公开(公告)号：US20160221860A1

公开(公告)日：2016-08-04

申请号：US15094477

申请日：2016-04-08

Applicant: Corning Incorporated

Inventor： Robert Alan Bellman ,  Dana Craig Bookbinder ,  Theresa Chang ,  Jeffrey John Domey ,  Robert George Manley ,  Prantik Mazumder ,  Alan Thomas Stephens, II

IPC: C03B25/02 ,  C03C17/32 ,  B05D1/00 ,  C03B35/14

CPC classification number: C03B25/025 ,  B05D1/60 ,  B32B7/06 ,  B32B17/06 ,  C03B35/14 ,  C03B40/005 ,  C03C1/00 ,  C03C17/328 ,  G02F2001/133302

Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract translation: 可以在片材，载体或两者上提供表面改性层和相关的热处理，以控制薄板和载体之间的室温范德华（和/或氢）键合和高温共价键合。 例如，在真空处理，湿法处理和/或超声波清洗处理中，室温粘合被控制为足以将薄片和载体保持在一起。 同时控制高温共价键，以防止在高温加工过程中薄片和载体之间的永久性结合，并且保持足够的粘结以防止在高温加工过程中的分层。

公开(公告)号：US20160158798A1

公开(公告)日：2016-06-09

申请号：US15044330

申请日：2016-02-16

Applicant: CORNING INCORPORATED ,  ICFO (THE INSTITUTE OF PHOTONIC SCIENCES) ,  ICREA (INSTITUTE CATALANA DE RECERCA I ESTUDIS AVANCATS)

Inventor： David Eugene Baker ,  Carme Gomez Carbonell ,  David Francis Dawson-Elli ,  Prantik Mazumder ,  Valerio Pruneri ,  Lili Tian

IPC: B05D3/00 ,  C03C17/06

CPC classification number: B05D3/007 ,  B05D3/0254 ,  B32B33/00 ,  C03C17/06 ,  C23C14/185 ,  C23C14/5806 ,  Y10T428/24355

Abstract: Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack disposed on a surface thereof, and dewetting at least a portion of the continuous ultra-thin metal-containing film or film stack to produce a plurality of discrete metal-containing dewetted islands on the surface of the substrate.

公开(公告)号：US20150367270A1

公开(公告)日：2015-12-24

申请号：US14712112

申请日：2015-05-14

Applicant: Corning Incorporated

Inventor： Prantik Mazumder ,  Wageesha Senaratne ,  Ying Wei

IPC: B01D46/00 ,  B01D46/24

CPC classification number: B01D46/0028 ,  B01D46/0001 ,  B01D46/247 ,  B01D2046/2433 ,  B01D2046/2437

Abstract: An air filter article, including: a wall-flow honeycomb particulate filter; and at least one anti-microbial agent on at least a portion of the interior surfaces. The disclosure also provides a filtration system that incorporates or uses the air filter article, and methods for making the air filter article.

Abstract translation: 一种空气过滤器制品，包括：壁流式蜂窝状颗粒过滤器; 和在至少一部分内表面上的至少一种抗微生物剂。 本公开还提供了一种包含或使用空气过滤器制品的过滤系统，以及用于制造空气过滤器制品的方法。

公开(公告)号：US20150306847A1

公开(公告)日：2015-10-29

申请号：US14651720

申请日：2013-12-13

Applicant: Robert Alan BELLMAN ,  Dana Craig BOOKBINDER ,  Robert George MANLEY ,  Prantik MAZUMDER ,  CORNING INCORPORATED

Inventor： Robert Alan Bellman ,  Dana Craig Bookbinder ,  Robert George Manley ,  Prantik Mazumder

IPC: B32B17/06 ,  B32B3/04 ,  B32B7/12

CPC classification number: B32B17/06 ,  B32B3/04 ,  B32B7/12 ,  B32B2255/26 ,  B32B2457/206 ,  B32B2457/208 ,  C03C27/10 ,  C03C2218/328 ,  H01L51/0096 ,  Y02E10/549

Abstract: A method of forming an article from a glass sheet (20) having a glass-sheet bonding surface (24) and a glass carrier (10) having a carrier bonding surface (14). At least one of the glass sheet and carrier bonding surfaces is coated with a surface modification layer (30), and then the glass sheet is connected with the carrier via the surface modification layer. From the perimeter of the glass sheet and the carrier while connected, there is removed a portion of the surface modification layer so as to expose a portion (19, 29) of the bonding surface on each of the glass sheet and the carrier. The glass sheet and carrier are then heated at a temperature ≧400° C. so as to bond the perimeter of the glass sheet (26) with the perimeter of the carrier (16).

Abstract translation: 一种从具有玻璃板接合面（24）的玻璃板（20）和具有载体接合面（14）的玻璃载体（10）形成物品的方法。 玻璃板和载体接合面中的至少一个涂覆有表面改性层（30），然后玻璃板经由表面改性层与载体连接。 从连接的玻璃板和载体的周边起，除去一部分表面改性层，以便露出玻璃板和载体上的每一个上的接合表面的部分（19,29）。 然后将玻璃板和载体在≥400℃的温度下加热，以便将玻璃板（26）的周边与载体（16）的周边粘合。

公开(公告)号：US20140166199A1

公开(公告)日：2014-06-19

申请号：US14047514

申请日：2013-10-07

Applicant: Corning Incorporated

Inventor： Robert Alan Bellman ,  Dana Craig Bookbinder ,  Robert George Manley ,  Prantik Mazumder

IPC: H01L51/00

CPC classification number: H01L21/2007 ,  H01L51/003 ,  H01L51/0097 ,  H01L2227/326 ,  H01L2251/5338 ,  Y02E10/549 ,  Y10T156/10 ,  Y10T156/1052

Abstract: Methods for making electronic devices on thin sheets bonded to carriers. A surface modification layer and associated heat treatments, may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier during the electronic device processing. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, during the electronic device processing. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, during the electronic device processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract translation: 将电子器件制造在与载体结合的薄片上的方法。 可以在片材，载体或两者上提供表面改性层和相关的热处理，以控制薄板和载体之间的室温范德华（和/或氢）键合和高温共价键合 电子设备处理。 在电子设备处理期间，室温粘合被控制为足以在真空处理，湿法处理和/或超声波清洗处理期间将薄片和载体保持在一起。 同时，控制高温共价键，以防止在高温处理期间，在电子器件加工期间薄片和载体之间的永久性接合，并且保持足够的粘结以防止高温下的分层 处理。

公开(公告)号：US20140165654A1

公开(公告)日：2014-06-19

申请号：US14047251

申请日：2013-10-07

Applicant: Corning Incorporated

Inventor： Robert Alan Bellman ,  Dana Craig Bookbinder ,  Robert George Manley ,  Prantik Mazumder

IPC: C03B25/02

CPC classification number: C03B25/025 ,  B05D1/60 ,  B32B7/06 ,  B32B17/06 ,  C03B35/14 ,  C03B40/005 ,  C03C1/00 ,  C03C17/328 ,  G02F2001/133302

Abstract: Surface modification layers and associated heat treatments, that may be provided on a sheet, a carrier, or both, to control both room-temperature van der Waals (and/or hydrogen) bonding and high temperature covalent bonding between the thin sheet and carrier. The room-temperature bonding is controlled so as to be sufficient to hold the thin sheet and carrier together during vacuum processing, wet processing, and/or ultrasonic cleaning processing, for example. And at the same time, the high temperature covalent bonding is controlled so as to prevent a permanent bond between the thin sheet and carrier during high temperature processing, as well as maintain a sufficient bond to prevent delamination during high temperature processing.

Abstract translation: 可以在片材，载体或两者上提供表面改性层和相关的热处理，以控制薄板和载体之间的室温范德华（和/或氢）键合和高温共价键合。 例如，在真空处理，湿法处理和/或超声波清洗处理中，室温粘合被控制为足以将薄片和载体保持在一起。 同时控制高温共价键，以防止在高温加工过程中薄片和载体之间的永久性结合，并且保持足够的粘结以防止在高温加工过程中的分层。

公开(公告)号：US20140099232A1

公开(公告)日：2014-04-10

申请号：US13841995

申请日：2013-03-15

Applicant: Corning Incorporated

Inventor： Samir Biswas ,  Douglass Lane Blanding ,  Glen Bennett Cook ,  Prantik Mazumder ,  Kamal Kishore Soni ,  Balram Suman

IPC: H01L33/02 ,  H01L21/02

CPC classification number: H01L33/02 ,  C30B15/08 ,  C30B29/06 ,  C30B29/08 ,  C30B29/42 ,  C30B29/64 ,  H01L21/02

Abstract: A method of forming a sheet of semiconductor material utilizes a system. The system comprises a first convex member extending along a first axis and capable of rotating about the first axis and a second convex member spaced from the first convex member and extending along a second axis and capable of rotating about the second axis. The first and second convex members define a nip gap therebetween. The method comprises applying a melt of the semiconductor material on an external surface of at least one of the first and second convex members to form a deposit on the external surface of at least one of the first and second convex members. The method further comprises rotating the first and second convex members in a direction opposite one another to allow for the deposit to pass through the nip gap, thereby forming the sheet of semiconductor material.

Abstract translation: 形成半导体材料片的方法利用了一种系统。 该系统包括沿着第一轴线延伸并且能够围绕第一轴线旋转的第一凸起构件和与第一凸起构件间隔开并且沿着第二轴线延伸并能够围绕第二轴线旋转的第二凸起构件。 第一和第二凸起构件在它们之间限定了夹持间隙。 所述方法包括将所述半导体材料的熔体施加在所述第一和第二凸起构件中的至少一个的外表面上，以在所述第一和第二凸起构件中的至少一个的外部表面上形成沉积物。 该方法还包括使第一和第二凸出部件沿彼此相反的方向旋转，以允许沉积物通过夹持间隙，由此形成半导体材料片。

公开(公告)号：US20130323466A1

公开(公告)日：2013-12-05

申请号：US13905367

申请日：2013-05-30

Applicant: Corning Incorporated

Inventor： Adra Smith Baca ,  David Eugene Baker ,  Prantik Mazumder ,  Mark Alejandro Quesada ,  Wageesha Senaratne

IPC: B08B17/06 ,  B05D5/00

CPC classification number: B08B17/065 ,  B05D5/00 ,  C03C17/245 ,  C03C2217/213 ,  C03C2217/76 ,  C03C2218/33 ,  C03C2218/34 ,  Y10T428/24355

Abstract: Described herein are glass substrates having oleophobic surfaces that are substantially free of features that form a reentrant geometry. The surfaces can include a plurality of gas-trapping features, extending from the surface to a depth below the surface, that are substantially isolated from each other. The gas-trapping features are capable of trapping gas below any droplets that are contacted with the surface so as to prevent wetting of the surface by the droplets.

Abstract translation: 这里描述的是具有疏油表面的玻璃基板，其基本上没有形成折入几何形状的特征。 表面可以包括多个气体捕获特征，其从表面延伸到表面下方的深度，其基本上彼此隔离。 气体捕获特征能够将气体捕获到与表面接触的任何液滴之下，以防止液滴对表面的润湿。

公开(公告)号：US20130300025A1

公开(公告)日：2013-11-14

申请号：US13841773

申请日：2013-03-15

Applicant: Corning Incorporated

Inventor： Glen Bennett Cook ,  Prantik Mazumder ,  John Paul Bir Singh

IPC: B29C33/56

CPC classification number: B29C33/56

Abstract: A method of forming a solid layer of a semiconducting material on an external surface of a treated mold which extends between a leading edge and a trailing edge comprises selectively modifying a temperature gradient of a mold such that a temperature of the leading edge (T1) is less than a temperature of the trailing edge (T2) to form the treated mold. The method further comprises submersing the treated mold into a molten semiconducting material such that the leading edge of the treated mold is first submersed into the molten semiconducting material. The method also comprises withdrawing the treated mold from the molten semiconducting material to form the solid layer of the semiconducting material on the external surface of the treated mold.

Abstract translation: 在处理的模具的外表面上形成半导体材料的固体层的方法，其在前缘和后缘之间延伸，包括选择性地改变模具的温度梯度，使得前缘（T1）的温度为 小于后缘（T2）的温度以形成经处理的模具。 该方法还包括将经处理的模具浸入熔融半导体材料中，使得经处理的模具的前缘首先浸入熔融半导体材料中。 该方法还包括从熔融半导体材料中取出经处理的模具，以在被处理的模具的外表面上形成半导体材料的固体层。

公开(公告)号：US12131985B2

公开(公告)日：2024-10-29

申请号：US17470519

申请日：2021-09-09

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: C25D3/38 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/00 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/38 ,  C03C3/076 ,  C25D7/12 ,  H01L23/00 ,  H01L23/492 ,  H05K3/00 ,  H05K3/42

CPC classification number: H01L23/49827 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/0025 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/76877 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49838 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/388 ,  C03C3/076 ,  C03C2218/115 ,  C25D3/38 ,  C25D7/123 ,  H01L21/486 ,  H01L23/4924 ,  H01L23/49866 ,  H01L23/564 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  H05K3/423 ,  H05K3/425 ,  H05K3/428 ,  H05K2201/068 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/0989 ,  H05K2201/10378 ,  H05K2203/1194 ,  H05K2203/1361 ,  H05K2203/143 ,  H05K2203/1438 ,  H05K2203/162 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.