公开(公告)号：US20080296748A1

公开(公告)日：2008-12-04

申请号：US11809214

申请日：2007-05-30

Applicant: Belgacem Haba ,  Richard Dewitt Crisp ,  Masud Beroz

Inventor： Belgacem Haba ,  Richard Dewitt Crisp ,  Masud Beroz

IPC: H01L23/48 ,  H01L23/02

CPC classification number: H01L25/0657 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/1903 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A microelectronic unit has a structure including a microelectronic element such as a semiconductor chip with a first contact disposed remote from the periphery of the structure. The unit further includes first and second redistribution conductive pads disposed near a periphery of the structure and a conductive path incorporating first and second conductors extending toward the first contact, these conductors being connected to one another adjacent the first contact. The conductive path is connected to the first contact, and can provide signal routing from the periphery of the unit to the contact without the need for long stubs. A package may include a plurality of such units, which may be stacked on one another with the redistribution conductive pads of the various units connected to one another.

Abstract translation: 微电子单元具有包括诸如半导体芯片的微电子元件的结构，其具有远离结构的周边设置的第一触点。 该单元还包括设置在结构的周边附近的第一和第二再分布导电焊盘以及包括朝向第一触点延伸的第一和第二导体的导电路径，这些导体彼此相邻地邻近第一接触。 导电路径连接到第一触点，并且可以提供从单元的外围到触点的信号路由，而不需要长存根。 封装可以包括多个这样的单元，其可以彼此堆叠，并且各个单元的再分配导电焊盘彼此连接。

公开(公告)号：US20080185705A1

公开(公告)日：2008-08-07

申请号：US11895191

申请日：2007-08-23

Applicant: Philip R. Osborn ,  Belgacem Haba ,  Ellis Chau ,  Giles Humpston ,  Masud Beroz ,  Teck-Gyu Kang ,  Dat Nghe Duong ,  Jae M. Park ,  Jesse Burl Thompson ,  Richard Dewitt Crisp

Inventor： Philip R. Osborn ,  Belgacem Haba ,  Ellis Chau ,  Giles Humpston ,  Masud Beroz ,  Teck-Gyu Kang ,  Dat Nghe Duong ,  Jae M. Park ,  Jesse Burl Thompson ,  Richard Dewitt Crisp

IPC: H01L23/48

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/16 ,  H01L24/31 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13169 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/83194 ,  H01L2224/83365 ,  H01L2224/83385 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A microelectronic package includes a microelectronic element having a first face including contacts, and a flexible substrate having a first surface and a second surface, conductive posts projecting from the first surface and conductive terminals accessible at the second surface, at least some of the conductive terminals and the conductive posts being electrically interconnected and at least some of the conductive terminals being offset from the conductive posts. The first surface of the flexible substrate is juxtaposed with the first face of the microelectronic element so that the conductive posts project from the flexible substrate toward the first face of the microelectronic element. The conductive posts are electrically interconnected with the contacts of the microelectronic element and at least some of the conductive terminals are movable relative to the microelectronic element.

Abstract translation: 微电子封装包括具有包括触点的第一面的微电子元件和具有第一表面和第二表面的柔性基板，从第一表面突出的导电柱和在第二表面可接触的导电端子，至少一些导电端子 并且所述导电柱电互连，并且所述导电端子中的至少一些偏离所述导电柱。 柔性基板的第一表面与微电子元件的第一面并置，使得导电柱从柔性基板朝向微电子元件的第一面突出。 导电柱与微电子元件的触点电互连，并且至少一些导电端子可相对于微电子元件移动。

公开(公告)号：US07288433B2

公开(公告)日：2007-10-30

申请号：US11156812

申请日：2005-06-20

Applicant: Belgacem Haba ,  Masud Beroz

Inventor： Belgacem Haba ,  Masud Beroz

IPC: H01L21/44

CPC classification number: H01L23/5387 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2224/0401

Abstract: A stacked microelectronic assembly comprises a flexible sheet having an obverse surface and a reverse surface and including at least a first panel and a second panel. The second panel and the first panel are adjacent to each other, the second panel including terminals on the reverse surface for mounting to an external circuit. The first panel includes a non-overmolded microelectronic element mounted thereon. The microelectronic element having a rear face and a front face surface, wherein the front face surface confronts the obverse surface of the first panel. During manufacture the flexible sheet is folded to create a stacked microelectronic assembly such that the rear face of the first microelectronic assembly confronts and substantially contacts the obverse surface of the second panel. This results in the second panel being kept substantially flat during subsequent mounting to the external circuit.

Abstract translation: 堆叠的微电子组件包括具有正面和反面并且至少包括第一面板和第二面板的柔性片。 第二面板和第一面板彼此相邻，第二面板包括用于安装到外部电路的反面上的端子。 第一面板包括安装在其上的非包覆成型的微电子元件。 微电子元件具有后表面和前表面，其中前表面面对第一面板的正面。 在制造期间，将柔性片材折叠以产生堆叠的微电子组件，使得第一微电子组件的后表面面对并基本上接触第二面板的正面。 这导致在后续安装到外部电路期间第二面板保持基本平坦。

公开(公告)号：US07268426B2

公开(公告)日：2007-09-11

申请号：US10783314

申请日：2004-02-20

Applicant: Michael Warner ,  Lee Smith ,  Belgacem Haba ,  Glenn Urbish ,  Masud Beroz ,  Teck-Gyu Kang

Inventor： Michael Warner ,  Lee Smith ,  Belgacem Haba ,  Glenn Urbish ,  Masud Beroz ,  Teck-Gyu Kang

IPC: H01L23/10 ,  H01L23/34

CPC classification number: G06F21/10 ,  G06F2221/2129 ,  H01F17/0033 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49861 ,  H01L23/5387 ,  H01L23/552 ,  H01L23/645 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6611 ,  H01L2224/05569 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45099 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/85207 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/19011 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03H9/0542 ,  H03H9/0547 ,  H03H9/1064 ,  H03H2009/0019 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit panel so as to provide enhanced thermal conductivity to the circuit panel and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier.

Abstract translation: 封装的半导体芯片包括诸如具有大导热体的芯片载体的特征，其可以焊接到电路板上，以便为电路板提供增强的导热性和电磁屏蔽，以及导电外壳，其部分地或完全地围绕 封装芯片提供额外的散热和屏蔽。 封装单元可以包括有源半导体芯片和无源元件，期望地包括芯片形式，其包括电阻器和电容器。 电感器可以全部或部分地设置在芯片载体上。

公开(公告)号：US20070205496A1

公开(公告)日：2007-09-06

申请号：US11799771

申请日：2007-05-03

Applicant: Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John Riley ,  Ilyas Mohammed

Inventor： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John Riley ,  Ilyas Mohammed

IPC: H01L23/02

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, the microelectronic element having an outer perimeter, and a substrate overlying and spaced from a first face of the microelectronic element, whereby an outer region of the substrate extends beyond the outer perimeter of the microelectronic element. The microelectronic package includes a plurality of etched conductive posts exposed at a surface of the substrate and being electrically interconnected with the microelectronic element, whereby at least one of the etched conductive posts is disposed in the outer region of the substrate. The package includes an encapsulating mold material in contact with the microelectronic element and overlying the outer region of the substrate, the encapsulating mold material extending outside of the etched conductive posts for defining an outermost edge of the microelectronic package.

Abstract translation: 微电子封装包括具有面和触点的微电子元件，微电子元件具有外周边，以及覆盖并与微电子元件的第一面间隔开的衬底，由此衬底的外部区域延伸超过微电子器件的外周边 元件。 微电子封装包括多个蚀刻的导电柱，暴露在衬底的表面并与微电子元件电互连，由此至少一个蚀刻的导电柱设置在衬底的外部区域中。 封装包括与微电子元件接触并覆盖衬底的外部区域的封装模具材料，该封装模具材料延伸到蚀刻的导电柱的外部，用于限定微电子封装的最外边缘。

公开(公告)号：US20060138640A1

公开(公告)日：2006-06-29

申请号：US11025401

申请日：2004-12-29

Applicant: Masud Beroz ,  Belgacem Haba

Inventor： Masud Beroz ,  Belgacem Haba

IPC: H05K1/11 ,  H01L21/4763 ,  H01L23/12

CPC classification number: H01L23/49833 ,  H01L23/4985 ,  H01L2224/48227 ,  H01L2224/49109 ,  H05K1/112 ,  H05K3/4611 ,  H05K2201/09472

Abstract: A substrate is provided having a plurality of sheets. Each sheet has a first major surface containing a plurality of electrically conductive regions and a second major surface that opposes the first major surface. The sheets are arranged such that the first major surface of a sheet faces the second major surface of another. At least one electrically conductive region of each sheet is partially or fully exposed. At least one electrically conductive region of a sheet is partially or fully covered, e.g., by one or more electrically conductive regions of another sheet. A method for forming such a substrate is also provided.

Abstract translation: 提供具有多个片材的基片。 每个片材具有包含多个导电区域的第一主表面和与第一主表面相对的第二主表面。 片材布置成使得片材的第一主表面面对另一片材的第二主表面。 每个片材的至少一个导电区域部分或全部暴露。 片材的至少一个导电区域被部分或完全覆盖，例如由另一片材的一个或多个导电区域覆盖。 还提供了一种用于形成这种基板的方法。

公开(公告)号：US20050285246A1

公开(公告)日：2005-12-29

申请号：US11140312

申请日：2005-05-27

Applicant: Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John Riley ,  Ilyas Mohammed

Inventor： Belgacem Haba ,  Masud Beroz ,  Teck-Gyu Kang ,  Yoichi Kubota ,  Sridhar Krishnan ,  John Riley ,  Ilyas Mohammed

IPC: H01L23/02 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package includes a microelectronic element having faces, contacts and an outer perimeter, and a flexible substrate overlying and spaced from a first face of the microelectronic element, an outer region of the flexible substrate extending beyond the outer perimeter of the microelectronic element. The package includes a plurality of conductive posts exposed at a surface of the flexible substrate and being electrically interconnected with the microelectronic element, wherein at least one of the conductive posts is disposed in the outer region of the flexible substrate, and a compliant layer disposed between the first face of the microelectronic element and the flexible substrate, wherein the compliant layer overlies the at least one of the conductive posts that is disposed in the outer region of the flexible substrate. The package includes a support element in contact with the microelectronic element and the compliant layer, whereby the support element overlies the outer region of the flexible substrate.

Abstract translation: 微电子封装包括具有面，触点和外周边的微电子元件，以及覆盖并与微电子元件的第一面间隔开的柔性基板，柔性基板的外部区域延伸超出微电子元件的外周边。 所述封装包括暴露在所述柔性基板的表面处并与所述微电子元件电互连的多个导电柱，其中至少一个所述导电柱设置在所述柔性基板的外部区域中，并且柔性层设置在所述柔性基板之间 微电子元件和柔性基板的第一面，其中柔性层覆盖设置在柔性基板的外部区域中的至少一个导电柱。 该封装包括与微电子元件和柔性层接触的支撑元件，由此支撑元件覆盖在柔性基板的外部区域上。

公开(公告)号：US06651321B2

公开(公告)日：2003-11-25

申请号：US09523513

申请日：2000-03-10

Applicant: Masud Beroz ,  Belgacem Haba ,  Klaus-Jurgen Wolter

Inventor： Masud Beroz ,  Belgacem Haba ,  Klaus-Jurgen Wolter

IPC: H05K334

CPC classification number: H01L24/75 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/11 ,  H01L24/12 ,  H01L24/14 ,  H01L24/16 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81209 ,  H01L2224/81801 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49169 ,  Y10T29/49224 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A Microelectronic Bonding processes wherein a microelectronic element is connected with a connection component having a polymeric body, and a bonding material is provided between contacts on the microelectronic element and conductive features of the connection component. The microelectronic element is heated so as to activate the bonding material, and then cooled, leaving said contacts on said microelectronic element bonded to said conductive features on the connection component. The connection component is maintained at an average temperature below the glass transition temperature of the polymer in the connection component during the heating and cooling steps.

Abstract translation: 一种微电子接合方法，其中微电子元件与具有聚合物主体的连接部件连接，并且在微电子元件上的触点和连接部件的导电特征之间提供接合材料。 加热微电子元件以激活接合材料，然后冷却，使所述微电子元件上的接触物接合到连接部件上的导电特征上。 在加热和冷却步骤期间，连接部件保持在连接部件中聚合物的玻璃化转变温度以下的平均温度。

公开(公告)号：US06384475B1

公开(公告)日：2002-05-07

申请号：US09535620

申请日：2000-03-27

Applicant: Masud Beroz ,  Belgacem Haba ,  Christopher M. Pickett

Inventor： Masud Beroz ,  Belgacem Haba ,  Christopher M. Pickett

IPC: H01L2348

CPC classification number: H01L23/49827 ,  H01L21/4846 ,  H01L21/563 ,  H01L2224/73203 ,  H01L2924/01079

Abstract: A component for making microelectronic units includes a grid of interspersed leads with ends of the various leads being connected to one another by frangible elements. One end of each lead is bonded to a top element and the other end of each lead is bonded to a bottom element. The top and bottom elements are moved away from one another, thereby breaking the frangible elements and deforming the leads towards a vertically extensive disposition. A flowable composition such as dielectric material may be injected around the leads during or after the moving step. The resulting unit may be used to form permanent or temporary connections between microelectronic elements.

Abstract translation: 用于制造微电子单元的部件包括散布引线的网格，各个引线的端部通过易碎元件彼此连接。 每个引线的一端结合到顶部元件，并且每个引线的另一端结合到底部元件。 顶部和底部元件彼此远离，从而破坏易碎元件并使引线变形成垂直方向的布置。 可移动组合物如介电材料可以在移动步骤期间或之后在引线周围注入。 所得到的单元可用于在微电子元件之间形成永久或临时连接。

公开(公告)号：US06334942B1

公开(公告)日：2002-01-01

申请号：US09247156

申请日：1999-02-09

Applicant: Belgacem Haba ,  Irina Poukhova ,  Masud Beroz

Inventor： Belgacem Haba ,  Irina Poukhova ,  Masud Beroz

IPC: C25D502

CPC classification number: H01L21/4828 ,  C25D7/12 ,  H05K3/062 ,  H05K3/108 ,  H05K3/4092 ,  H05K2203/0597 ,  H05K2203/095 ,  H05K2203/105 ,  H05K2203/1184

Abstract: A metal is provided on a polymeric component and the component is subjected to a removal process such as plasma or liquid etching in the presence of an electric field. The etchant selectively attacks the polymer at the boundary between the metal and the polymer, thereby forming gaps alongside the metal. A cover metal may be plated onto the metal in the gaps. The cover metal protects the principal metal during subsequent etching procedures.