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23 条记录 (耗时 0.016 秒)

    Module sealing structure
    1.
    发明授权
    Module sealing structure 失效
    模块密封结构

    公开(公告)号：US4949219A

    公开(公告)日：1990-08-14

    申请号：US356245

    申请日：1989-05-24

    申请人： Kiyokazu Moriizumi ,  Kyoichiro Kawano ,  Kiyotaka Seyama

    发明人： Kiyokazu Moriizumi ,  Kyoichiro Kawano ,  Kiyotaka Seyama

    IPC分类号： H01L23/473 ,  H01L23/10 ,  H01L23/20 ,  H01L23/433

    CPC分类号： H01L23/10 ,  H01L23/20 ,  H01L23/4332 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/09701 ,  H01L2924/15312

    摘要： A sealed module includes a cold plate having a passage through which a cooling medium flows, a plurality of bellows structures having first ends which communicate with the passage in the cold plate to form a thermal conduction type cooling system and a plated printed circuit having a substrate and a plurality of integrated circuit elements provided on a first surface the substrate. The integrated circuit elements are in contact with ends of the bellows structures. A metal fitting secured on the cold plate has a flange disposed beneath the other surface of the substrate to present a junction between the second surface of the substrate and the flange of the metal fitting. A polyimide layer is formed on the surface of the substrate and a conductor layer is formed on the polyimide layer. The polyimide layer and the conductor layer are approximately ring shaped at least at the peripheral portions of the substrate. The flange of the metal fitting is fixed to the substrate by solder provided between the conductor layer and the flange, to thereby provide a seal between the substrate and the flange.

    Electrolytic capacitor
    3.
    发明申请
    Electrolytic capacitor 有权
    电解电容器

    公开(公告)号：US20060285275A1

    公开(公告)日：2006-12-21

    申请号：US11234161

    申请日：2005-09-26

    申请人： Masayuki Itoh ,  Kiyokazu Moriizumi ,  Takao Ishikawa ,  Tomokazu Nakashima ,  Masako Okazaki

    发明人： Masayuki Itoh ,  Kiyokazu Moriizumi ,  Takao Ishikawa ,  Tomokazu Nakashima ,  Masako Okazaki

    IPC分类号： H01G9/08

    CPC分类号： H01G2/12 ,  H01G9/08 ,  H01G9/12

    摘要： The present invention provides a low-cost electrolytic capacitor wherein the deformation of the casing due to the thermal expansion during reflowing is prevented. An electrolytic capacitor of a surface mounting type having a capacitor element that consists of a dielectric film and an electrode foil, a metal casing that holds the capacitor element, and an electrolyte solution in which the capacitor element held in the casing is immersed, wherein the casing is equipped with a gas absorbing member that absorbs the gas generated in the casing.

    摘要翻译： 本发明提供了一种低成本的电解电容器，其中防止由于回流期间的热膨胀引起的壳体的变形。 具有由电介质膜和电极箔构成的电容器元件的表面安装型电解电容器，保持电容器元件的金属壳体和浸渍在壳体内的电容器元件浸渍的电解液， 壳体配备有吸收壳体中产生的气体的气体吸收构件。

    PART INFORMATION PROVIDING SYSTEM, PART INFORMATION PROVIDING APPARATUS, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM IN WHICH PART INFORMATION PROVIDING PROGRAM IS STORED
    6.
    发明申请
    PART INFORMATION PROVIDING SYSTEM, PART INFORMATION PROVIDING APPARATUS, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM IN WHICH PART INFORMATION PROVIDING PROGRAM IS STORED 审中-公开
    零件信息提供系统，提供设备的零件信息以及提供程序的零件信息存储的非终端计算机可读介质

    公开(公告)号：US20120095884A1

    公开(公告)日：2012-04-19

    申请号：US13227767

    申请日：2011-09-08

    申请人： Misako TANABE ,  Kiyokazu Moriizumi ,  Minoru Yabumoto

    发明人： Misako TANABE ,  Kiyokazu Moriizumi ,  Minoru Yabumoto

    IPC分类号： G06Q10/00

    CPC分类号： G06Q10/087 ,  G06F16/217 ,  G06F17/50

    摘要： The part information providing system includes a part information database a retrieving section, and a notifying section. The part information database stores part information including a price of a first part and identification information of a cheaper second part, serving as a substitute for the first part, in association with identification of the first part. The retrieving section retrieves identification information of a third part, which is a component of a device, from the database and, if the identification information of the third part is associated with that of the second part, retrieves the second part, which serves as a substitute for the third part and is cheaper than the third part, from the part using the identification information of the second part by following a link of the identification information of the second part. The notifying section notifies a user of information about the second part retrieved.

    摘要翻译： 零件信息提供系统包括零件信息数据库，检索部分和通知部分。 与第一部分的识别相关联，部件信息数据库存储包括第一部分的价格和便宜的第二部分的识别信息的部分信息，作为第一部分的替代。 检索部分从数据库检索作为设备的组件的第三部分的标识信息，并且如果第三部分的识别信息与第二部分的识别信息相关联，则检索第二部分，其用作 代替第三部分，并且比通过第二部分的识别信息的链接从使用第二部分的识别信息的部分更便宜。 通知部分通知用户有关检索到的第二部分的信息。

    Method of producing double-sided circuit board
    8.
    发明授权
    Method of producing double-sided circuit board 失效
    生产双面电路板的方法

    公开(公告)号：US06526654B1

    公开(公告)日：2003-03-04

    申请号：US09606008

    申请日：2000-06-29

    申请人： Zhiyi Song ,  Kiyokazu Moriizumi ,  Kazuaki Satoh ,  Norikazu Ozaki

    发明人： Zhiyi Song ,  Kiyokazu Moriizumi ,  Kazuaki Satoh ,  Norikazu Ozaki

    IPC分类号： H05K334

    CPC分类号： H01L23/5383 ,  H01L21/481 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/0035 ,  H05K3/4605 ,  H05K2201/0154 ,  H05K2201/09436 ,  H05K2201/096 ,  H05K2201/10318 ,  H05K2203/1581 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  H01L2924/00

    摘要： The method comprises forming a plurality of wiring pattern layers on the front surface of a substrate. In the process of forming the wiring pattern layers, an insulator protection film keeps covering over the wiring pattern on the back surface of the substrate. When the formation of the wiring pattern layers has been completed on the front surface of the substrate, a penetrating hole is bored in the cured or hardened insulator protection film. The penetrating hole may be utilized as a conductive via or a conductive through hole. A wiring pattern layer is then formed over the hardened insulator protection film on the back surface of the substrate. It is possible to omit an additional process for removing the insulator protection film. The method contributes to further facilitation of production process and further reduction in production cost.

    摘要翻译： 该方法包括在基板的前表面上形成多个布线图案层。 在形成布线图案层的过程中，绝缘体保护膜保持覆盖在基板的背面上的布线图案上。 当在基板的前表面上完成布线图形层的形成时，在固化或硬化的绝缘体保护膜中钻出一个穿透孔。 穿透孔可以用作导电通孔或导电通孔。 然后在基板的背面上的硬化的绝缘体保护膜上形成布线图案层。 可以省略用于去除绝缘体保护膜的附加工艺。 该方法有助于进一步促进生产过程，进一步降低生产成本。