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    Multilayer printed circuit board for ceramic chip carriers
    31.
    发明授权
    Multilayer printed circuit board for ceramic chip carriers 失效
    陶瓷芯片载体多层印刷电路板

    公开(公告)号：US4814945A

    公开(公告)日：1989-03-21

    申请号：US98260

    申请日：1987-09-18

    Applicant: Joseph D. Leibowitz

    Inventor： Joseph D. Leibowitz

    IPC: H05K1/03 ,  H05K3/46

    CPC classification number: H05K1/0366 ,  H05K3/4626 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/2905

    Abstract: A multilayer printed circuit board in which multiple layers of a composite material, fabricated by the lay-up of an aramid fiber tape, are employed to provide a circuit board with a desired coefficient of thermal expansion. Tape lay-up of aramid fibers provides a composite layer having a lower thermal coefficient of expansion than a composite layer fabricated from woven aramid fibers. Degradation in the tensile modulus of elasticity caused by the over and under characteristics of woven fabrics is also eliminated by tape lay-up, thus providing a circuit board with better mechanical strength. In addition, tape lay-up reduces the amount of resin required to fabricate the circuit board and eliminates the need for twisting the aramid fibers into yarns and then weaving the yarns, thus reducing the cost of the circuit board.

    FOLDABLE DISPLAY
    36.
    发明申请
    FOLDABLE DISPLAY 有权
    可折叠显示

    公开(公告)号：US20150029652A1

    公开(公告)日：2015-01-29

    申请号：US14160412

    申请日：2014-01-21

    Applicant: Samsung Display Co., Ltd.

    Inventor： Gui-Nam Min ,  Kyu Young Kim ,  Kyu-Taek Lee ,  Jongin Lee ,  Kyung Woo Han ,  Soyeon Han

    IPC: G06F1/16 ,  H05K1/02

    CPC classification number: G06F1/1652 ,  B32B2457/202 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/038 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/051 ,  H05K2201/055

    Abstract: A foldable display is disclosed. In one aspect, the foldable display includes a base substrate including a flexible area and a rigid area disposed at one or more sides of the flexible area. The foldable display also includes an image display device provided on the base substrate. The base substrate includes a matrix and a textile implanted in the matrix. The textile includes a flexible part corresponding to the flexible area and a rigid part corresponding to the rigid area. The rigid part is weaved differently from the flexible part.

    Abstract translation: 公开了可折叠显示器。 一方面，可折叠显示器包括基底基板，其包括柔性区域和布置在柔性区域的一侧或多侧的刚性区域。 可折叠显示器还包括设置在基底基板上的图像显示装置。 基底包括基体和植入基质中的织物。 纺织品包括对应于柔性区域的柔性部件和对应于刚性区域的刚性部件。 刚性部分与柔性部分不同。

    MULTILAYER-WIRED SUBSTRATE
    37.
    发明申请
    MULTILAYER-WIRED SUBSTRATE 有权
    多层有线基板

    公开(公告)号：US20100051327A1

    公开(公告)日：2010-03-04

    申请号：US12514365

    申请日：2007-10-09

    Applicant: Toshinobu Ogatsu

    Inventor： Toshinobu Ogatsu

    IPC: H05K1/03

    CPC classification number: H05K3/4688 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/4635 ,  H05K3/4691 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0296 ,  H05K2201/09018 ,  H05K2203/302 ,  Y10T428/24917 ,  Y10T442/3065 ,  Y10T442/3195 ,  Y10T442/3236

    Abstract: Provided is a multilayer-wired substrate for mobile electric equipment, wherein the multilayer-wired substrate is very strong, includes a larger elastically deformable region and a higher elasticity than those of the conventional structure, and can be curved. The multilayer-wired substrate is a multilayer-wired substrate including one or more insulating layers. At least one insulating layer of the substrate is made of a material in which the mechanical characteristic in an in-plane direction component exhibits anisotropy.

    Abstract translation: 本发明提供一种移动电子设备用多层布线基板，其中多层布线基板非常坚固，包括比常规结构更大的弹性变形区域和更高的弹性，并且可以是弯曲的。 多层布线基板是包括一个或多个绝缘层的多层布线基板。 衬底的至少一个绝缘层由其中面内方向分量的机械特性表现出各向异性的材料制成。

    Selective PCB stiffening with preferentially oriented fibers
    39.
    发明授权
    Selective PCB stiffening with preferentially oriented fibers 有权

    公开(公告)号：US06682802B2

    公开(公告)日：2004-01-27

    申请号：US09737213

    申请日：2000-12-14

    Applicant: George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

    Inventor： George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

    IPC: B32B512

    CPC classification number: B29C70/083 ,  B32B5/12 ,  B32B27/04 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24091 ,  Y10T428/24099 ,  Y10T428/24116 ,  Y10T428/24124

    Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.

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