC classification number: H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Abstract translation: 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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2.发明授权公开(公告)号：US07656256B2
公开(公告)日：2010-02-02
申请号：US12005936
申请日：2007-12-28
Applicant: William D. Houck , David W. Sherrer
Inventor： William D. Houck , David W. Sherrer
IPC: H01P3/06
CPC classification number: H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Abstract translation: 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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公开(公告)号：US08031037B2
公开(公告)日：2011-10-04
申请号：US12608870
申请日：2009-10-29
Applicant: David W. Sherrer , William D. Houck
Inventor： David W. Sherrer , William D. Houck
IPC: H01P3/06
CPC classification number: H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Abstract translation: 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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公开(公告)号：US20080197946A1
公开(公告)日：2008-08-21
申请号：US12005936
申请日：2007-12-28
Applicant: William D. Houck , David W. Sherrer
Inventor： William D. Houck , David W. Sherrer
IPC: H01P3/06
CPC classification number: H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
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5.发明授权公开(公告)号：US08933769B2
公开(公告)日：2015-01-13
申请号：US13219736
申请日：2011-08-29
Applicant: William D. Houck , David W. Sherrer
Inventor： William D. Houck , David W. Sherrer
CPC classification number: H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Abstract translation: 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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Patent Agency Ranking
公开(公告)号：US20100109819A1
公开(公告)日：2010-05-06
申请号：US12608870
申请日：2009-10-29
Applicant: William D. Houck , David W. Sherrer
Inventor： William D. Houck , David W. Sherrer
IPC: H01P3/06
CPC classification number: H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Abstract translation: 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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7.发明申请公开(公告)号：US20110273241A1
公开(公告)日：2011-11-10
申请号：US13015671
申请日：2011-01-28
Applicant: David W. Sherrer , Jean-Marc Rollin
Inventor： David W. Sherrer , Jean-Marc Rollin
CPC classification number: H01P3/06 , H01P5/026 , H01P11/005 , Y10T29/49016 , Y10T29/49123
Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供通过顺序构建工艺形成的同轴传输线微结构以及形成这种微结构的方法。 微结构包括用于在同轴传输线和电连接器之间转变的过渡结构。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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公开(公告)号：US08049161B2
公开(公告)日：2011-11-01
申请号：US12837734
申请日：2010-07-16
Applicant: David W. Sherrer , Noel A. Heiks
Inventor： David W. Sherrer , Noel A. Heiks
IPC: H01J40/14
CPC classification number: G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4214 , G02B6/4231 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4257 , G02B6/4274
Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
Abstract translation: 提供了包括光电子器件和用于自对准光电器件的结构的光电子部件。 还提供了光电子模块和形成光电子部件的方法。
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公开(公告)号：US20090256251A1
公开(公告)日：2009-10-15
申请号：US12072157
申请日：2008-02-25
Applicant: James W. Getz , David W. Sherrer , John J. Fisher
Inventor： James W. Getz , David W. Sherrer , John J. Fisher
CPC classification number: B81B7/007 , B81C2203/0109 , H01L2924/0002 , H01L2924/00
Abstract: Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.
Abstract translation: 提供电子器件封装及其形成方法。 电子器件封装包括安装在衬底上的电子器件，衬底中的导电通孔和局部变薄的区域。 本发明可应用于电子工业中用于包含诸如IC，光电子或MEMS器件的电子器件的气密封装。
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公开(公告)号：US07508065B2
公开(公告)日：2009-03-24
申请号：US11590629
申请日：2006-10-31
Applicant: David W. Sherrer , Larry J. Rasnake , John J. Fisher
Inventor： David W. Sherrer , Larry J. Rasnake , John J. Fisher
IPC: H01L23/12
CPC classification number: G02B6/4248 , G01B11/16 , G01B11/26 , G02B6/3692 , G02B6/4201 , G02B6/4204 , G02B6/4206 , G02B6/421 , G02B6/4214 , G02B6/423 , G02B6/4239 , G02B6/4243 , G02B6/4244 , G02B6/4257 , G02B6/4271 , G02B6/4292 , H01L23/481 , H01L2924/0002 , H01S5/0014 , H01S5/022 , H01S5/02208 , H01S5/02216 , H01S5/0222 , H01S5/02252 , H01S5/02272 , H01S5/02284 , H01S5/02288 , H01S5/02415 , H01S5/02469 , H01S5/0683 , H01L2924/00012 , H01L2924/00
Abstract: Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages having cooling structures, and methods of bonding a first component to a second component.
Abstract translation: 提供形成密封通孔结构的方法。 一种方法包括：（a）提供具有第一表面和与第一表面相对的第二表面的半导体衬底; （b）在所述基板的第一表面上形成层; （c）从所述第二表面到所述层蚀刻穿过所述基板的通孔，所述通孔在所述第一表面具有第一周边; （d）在所述层中形成孔，其中所述孔在所述第一周边内具有第二周边; 和（e）提供用于密封通孔结构的导电结构。 还提供了密封通孔结构，检测密封器件封装中的泄漏的方法，密封器件封装，具有冷却结构的器件封装以及将第一元件接合到第二元件的方法。
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