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1.发明申请公开(公告)号：US20120165444A1
公开(公告)日：2012-06-28
申请号：US13271742
申请日：2011-10-12
申请人： Min Soo LEE , Im Hyuck BAE , Seon Ae LEE , Sang Hyun HONG , Chang Hong KO , Beom Jun JOO , Jin Hwan KIM , Ik Hyun YU , Thi Hai VO , Thanh Kieu GIANG , Thi Thuy Hang NGUYEN
发明人： Min Soo LEE , Im Hyuck BAE , Seon Ae LEE , Sang Hyun HONG , Chang Hong KO , Beom Jun JOO , Jin Hwan KIM , Ik Hyun YU , Thi Hai VO , Thanh Kieu GIANG , Thi Thuy Hang NGUYEN
摘要： Disclosed herein is a phosphorus compound represented by Formula 1: wherein each R is the same or different and is independently hydrogen, C1-C6 alkyl or C6-C12 aryl.
摘要翻译： 本文公开了由式1表示的磷化合物：其中每个R相同或不同，独立地为氢，C 1 -C 6烷基或C 6 -C 12芳基。
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2.发明授权Phosphorus compound, method of preparing the same and flame retardant thermoplastic resin composition including the same 有权磷化合物，其制备方法和包含其的阻燃性热塑性树脂组合物公开(公告)号：US08410203B2
公开(公告)日：2013-04-02
申请号：US13271742
申请日：2011-10-12
申请人： Min Soo Lee , Im Hyuck Bae , Seon Ae Lee , Sang Hyun Hong , Chang Hong Ko , Boem Jun Joo , Jin Hwan Kim , Ik Hyun Yu , Thi Hai Vo , Thanh Kieu Giang , Thi Thuy Hang Nguyen
发明人： Min Soo Lee , Im Hyuck Bae , Seon Ae Lee , Sang Hyun Hong , Chang Hong Ko , Boem Jun Joo , Jin Hwan Kim , Ik Hyun Yu , Thi Hai Vo , Thanh Kieu Giang , Thi Thuy Hang Nguyen
IPC分类号： C08K5/523
摘要： Disclosed herein is a phosphorus compound represented by Formula 1: wherein each R is the same or different and is independently hydrogen, C1-C6 alkyl or C6-C12 aryl.
摘要翻译： 本文公开了由式1表示的磷化合物：其中每个R相同或不同，独立地为氢，C 1 -C 6烷基或C 6 -C 12芳基。
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公开(公告)号：US20140290986A1
公开(公告)日：2014-10-02
申请号：US14232510
申请日：2012-07-12
申请人： Eun Jin Kim , Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Hyun Gyu Park , Jong Heum Yoon , In Hee Cho , Jin Hwan Kim , Thanh Kieu Giang
发明人： Eun Jin Kim , Hae Yeon Kim , Sung Bae Moon , Jae Man Park , Jeung Ook Park , Hyun Gyu Park , Jong Heum Yoon , In Hee Cho , Jin Hwan Kim , Thanh Kieu Giang
CPC分类号： H05K1/0373 , C08K3/013 , C08L63/00 , H05K1/0212 , H05K1/0346 , H05K1/056
摘要： An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board.
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