Abstract:
The unintentional programming of an unselected (or inhibited) non-volatile storage element during a program operation that intends to program another non-volatile storage element is referred to as “program disturb.” A system is proposed for programming and/or reading non-volatile storage that reduces the effect of program disturb. In one embodiment, different verify levels are used for a particular word line (or other grouping of storage elements) during a programming process. In another embodiment, different compare levels are used for a particular word (or other grouping of storage elements) during a read process.
Abstract:
A method for minimizing program disturb in Flash memories. To reduce program disturb in a NAND Flash memory cell string where no programming from the erased state is desired, a local boosted channel inhibit scheme is used. In the local boosted channel inhibit scheme, the selected memory cell in a NAND string where no programming is desired, is decoupled from the other cells in the NAND string. This allows the channel of the decoupled cell to be locally boosted to a voltage level sufficient for inhibiting F-N tunneling when the corresponding wordline is raised to a programming voltage. Due to the high boosting efficiency, the pass voltage applied to the gates of the remaining memory cells in the NAND string can be reduced relative to prior art schemes, thereby minimizing program disturb while allowing for random page programming.
Abstract:
A memory page boosting method, device and system for boosting unselected memory cells in a multi-level cell memory cell is described. The memory device includes a memory array of multi-level cell memory cells configured to store a first portion of logic states and a second portion of logic states. When programming the first portion of logic states, a first boosting process is applied to unselected memory cells and when programming the second portion of logic states, a second boosting process is applied to unselected memory cells.
Abstract:
A semiconductor memory device includes: a semiconductor layer provided on an insulating substrate or an insulating layer; active areas each defined in the semiconductor layer with a device insulating film buried therein; and NAND cell units formed on the active areas, each NAND cell unit including a plurality of electrically rewritable and non-volatile memory cells connected in series, both ends of each NAND cell unit being coupled to a source line and a bit line, wherein the device has such a carrier discharging mode as to discharge channel carriers in the NAND cell unit to at least one of the source line and the bit line.
Abstract:
An embodiment of a flash memory device with NAND architecture, including a matrix of data storage memory cells each one having a programmable threshold voltage, wherein the matrix is arranged in a plurality of rows and columns with the memory cells of each row being connected to a corresponding word line and the memory cells of each column being arranged in a plurality of strings of memory cells, the memory cells in each string being connected in series, the strings of each column being coupled to a reference voltage distribution line distributing a reference voltage by means of a first selector, wherein each string further includes at least one first shielding element interposed between the memory cells of the string and said first selector, the first shielding element being adapted to shield the memory cells from electric fields that, in operation, arise between the string of memory cells and the first selector.
Abstract:
A nonvolatile semiconductor memory is capable of dual and triple operation with a small chip size. A plurality of sectors is formed. Each sector has nonvolatile memory cells, local bit lines connected to these memory cells, and switch circuits. Write global bit lines and read global bit lines are each wired commonly to the sectors. The write global bit lines transfer write data to the memory cells or verify data from the memory cells. The read global bit lines transfer read data from the memory cells. The switch circuits connect the local bit lines to the write global bit lines or the read global bit lines in accordance with the operation modes. Consequently, it is possible to execute read operation while executing a write sequence or an erase sequence. That is, dual operation can be executed.
Abstract:
Flash memory devices include a memory array having a plurality of NAND strings of EEPROM cells therein. A word line driver is provided to improve programming efficiency. The word line driver is electrically coupled to the memory array by a plurality of word lines. The word line driver includes a plurality of pass voltage switches. These switches have outputs electrically coupled by diodes to the plurality of word lines. Methods of programming flash memory devices include applying a pass voltage to a plurality of unselected word lines in a non-volatile memory array while simultaneously applying a sequentially ramped program voltage to a selected word line in the non-volatile memory array. The sequentially ramped program voltage has a minimum value that is clamped by a word line driver to a level not less than a value of the pass voltage.
Abstract:
A non-volatile memory device may include a plurality of memory blocks including memory cells connected in series to bit lines, respectively. Each of the plurality of memory blocks may include a first sub memory block having a first group of memory cells, which are respectively connected in series between first select transistors connected to the bit lines, respectively, and second select transistors connected to a common source line, and a second sub memory block having a second group of memory cells, which are respectively connected in series between third select transistors connected to the bit lines, respectively, and fourth select transistors connected to the common source line.
Abstract:
A synchronous flash memory includes an array of non-volatile memory cells. The memory array is arranged in rows and columns, and can be further arranged in addressable blocks. Data communication connections are used for bi-directional data communication with an external device(s), such as a processor or other memory controller. The memory can output data from storage registers on the data communication connections during a series of clock cycles to provide a burst of register data. The memory can also provide the register data in accordance to a defined clock latency value. The register data can include status data, operating setting data, manufacture identification, and memory device identification.
Abstract:
Methods for erasing flash memory using a decrease in magnitude of a source voltage of a first polarity to increase the magnitude of a control gate voltage of a second polarity during an erase period.