公开(公告)号：US20140354379A1

公开(公告)日：2014-12-04

申请号：US13904277

申请日：2013-05-29

申请人： Donnie S. Coleman ,  Michael H. Harris ,  Terry A. Willemin

发明人： Donnie S. Coleman ,  Michael H. Harris ,  Terry A. Willemin

IPC分类号： H01P1/06

CPC分类号： H01R39/10 ,  H01R13/533 ,  H01R39/64 ,  H01R2107/00 ,  H02K9/22 ,  H02K9/28 ,  H05K1/0212 ,  H05K2201/09027

摘要： An improved slip-ring has a stator and a rotor, and includes a brush having a proximal end mounted on one of the stator and rotor and having a distal end engaging the other of the stator and rotor. The brush is adapted to convey electrical signals across the interface between the stator and rotor. The improvement includes: the rotor including a support member (1); and a track provided on the other of the stator and rotor, the track being arranged for sliding contact with the brush distal end; and a thermal element (3 or 6) arranged within the support member for selectively affecting the temperature of the rotor; whereby the temperature operating range of the slip-ring may be increased.

摘要翻译： 改进的滑环具有定子和转子，并且包括具有安装在定子和转子中的一个上并且具有与定子和转子中的另一个接合的远端的近端的刷子。 电刷适于在定子和转子之间的界面上传送电信号。 改进包括：转子包括支撑构件（1）; 以及设置在所述定子和转子的另一个上的轨道，所述轨道布置成与所述电刷远端滑动接触; 以及布置在所述支撑构件内的用于选择性地影响所述转子的温度的热元件（3或6） 从而可以增加滑环的温度操作范围。

公开(公告)号：US20140290986A1

公开(公告)日：2014-10-02

申请号：US14232510

申请日：2012-07-12

申请人： Eun Jin Kim ,  Hae Yeon Kim ,  Sung Bae Moon ,  Jae Man Park ,  Jeung Ook Park ,  Hyun Gyu Park ,  Jong Heum Yoon ,  In Hee Cho ,  Jin Hwan Kim ,  Thanh Kieu Giang

发明人： Eun Jin Kim ,  Hae Yeon Kim ,  Sung Bae Moon ,  Jae Man Park ,  Jeung Ook Park ,  Hyun Gyu Park ,  Jong Heum Yoon ,  In Hee Cho ,  Jin Hwan Kim ,  Thanh Kieu Giang

IPC分类号： H05K1/03 ,  H05K1/05

CPC分类号： H05K1/0373 ,  C08K3/013 ,  C08L63/00 ,  H05K1/0212 ,  H05K1/0346 ,  H05K1/056

摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.

公开(公告)号：US20140078684A1

公开(公告)日：2014-03-20

申请号：US14078622

申请日：2013-11-13

申请人： MITSUBISHI MATERIALS CORPORATION

发明人： Yoshirou Kuromitsu ,  Kazuhiro Akiyama ,  Takeshi Kitahara ,  Hiroshi Tonomura

IPC分类号： H05K1/05 ,  H05K7/06

CPC分类号： H05K1/053 ,  H01L23/3735 ,  H01L2224/32225 ,  H05K1/021 ,  H05K1/0212 ,  H05K1/18 ,  H05K1/181 ,  H05K7/06 ,  Y10T29/49124 ,  Y10T428/12576

摘要： A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate.

公开(公告)号：US20130235531A1

公开(公告)日：2013-09-12

申请号：US13792467

申请日：2013-03-11

申请人： YAZAKI CORPORATION

发明人： Takafumi Toda ,  Takeyuki Hamaguchi

IPC分类号： H05K1/02 ,  H05K13/04

CPC分类号： H05K3/20 ,  H05K1/0203 ,  H05K1/0209 ,  H05K1/0212 ,  H05K1/0263 ,  H05K3/0044 ,  H05K3/202 ,  H05K13/04 ,  H05K2201/09781 ,  H05K2201/10272 ,  H05K2203/0228 ,  Y10T29/4913

摘要： An electronic component board is made by attaching bus bars to an insulating plate, and by electrically connecting electronic components to the bus bars. In the electronic component board, heat radiating portions integrally formed with specific bus bars are provided along an outer periphery of the insulating plate. A width of a portion extended parallel to the outer periphery of the insulating plate of the heat radiating portion is constant. The electronic component board 1 is produced by die-cutting a metal plate in a lump into the bus bars and a band-shaped connecting portion connected to the bus bars, having a constant width, and positioned at an outer edge of the metal plate, by attaching the bus bars to the insulating board, and by cutting and removing the connecting portion while leaving a part of the connecting portion uncut which is used as the heat radiating portion.

摘要翻译： 通过将母线连接到绝缘板，并且通过将电子部件电连接到母线来制造电子部件板。 在电子部件板中，沿着绝缘板的外周设置与特定母线一体形成的散热部。 平行于散热部分的绝缘板的外周延伸的部分的宽度是恒定的。 电子部件板1通过将金属板块模压成母线而形成，并且连接到母线的带状连接部分具有恒定的宽度并且位于金属板的外边缘处， 通过将母线安装到绝缘板上，并且通过切割和移除连接部分，同时留下用作热辐射部分的未切割的连接部分的一部分。

公开(公告)号：US20130180973A1

公开(公告)日：2013-07-18

申请号：US13482702

申请日：2012-05-29

申请人： Gil White

发明人： Gil White

IPC分类号： H05B3/02

CPC分类号： H05K1/0212 ,  H05B3/28 ,  H05B2203/004 ,  H05B2203/006 ,  H05K1/167 ,  H05K7/20 ,  H05K2203/06 ,  H05K2203/1115

摘要： Aspects of the present invention are directed to providing a printed circuit board including a top conductive layer; a bottom conductive layer; a plurality of electronic components arranged on at least one of the top conductive layer or the bottom conductive layer; a heater layer interposed between the top conductive layer and the bottom conductive layer and configured to generate and transfer heat to at least one of the electronic components.

摘要翻译： 本发明的方面涉及提供一种包括顶部导电层的印刷电路板; 底部导电层; 布置在顶部导电层或底部导电层中的至少一个上的多个电子部件; 插入在所述顶部导电层和所述底部导电层之间并且被配置为产生热量并将热量传递到所述电子部件中的至少一个的加热器层。

公开(公告)号：US08481897B2

公开(公告)日：2013-07-09

申请号：US11814393

申请日：2006-01-24

申请人： Markus Wöelfel

发明人： Markus Wöelfel

IPC分类号： H05B3/16 ,  H05B3/22 ,  H05K1/00 ,  H05K1/18

CPC分类号： H05B3/26 ,  H05B3/28 ,  H05B2203/003 ,  H05B2203/014 ,  H05B2203/017 ,  H05K1/0212 ,  H05K2201/10287 ,  H05K2203/1115

摘要： A printed circuit board or card (1) has an electric circuit (1a) and at least one electrically insulated conductive heating wire (2), the heating wire (2) being wire-printed on or in the printed circuit board or card. Heating wire (2) can be connected at connection points (4) to a voltage source (not shown) to be provided on or in the printed circuit board or card (1).

摘要翻译： 印刷电路板或卡（1）具有电路（1a）和至少一个电绝缘导电加热丝（2），所述加热线（2）被丝网印刷在印刷电路板或卡上。 加热线（2）可以在连接点（4）处连接到要设置在印刷电路板或卡（1）上或印刷电路板或卡（1）上的电压源（未示出）。

公开(公告)号：US20120275128A1

公开(公告)日：2012-11-01

申请号：US13420131

申请日：2012-03-14

申请人： Katsumi TAKADA ,  Kiyokazu MORIIZUMI ,  Masayuki ITOH

发明人： Katsumi TAKADA ,  Kiyokazu MORIIZUMI ,  Masayuki ITOH

IPC分类号： H05K1/18 ,  H05K13/04

CPC分类号： H05K1/0212 ,  H01L23/345 ,  H01L23/3735 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29144 ,  H01L2224/32238 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48105 ,  H01L2224/48227 ,  H01L2224/81444 ,  H01L2224/83444 ,  H01L2924/0001 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/181 ,  H05K3/22 ,  H05K3/3494 ,  H05K2201/09263 ,  H05K2203/1115 ,  H05K2203/176 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01029 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

摘要： An electronic component includes a wiring substrate having a first surface and a second surface, an electronic component body mounted on a first surface side of the wiring substrate, an external electrode formed on a second surface side of the wiring substrate which is opposite to the first surface side, the external electrode being electrically connected to the electronic component body, a heat generating member having a conductive property and having a higher resistivity than the external electrode, and a heat insulating layer disposed between the electronic component body and the heat generating member, the heat insulating layer having an insulating property and being formed of a material different from an other material of the wiring substrate.

摘要翻译： 电子部件包括具有第一表面和第二表面的布线基板，安装在布线基板的第一表面侧上的电子部件主体，形成在布线基板的与第一表面相对的第二表面侧上的外部电极 表面侧，外部电极电连接到电子部件主体，具有导电性能并且具有比外部电极更高的电阻率的发热部件，以及设置在电子部件主体和发热部件之间的绝热层， 所述绝热层具有绝缘性，并且由与所述布线基板的其它材料不同的材料形成。

公开(公告)号：US08085105B2

公开(公告)日：2011-12-27

申请号：US12618315

申请日：2009-11-13

申请人： Kenji Kasahara

发明人： Kenji Kasahara

IPC分类号： H03L1/00

CPC分类号： H03B1/02 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H03L1/023 ,  H03L1/028 ,  H03L1/04 ,  H05K1/0201 ,  H05K1/0212 ,  H05K1/181 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2203/165 ,  H01L2224/0401

摘要： A constant-temperature type crystal oscillator includes: a crystal unit including a case main body including a first power source terminal on an outer bottom surface thereof; a surface-mounted oscillator; a temperature control circuit including a heating resistor and a temperature sensor; and a circuit substrate including a second power source terminal. One ends of the heating resistor and the temperature sensor are electrically connected to the second power source terminal. The first power source terminal of the surface-mounted oscillator and the one ends of the heating resistor and the temperature sensor are electrically connected to the second power source terminal of the circuit substrate. The first power source terminal of the surface-mounted oscillator is directly and electrically connected to, at least, the one end of the temperature sensor via an electrically-conducting path.

摘要翻译： 恒温型晶体振荡器包括：晶体单元，包括壳主体，其在其外底表面上包括第一电源端子; 表面安装的振荡器; 温度控制电路，包括加热电阻器和温度传感器; 以及包括第二电源端子的电路基板。 加热电阻器和温度传感器的一端电连接到第二电源端子。 表面安装的振荡器的第一电源端子和加热电阻器的一端和温度传感器电连接到电路基板的第二电源端子。 表面安装振荡器的第一电源端子至少通过导电路径电连接到温度传感器的一端。

公开(公告)号：US08083400B2

公开(公告)日：2011-12-27

申请号：US12286678

申请日：2008-10-01

申请人： Sergej Sosedov

发明人： Sergej Sosedov

IPC分类号： G01N25/18 ,  G01K17/08 ,  H05K7/20

CPC分类号： H05K7/1477 ,  G06F1/20 ,  G06F1/206 ,  H05K1/0203 ,  H05K1/0212 ,  H05K7/207 ,  H05K2201/10151 ,  H05K2203/163

摘要： The invention relates to an arrangement with a mounting rack and at least one assembly provided with a housing encapsulation and mounted on the mounting rack, wherein the mounting rack and the assembly have contacting means which are thermally connected to each other. Suitable measures are provided with which the quality of the heat dissipation is identified at the correct time.

摘要翻译： 本发明涉及一种具有安装架的装置和至少一个装配有壳体封装并组装在安装架上的组件，其中安装架和组件具有彼此热连接的接触装置。 提供适当的措施，在正确的时间确定散热的质量。

公开(公告)号：US08013683B2

公开(公告)日：2011-09-06

申请号：US12584192

申请日：2009-09-01

申请人： Junichi Arai

发明人： Junichi Arai

IPC分类号： H03L1/00

CPC分类号： H03L1/04 ,  H05K1/0206 ,  H05K1/0212 ,  H05K2201/09781 ,  H05K2201/10022 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2203/165

摘要： A constant-temperature type crystal oscillator includes: a crystal unit that is installed on one principal surface of a circuit substrate, and chip resistors, which function as heating elements, and which are installed on the other principal surface of the circuit substrate so as to face a principal surface of the crystal unit, the chip resistors heating up the crystal unit to keep an operational temperature of the crystal unit constant. A heating metal film facing the principal surface of the crystal unit is provided on the one principal surface of the circuit substrate. A heat conducting material is interposed between the principal surface of the crystal unit and the heating metal film to perform thermal coupling therebetween. The heating metal film is thermally coupled to electrode terminals of the chip resistors via a plurality of electrode through holes.

摘要翻译： 恒温型晶体振荡器包括：安装在电路基板的一个主表面上的晶体单元和用作加热元件的片式电阻器，并且安装在电路基板的另一个主表面上，以便 面对晶体单元的主表面，芯片电阻加热晶体单元以保持晶体单元的工作温度恒定。 在电路基板的一个主表面上设置面对晶体单元的主表面的加热金属膜。 导热材料插入在晶体单元的主表面和加热金属膜之间，以在它们之间进行热耦合。 加热金属膜通过多个电极通孔热耦合到芯片电阻器的电极端子。