公开(公告)号：US20180304716A1

公开(公告)日：2018-10-25

申请号：US15830971

申请日：2017-12-04

Applicant: C.R.F. Società Consortile per Azioni

Inventor： Antonino Domenico VECA ,  Paolo CHIAPPERO ,  Francesca DALMASSO ,  Vito Guido LAMBERTINI

IPC: B60G17/019 ,  G01L1/18 ,  B60G17/016

CPC classification number: B60G17/01941 ,  B60G17/016 ,  B60G17/019 ,  B60G2204/11 ,  B60G2204/112 ,  B60G2204/116 ,  B60G2204/41 ,  B60G2206/73 ,  B60G2400/60 ,  B60G2401/10 ,  B60G2401/26 ,  B60G2600/02 ,  B60G2600/182 ,  G01L1/18 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/107 ,  H05K2203/1136

Abstract: An elastic support for on-board suspension systems of a motor-vehicle includes at least one body formed of polymeric elastomeric material supplemented with carbon-based nanofillers. An outer surface is provided with one or more piezo-resistive areas where a polymeric material supplemented with carbon-based nanofillers has been made locally piezo-resistive by laser irradiation so as to define one or more electric deformation sensors configured to detect the load applied on the elastic support.

公开(公告)号：US20180244197A1

公开(公告)日：2018-08-30

申请号：US15965308

申请日：2018-04-27

Applicant: C.R.F. Società Consortile per Azioni

Inventor： Antonino Domenico VECA ,  Matteo STRUMIA ,  Vito Guido LAMBERTINI ,  Maurizio SERVETTI

IPC: B60Q9/00 ,  B29C35/08 ,  B29C44/12 ,  B29C45/14 ,  B60R16/00 ,  G08B21/18 ,  G01N27/04 ,  B29L31/30 ,  B29K507/04 ,  B29K105/16 ,  B29K105/04 ,  B60R13/02 ,  B60N2/75 ,  H03K17/96

CPC classification number: B60Q9/00 ,  B29C35/0805 ,  B29C44/12 ,  B29C45/14065 ,  B29C2035/0838 ,  B29K2105/04 ,  B29K2105/16 ,  B29K2507/04 ,  B29K2995/0005 ,  B29L2031/3014 ,  B29L2031/3026 ,  B60N2/0228 ,  B60N2/797 ,  B60R13/0243 ,  B60R13/0256 ,  B60R16/005 ,  B60R2013/0287 ,  G01N27/041 ,  G08B21/182 ,  H01H13/704 ,  H01H2229/02 ,  H01H2229/056 ,  H01H2300/036 ,  H03K17/964 ,  H03K17/9645 ,  H05K1/0373 ,  H05K1/165 ,  H05K1/167 ,  H05K3/105 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/10053 ,  H05K2201/10098 ,  H05K2203/107 ,  H05K2203/1136

Abstract: A component for the passenger compartment of a motor vehicle includes a rigid supporting body, made of plastic material, an outer upholstery skin, made of plastic material, and a padding body made of foamed plastic material, which is set between the rigid body and the outer upholstery skin. The rigid body and the outer skin have portions formed by a polymeric material with carbon-based nanofillers, which have respective inner surfaces facing the padding body, which include one or more paths where said polymeric material with carbon-based nanofillers has been rendered electrically conductive by laser irradiation to define one or more electrical circuits, and one or more piezoresistive areas where the polymeric material has been rendered piezoresistive by laser irradiation to define one or more electrical switches, which can be activated by exerting a localized pressure on the outer upholstery skin.

公开(公告)号：US09693463B2

公开(公告)日：2017-06-27

申请号：US14809069

申请日：2015-07-24

Applicant: LG DISPLAY CO., LTD.

Inventor： Joonyoung Heo

IPC: H05K3/32 ,  H05K1/09 ,  H05K1/02 ,  H05K1/18 ,  H05K3/10 ,  H01J17/49 ,  H01L27/32 ,  G02F1/1362 ,  H05K3/38

CPC classification number: H05K3/105 ,  G02F1/136286 ,  G02F2001/136295 ,  G02F2203/01 ,  H01J17/49 ,  H01L27/326 ,  H01L27/3262 ,  H01L27/3279 ,  H05K1/09 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0326 ,  H05K2203/095 ,  H05K2203/1136

Abstract: A transparent display panel, and a method of manufacturing the transparent display panel are discussed. The transparent display panel according to one embodiment includes a substrate; a driving element formed in a display pixel area on the substrate; a wiring electrode formed in the display pixel area and connected to the driving element; and a transparent wiring electrode formed in a transmissive area on the substrate, the transparent wiring electrode being extended to connect to the wiring electrode in the display pixel area.

公开(公告)号：US09219218B2

公开(公告)日：2015-12-22

申请号：US14578991

申请日：2014-12-22

Applicant: Seiko Epson Corporation

Inventor： Hideki Ishigami ,  Hidefumi Nakamura ,  Yukihiko Shiohara ,  Taku Kawasaki ,  Fumiaki Akahane

IPC: H05K1/09 ,  H05K1/03 ,  H01L41/047 ,  H01L41/053 ,  H01L41/333 ,  H01L41/29 ,  B22F5/12 ,  B22F3/105

CPC classification number: H01L41/0475 ,  B22F1/02 ,  B22F3/02 ,  B22F3/1055 ,  B22F5/12 ,  B22F2009/0828 ,  B22F2009/0884 ,  H01L41/0533 ,  H01L41/29 ,  H01L41/333 ,  H03H9/1021 ,  H03H9/13 ,  H03H2003/026 ,  H05K1/0306 ,  H05K3/105 ,  H05K3/1225 ,  H05K3/321 ,  H05K2201/0215 ,  H05K2201/0224 ,  H05K2201/10068 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1136 ,  Y10T428/252

Abstract: A method of manufacturing an electric wiring layer including an electric wiring includes obtaining a pressed powder molded layer by pressurizing a powder including a metal particle with an insulating layer, the metal particle being constituted by a metal particle having conductivity and a surface insulating layer which is located on a surface of the metal particle and which mainly contains a glass material; and irradiating the pressed powder molded layer with energy rays and forming the electric wiring in an irradiation region.

Abstract translation: 一种制造包括电气布线的电布线层的方法包括：通过加压包含具有绝缘层的金属颗粒的粉末来获得压制粉末成型层，所述金属颗粒由具有导电性的金属颗粒和表面绝缘层构成，所述金属颗粒是 位于金属颗粒的表面上，主要含有玻璃材料; 并用能量射线照射压制成型层，并在照射区域形成电布线。

公开(公告)号：US20140167330A1

公开(公告)日：2014-06-19

申请号：US14105535

申请日：2013-12-13

Applicant: Plastic Components and Modules Automotive S.p.A

Inventor： Enrico Parola ,  Pasquale Iacobone ,  Etienne Valentin

IPC: H01B1/18 ,  B29C71/04

CPC classification number: H01B1/18 ,  B29C71/04 ,  B82Y30/00 ,  C08J5/005 ,  C08J5/043 ,  C08K7/06 ,  C08K7/14 ,  H05K1/0373 ,  H05K3/105 ,  H05K2201/0112 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2201/09118 ,  H05K2203/107 ,  H05K2203/1136

Abstract: A composite material for the realization of a component or a structural part, in particular for installation on-board a vehicle, adapted to integrate electrical devices and connections, includes a non-conductive polymeric matrix; a dispersed phase including at least one promoter of carbonization adapted to form carbonaceous conductive structures; and a reinforcing-fibre filler adapted to direct the distribution and orientation of the dispersed phase in the polymeric matrix.

Abstract translation: 用于实现组件或结构部件的复合材料，特别是用于车载车辆的安装，适于集成电气设备和连接件，包括非导电聚合物基体; 分散相包括至少一个适于形成碳质导电结构的碳化促进剂; 以及适于引导分散相在聚合物基质中的分布和取向的增强纤维填料。

公开(公告)号：US20100132987A1

公开(公告)日：2010-06-03

申请号：US12450045

申请日：2008-02-08

Applicant: Nikolaus Hautmann

Inventor： Nikolaus Hautmann

IPC: H05K1/09 ,  H05K3/00

CPC classification number: H05K3/105 ,  H05K1/0284 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/1059 ,  H05K2203/0121 ,  H05K2203/105 ,  H05K2203/107 ,  H05K2203/1136

Abstract: In a method for producing an electrically conductive path on a plastic component, the plastic material of the plastic component is converted into a conductive substance using an energy application that is guided along the path.

Abstract translation: 在用于在塑料部件上制造导电路径的方法中，塑料部件的塑料材料使用沿路径引导的能量应用而被转换为导电物质。

公开(公告)号：US07288287B2

公开(公告)日：2007-10-30

申请号：US10467338

申请日：2001-03-02

Applicant: Hirokazu Tanaka ,  Satoshi Hirono

Inventor： Hirokazu Tanaka ,  Satoshi Hirono

IPC: B05D3/06

CPC classification number: H05K3/4661 ,  C23C18/1608 ,  C23C18/204 ,  C23C18/30 ,  C25D5/02 ,  C25D5/56 ,  H05K3/0035 ,  H05K3/188 ,  H05K2201/0209 ,  H05K2201/0323 ,  H05K2203/0759 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The insulating layer formation step of forming an insulating layer 24-1 on a base for resin application 20 by applying polymeric material, which has been diluted with a solvent, filled with inorganic filler to the base for resin application and by drying the base for resin application; the circuit formation portion forming step of creating a circuit formation portion and a via hole 25 in insulating layer 24-1 that has been formed in the above described insulating layer formation step by means of a laser treatment; and the circuit formation step of forming a circuit 23-1 by plating the circuit formation portion and via hole 25 that have been created in the above described circuit formation portion forming step are provided and the insulating layer formation step, the circuit formation portion forming step and the circuit formation step are repeated a plurality of times in this order and, thereby, a circuit formation part (multi-layered substrate) is manufactured. Accordingly, a multi-layered circuit, even of more than three layers, having an arbitrary circuit formation can easily be manufactured at a low cost.

Abstract translation: 绝缘层形成步骤，通过将已经用溶剂稀释的填充有无机填料的聚合物材料涂覆在树脂涂覆用基材上，并通过干燥树脂基材而在树脂涂布用基材20上形成绝缘层24-1 应用; 电路形成部分形成步骤，通过激光处理在上述绝缘层形成步骤中形成绝缘层24-1中的电路形成部分和通孔25; 并且设置通过电镀在上述电路形成部分形成步骤中产生的电路形成部分和通孔25形成电路23-1的电路形成步骤，并且绝缘层形成步骤，电路形成部分形成步骤 并且电路形成步骤依次重复多次，从而制造电路形成部分（多层基板）。 因此，可以容易地以低成本制造具有任意电路形成的多层三层以上的多层电路。

公开(公告)号：US20070113305A1

公开(公告)日：2007-05-17

申请号：US10555632

申请日：2004-05-04

Applicant: Michael Bauer ,  Thomas Bemmerl ,  Markus Flink ,  Edward Fuergut ,  Horst Groeninger ,  Hermann Vilsmeier

Inventor： Michael Bauer ,  Thomas Bemmerl ,  Markus Flink ,  Edward Fuergut ,  Horst Groeninger ,  Hermann Vilsmeier

IPC: H02B7/06

CPC classification number: H01L25/50 ,  H01L23/49883 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0652 ,  H01L2224/24011 ,  H01L2224/82103 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/105 ,  H05K2201/0257 ,  H05K2201/0323 ,  H05K2203/0285 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1136 ,  Y10S977/773

Abstract: An electrical device having carbonized conductors and a method and a device for the production thereof is disclosed. The electrical device has electrical components having connections. Furthermore, there are situated between the electrical components regions made of plastic with conductors having carbonized plastic and/or agglomerated nanoparticles. The conductors are connected to the connections of the components and/or to external connections of the electronic device.

Abstract translation: 公开了一种具有碳化导体的电气装置及其制造方法和装置。 电气设备具有具有连接的电气部件。 此外，位于由塑料制成的电气部件区域之间，导体具有碳化塑料和/或附聚纳米颗粒。 导体连接到组件的连接和/或电子设备的外部连接。

公开(公告)号：US07158383B2

公开(公告)日：2007-01-02

申请号：US10716143

申请日：2003-11-18

Applicant: Kevin M. Durocher ,  Richard J. Saia ,  Vikram B. Krishnamurthy

Inventor： Kevin M. Durocher ,  Richard J. Saia ,  Vikram B. Krishnamurthy

IPC: H05K1/16

CPC classification number: H01C17/12 ,  B29C59/14 ,  H01C7/006 ,  H05K1/0346 ,  H05K1/167 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/095 ,  H05K2203/1136

Abstract: A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is disposed over the activated portion of the substrate, thereby resulting in the formation of a highly resistive metal-carbide region. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal carbide region. The metal-carbide region is patterned to form a resistor between the terminals. Alternatively, only a selected area of the polyimide substrate is activated. The selected area forms the area in which the metal-carbide region is formed. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal-carbide region.

Abstract translation: 一种在柔性基板上制造电阻器的技术。 具体地，通过暴露于离子溅射蚀刻技术来活化聚酰亚胺基底的至少一部分。 金属层设置在基板的激活部分上，从而形成高电阻金属碳化物区域。 互连层设置在金属碳化物区域上并被图案化以在金属碳化物区域的相对端形成端子。 将金属碳化物区域图案化以在端子之间形成电阻器。 或者，仅激活聚酰亚胺基板的选定区域。 所选择的区域形成形成金属碳化物区域的区域。 互连层设置在金属碳化物区域上并被图案化以在金属碳化物区域的相对端形成端子。

公开(公告)号：US20040114336A1

公开(公告)日：2004-06-17

申请号：US10716143

申请日：2003-11-18

Inventor： Kevin M. Durocher ,  Richard J. Saia ,  Vikram B. Krishnamurthy

IPC: H05K001/16 ,  H05K007/06

CPC classification number: H01C17/12 ,  B29C59/14 ,  H01C7/006 ,  H05K1/0346 ,  H05K1/167 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0154 ,  H05K2201/0317 ,  H05K2203/095 ,  H05K2203/1136

Abstract: A technique for fabricating a resistor on a flexible substrate. Specifically, at least a portion of a polyimide substrate is activated by exposure to a ion sputter etch techniques. A metal layer is disposed over the activated portion of the substrate, thereby resulting in the formation of a highly resistive metal-carbide region. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal carbide region. The metal-carbide region is patterned to form a resistor between the terminals. Alternatively, only a selected area of the polyimide substrate is activated. The selected area forms the area in which the metal-carbide region is formed. Interconnect layers are disposed over the metal-carbide region and patterned to form terminals at opposite ends of the metal-carbide region.