Invention Grant
- Patent Title: Mounted circuit substrate and method for fabricating the same for surface layer pads that can withstand pad erosion by molten solder applied over a plurality of times
- Patent Title (中): 安装电路基板及其制造方法，用于表面层焊盘，其可以承受多次施加的熔融焊料的焊盘侵蚀
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Application No.: US10784740Application Date: 2004-02-24
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Publication No.: US07005318B2Publication Date: 2006-02-28
- Inventor: Kiyokazu Moriizumi , Manabu Watanabe
- Applicant: Kiyokazu Moriizumi , Manabu Watanabe
- Applicant Address: JP Kawasaki
- Assignee: Fujistu Limited
- Current Assignee: Fujistu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2000-029927 20000208
- Main IPC: H01L21/44
- IPC: H01L21/44 ; H01L21/48 ; H01L21/50
Abstract:
A mounted circuit substrate has at least one conductive layer. The side faces of a component mounting pad is formed on a surface of the substrate, and includes at least a columnar pattern made of a metal highly resistant to erosion by solder. The side faces of the component mounting pad are completely covered with an organic insulating layer. Therefore, the component mounting pad can withstand molten solder stresses accompanying component replacement even when component replacement is done many times.
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