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1.发明申请公开(公告)号：US20110273241A1
公开(公告)日：2011-11-10
申请号：US13015671
申请日：2011-01-28
Applicant: David W. Sherrer , Jean-Marc Rollin
Inventor： David W. Sherrer , Jean-Marc Rollin
CPC classification number: H01P3/06 , H01P5/026 , H01P11/005 , Y10T29/49016 , Y10T29/49123
Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供通过顺序构建工艺形成的同轴传输线微结构以及形成这种微结构的方法。 微结构包括用于在同轴传输线和电连接器之间转变的过渡结构。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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2.发明授权公开(公告)号：US08542079B2
公开(公告)日：2013-09-24
申请号：US13015671
申请日：2011-01-28
Applicant: David W. Sherrer , Jean-Marc Rollin
Inventor： David W. Sherrer , Jean-Marc Rollin
CPC classification number: H01P3/06 , H01P5/026 , H01P11/005 , Y10T29/49016 , Y10T29/49123
Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供通过顺序构建工艺形成的同轴传输线微结构以及形成这种微结构的方法。 微结构包括用于在同轴传输线和电连接器之间转变的过渡结构。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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3.发明授权公开(公告)号：US07898356B2
公开(公告)日：2011-03-01
申请号：US12077546
申请日：2008-03-20
Applicant: David W. Sherrer , Jean-Marc Rollin
Inventor： David W. Sherrer , Jean-Marc Rollin
CPC classification number: H01P3/06 , H01P5/026 , H01P11/005 , Y10T29/49016 , Y10T29/49123
Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供通过顺序构建工艺形成的同轴传输线微结构以及形成这种微结构的方法。 微结构包括用于在同轴传输线和电连接器之间转变的过渡结构。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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公开(公告)号：US08814601B1
公开(公告)日：2014-08-26
申请号：US13490089
申请日：2012-06-06
Applicant: David W. Sherrer , Jean-Marc Rollin
Inventor： David W. Sherrer , Jean-Marc Rollin
CPC classification number: H01R13/40 , H01L23/49811 , H01L2924/0002 , H01R4/34 , H01R13/111 , H01R13/514 , H01R24/50 , H01R43/16 , H05K3/366 , H05K2201/10189 , Y10T29/49165 , H01L2924/0001 , H01L2924/00
Abstract: Connectors and interconnects for high power connectors which may operate at frequencies up to approximately 110 GHz and fabrication methods thereof are provided.
Abstract translation: 提供了可在高达约110GHz频率工作的高功率连接器的连接器和互连及其制造方法。
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公开(公告)号：US20100296252A1
公开(公告)日：2010-11-25
申请号：US12785531
申请日：2010-05-24
Applicant: Jean-Marc Rollin , David W. Sherrer
Inventor： Jean-Marc Rollin , David W. Sherrer
CPC classification number: H01L23/373 , H01L23/5286 , H01L23/552 , H01L23/562 , H01L23/58 , H01L23/66 , H01L2223/6627 , H01L2224/48091 , H01L2224/85444 , H01L2924/01012 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/1423 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H01P3/06 , H01P11/005 , H05K1/0221 , H05K1/0224 , H05K1/0272 , H05K3/4092 , H05K3/4661 , H05K2201/09809 , H05K2201/10636 , H05K2201/10674 , H05K2203/0733 , H05K2203/308 , Y02P70/611 , Y10T29/49002 , Y10T29/49018 , H01L2924/00014 , H01L2924/00
Abstract: Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供了包括通过顺序构建工艺形成的波导微结构和电子器件的集成电子部件以及形成这种集成电子部件的方法。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20080246562A1
公开(公告)日：2008-10-09
申请号：US12077546
申请日：2008-03-20
Applicant: David W. Sherrer , Jean-Marc Rollin
Inventor： David W. Sherrer , Jean-Marc Rollin
CPC classification number: H01P3/06 , H01P5/026 , H01P11/005 , Y10T29/49016 , Y10T29/49123
Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
Abstract translation: 提供通过顺序构建工艺形成的同轴传输线微结构以及形成这种微结构的方法。 微结构包括用于在同轴传输线和电连接器之间转变的过渡结构。 微结构对于传输电磁能和其他电子信号的装置具有特别的适用性。
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公开(公告)号：US20120189863A1
公开(公告)日：2012-07-26
申请号：US13219736
申请日：2011-08-29
Applicant: William D. Houck , David W. Sherrer
Inventor： William D. Houck , David W. Sherrer
CPC classification number: H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Abstract translation: 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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公开(公告)号：US08049161B2
公开(公告)日：2011-11-01
申请号：US12837734
申请日：2010-07-16
Applicant: David W. Sherrer , Noel A. Heiks
Inventor： David W. Sherrer , Noel A. Heiks
IPC: H01J40/14
CPC classification number: G02B6/4292 , G02B6/4201 , G02B6/4204 , G02B6/4214 , G02B6/4231 , G02B6/4232 , G02B6/4246 , G02B6/4249 , G02B6/4257 , G02B6/4274
Abstract: Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
Abstract translation: 提供了包括光电子器件和用于自对准光电器件的结构的光电子部件。 还提供了光电子模块和形成光电子部件的方法。
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9.发明授权公开(公告)号：US07656256B2
公开(公告)日：2010-02-02
申请号：US12005936
申请日：2007-12-28
Applicant: William D. Houck , David W. Sherrer
Inventor： William D. Houck , David W. Sherrer
IPC: H01P3/06
CPC classification number: H01P3/06 , B81B3/0059 , B81B2203/0109 , B81B2203/0307 , H01P11/005 , Y10T29/49123 , Y10T428/12361 , Y10T428/12389 , Y10T428/24331 , Y10T428/24545
Abstract: Provided are three-dimensional microstructures and their methods of formation. The microstructures are formed by a sequential build process and include microstructural elements which are affixed to one another. The microstructures find use, for example, in coaxial transmission lines for electromagnetic energy.
Abstract translation: 提供三维微结构及其形成方法。 微结构通过顺序构建工艺形成，并且包括彼此贴合的微结构元件。 微结构可用于例如用于电磁能的同轴传输线。
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公开(公告)号：US20090256251A1
公开(公告)日：2009-10-15
申请号：US12072157
申请日：2008-02-25
Applicant: James W. Getz , David W. Sherrer , John J. Fisher
Inventor： James W. Getz , David W. Sherrer , John J. Fisher
CPC classification number: B81B7/007 , B81C2203/0109 , H01L2924/0002 , H01L2924/00
Abstract: Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.
Abstract translation: 提供电子器件封装及其形成方法。 电子器件封装包括安装在衬底上的电子器件，衬底中的导电通孔和局部变薄的区域。 本发明可应用于电子工业中用于包含诸如IC，光电子或MEMS器件的电子器件的气密封装。
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