Invention Grant
- Patent Title: Front-and-back electrically conductive substrate
- Patent Title (中): 前后导电基板
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Application No.: US09783598Application Date: 2001-02-15
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Publication No.: US07579553B2Publication Date: 2009-08-25
- Inventor: Kiyokazu Moriizumi
- Applicant: Kiyokazu Moriizumi
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP.
- Priority: JP2000-226269 20000727
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.
Public/Granted literature
- US20020027022A1 Front-and-back electrically conductive substrate and method for manufacturing same Public/Granted day:2002-03-07
Information query
